Dual-functional porous copper films modulated via dynamic hydrogen bubble template for in situ SERS monitoring electrocatalytic reaction

2019 ◽  
Vol 494 ◽  
pp. 731-739 ◽  
Author(s):  
Hui Yang ◽  
Xin Hao ◽  
Jia Tang ◽  
Wei Jin ◽  
Changqing Liu ◽  
...  
Keyword(s):  
Copper Films ◽  
Hydrogen Bubble ◽  
Dual Functional ◽  
Porous Copper ◽  
Bubble Template ◽  
Electrocatalytic Reaction

scholarly journals 3D Porous Copper Films with Large Specific Surface Prepared by Hydrogen Bubble Template

2013 ◽  
Vol 25 (17) ◽  
pp. 9927-9930 ◽  
Author(s):  
Binbin Luo ◽  
Xueming Li ◽  
Xianli Li ◽  
Wenlin Feng
Keyword(s):  
Specific Surface ◽  
Copper Films ◽  
Hydrogen Bubble ◽  
Porous Copper ◽  
Bubble Template

Porous Copper Electroforming By Dynamic Hydrogen Bubble Template Using Continuous and Pulse Currents

2021 ◽  
Vol MA2021-02 (19) ◽  
pp. 704-704
Author(s):  
Jonathan Schoenleber ◽  
Baptiste Fedi ◽  
Marie-Pierre Gigandet ◽  
Jean-Yves Hihn
Keyword(s):  
Hydrogen Bubble ◽  
Porous Copper ◽  
Bubble Template

Superhydrophobicity of 3D Porous Copper Films Prepared Using the Hydrogen Bubble Dynamic Template

2007 ◽  
Vol 19 (23) ◽  
pp. 5758-5764 ◽  
Author(s):  
Ying Li ◽  
Wen-Zhi Jia ◽  
Yan-Yan Song ◽  
Xing-Hua Xia
Keyword(s):  
Copper Films ◽  
Hydrogen Bubble ◽  
Bubble Dynamic ◽  
Porous Copper ◽  
Dynamic Template

Dual functioning porous catalysts: Robust electro-oxidation of small organic molecules and water electrolysis at bimetallic Ni/Cu foam

2021 ◽  
Author(s):  
Mohamed R. Rizk ◽  
Muhammad G. Gamal ◽  
Amina Mazhar ◽  
Mohamed El-Deab ◽  
Bahgat El-Anadouli
Keyword(s):  
Thin Layer ◽  
Organic Molecules ◽  
Water Electrolysis ◽  
Single Step ◽  
Hydrogen Bubble ◽  
Small Organic Molecules ◽  
Porous Catalysts ◽  
Electro Oxidation ◽  
Bubble Template ◽  
Cu Foam

In this work, we report a single-step preparation of porous Ni-based foams thin layer atop Cu substrate via a facile dynamic hydrogen bubble template technique (DHBT). The prepared porous Ni-based...

Hieratical CuO clusters in-situ grown on copper films coated three-dimensional nickel foams for high-performance supercapacitors

2020 ◽  
Vol 46 (11) ◽  
pp. 17461-17468 ◽  
Author(s):  
Haibin Sun ◽  
Li'na Xu ◽  
Jiao Li ◽  
Yan'an Li ◽  
Tong Wu ◽  
...  
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Copper Films ◽  
Nickel Foams

In-Situ Tem Investigation During Thermal Cycling of thin Copper Films

1996 ◽  
Vol 436 ◽  
Author(s):  
R.-M. Keller ◽  
W. Sigle ◽  
S. P. Baker ◽  
O. Kraft ◽  
E. Arzt
Keyword(s):  
Grain Growth ◽  
Room Temperature ◽  
Dislocation Motion ◽  
In Situ Tem ◽  
Copper Films ◽  
Stress Evolution ◽  
Cu Films ◽  
Transmission Electron ◽  
Insight Into

AbstractIn-situ transmission electron microscopy (TEM) was performed to study grain growth and dislocation motion during temperature cycles of Cu films with and without a cap layer. In addition, the substrate curvature method was employed to determine the corresponding stresstemperature curves from room temperature up to 600°C. The results of the in-situ TEM investigations provide insight into the microstructural evolution which occurs during the stress measurements. Grain growth occurred continuously throughout the first heating cycle in both cases. The evolution of dislocation structure observed in TEM supports an explanation of the stress evolution in both capped and uncapped films in terms of dislocation effects.

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