Microstructure evolution and corrosion resistance of Ni–Cu–P amorphous coating during crystallization process

2019 ◽  
Vol 484 ◽  
pp. 835-844 ◽  
Author(s):  
Jie Chen ◽  
Guanlin Zhao ◽  
Kenji Matsuda ◽  
Yong Zou
Materials ◽  
2021 ◽  
Vol 14 (10) ◽  
pp. 2549
Author(s):  
Wenchao Yang ◽  
Jun Mao ◽  
Yueyuan Ma ◽  
Shuyuan Yu ◽  
Hongping He ◽  
...  

Electrochemical corrosion behavior of ternary tin-zinc-yttrium (Sn-9Zn-xY) solder alloys were investigated in aerated 3.5 wt.% NaCl solution using potentiodynamic polarization techniques, and the microstructure evolution was obtained by scanning electron microscope (SEM). Eight different compositions of Sn-9Zn-xY (x = 0, 0.02, 0.04, 0.06, 0.08, 0.10, 0.20, and 0.30 wt.%) were compared by melting. The experimental results show that when the content of Y reached 0.06 wt.%, the grain size of Zn-rich phase became the smallest and the effect of grain refinement was the best, but there was no significant effect on the melting point. With the increases of Y content, the spreading ratio first increased and then decreased. When the content of Y was 0.06 wt.%, the Sn-9Zn-0.06Y solder alloy had the best wettability on the Cu substrate, which was increased by approximately 20% compared with Sn-9Zn. Besides, the electrochemical corrosion experimental shows that the Y can improve the corrosion resistance of Sn-9Zn system in 3.5 wt.% NaCl solution, and the corrosion resistance of the alloy is better when the amount of Y added is larger within 0.02–0.30 wt.%. Overall considering all performances, the optimal performance can be obtained when the addition amount of Y is 0.06.


CORROSION ◽  
10.5006/2050 ◽  
2016 ◽  
Vol 72 (9) ◽  
pp. 1083-1094 ◽  
Author(s):  
Lianlian Wu ◽  
Yoichi Takeda ◽  
Tetsuo Shoji ◽  
Mitsuo Yamashita ◽  
Sakae Izumi

Vacuum ◽  
2018 ◽  
Vol 153 ◽  
pp. 39-42 ◽  
Author(s):  
Guokun Huang ◽  
Lidan Qu ◽  
Yunzhuo Lu ◽  
Yongzhe Wang ◽  
Hongge Li ◽  
...  

2012 ◽  
Vol 15 (2) ◽  
pp. 277-284 ◽  
Author(s):  
Lorena Braga Moura ◽  
Rodrigo Freitas Guimarães ◽  
Hamilton Ferreira Gomes de Abreu ◽  
Hélio Cordeiro de Miranda ◽  
Sérgio Souto Maior Tavares

2012 ◽  
Vol 89 ◽  
pp. 229-232 ◽  
Author(s):  
Yongjiang Huang ◽  
Yuanzhi Guo ◽  
Hongbo Fan ◽  
Jun Shen

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