Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder

2011 ◽  
Vol 257 (15) ◽  
pp. 6481-6488 ◽  
Author(s):  
Mauricio Ramirez ◽  
Lothar Henneken ◽  
Sannakaisa Virtanen
Keyword(s):  
Oxidation Kinetics ◽  
Lead Free ◽  
Copper Films ◽  
Lead Free Solder ◽  
Free Solder ◽  
Kinetics Of

scholarly journals Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls

2004 ◽  
Vol 45 (3) ◽  
pp. 754-758 ◽  
Author(s):  
Ikuo Shohji ◽  
Yuji Shiratori ◽  
Hiroshi Yoshida ◽  
Masahiko Mizukami ◽  
Akira Ichida
Keyword(s):  
Growth Kinetics ◽  
Flip Chip ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Balls ◽  
Free Solder ◽  
Kinetics Of Reaction ◽  
Kinetics Of

Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge

2007 ◽  
Vol 353-358 ◽  
pp. 2033-2036 ◽  
Author(s):  
Ikuo Shohji ◽  
Satoshi Tsunoda ◽  
Hirohiko Watanabe ◽  
Tatsuhiko Asai
Keyword(s):  
Reaction Layer ◽  
Joint Strength ◽  
Heat Exposure ◽  
Layer Growth ◽  
Lead Free ◽  
Joint Interface ◽  
Lead Free Solder ◽  
Free Solder ◽  
Kinetics Of ◽  
Soldered Joint

An influence of content of Ni and Ag in a Sn-Ag-Cu-Ni-Ge lead-free solder has been investigated on microstructure and joint strength of the soldered joint under heat exposure conditions. The growth kinetics of the reaction layer formed at the joint interface has been investigated, and the apparent activation energy of the reaction layer growth has been also examined. Moreover, the soldered joints with Sn-Ag and Sn-Ag-Cu solders were prepared and were compared with the joints with the Sn-Ag-Cu-Ni-Ge solders.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

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