Modification of the surface properties of polyimide films using polyhedral oligomeric silsesquioxane deposition and oxygen plasma exposure

2009 ◽  
Vol 255 (18) ◽  
pp. 8135-8144 ◽  
Author(s):  
Christopher J. Wohl ◽  
Marcus A. Belcher ◽  
Sayata Ghose ◽  
John W. Connell
Keyword(s):  
Surface Properties ◽  
Oxygen Plasma ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Polyimide Films ◽  
Plasma Exposure ◽  
Oligomeric Silsesquioxane ◽  
Modification Of The Surface

Synthesis, characterization and properties of telechelic hybrid biodegradable polymers containing polyhedral oligomeric silsesquioxane (POSS)

RSC Advances ◽  
2014 ◽  
Vol 4 (41) ◽  
pp. 21435-21449 ◽  
Author(s):  
M. Jesús Fernández ◽  
M. Dolores Fernández ◽  
Mónica Cobos
Keyword(s):  
Click Chemistry ◽  
Surface Properties ◽  
Biodegradable Polymers ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Oligomeric Silsesquioxane

The incorporation of POSS into PLA and PCL by click chemistry alters the thermal and surface properties of the polymers.

Synthesis, characterization and surface properties of star-shaped polymeric surfactants with polyhedral oligomeric silsesquioxane core

2017 ◽  
Vol 66 (11) ◽  
pp. 1610-1616 ◽  
Author(s):  
Ahmet Uner ◽  
Erdinc Doganci ◽  
Mehmet Atilla Tasdelen ◽  
Faruk Yilmaz ◽  
Ayşe Gül Gürek
Keyword(s):  
Surface Properties ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Polymeric Surfactants ◽  
Oligomeric Silsesquioxane

scholarly journals Preparation and Properties of Intrinsically Atomic-Oxygen Resistant Polyimide Films Containing Polyhedral Oligomeric Silsesquioxane (POSS) in the Side Chains

Polymers ◽  
2020 ◽  
Vol 12 (12) ◽  
pp. 2865 ◽  
Author(s):  
Hao Wu ◽  
Yan Zhang ◽  
Yi-Dan Guo ◽  
Hao-Ran Qi ◽  
Yuan-Cheng An ◽  
...  
Keyword(s):  
Atomic Oxygen ◽  
Linear Thermal Expansion ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Tensile Modulus ◽  
Low Earth Orbit ◽  
Molecular Structures ◽  
Polyimide Films ◽  
Passivation Layers ◽  
Pyromellitic Anhydride ◽  
Oligomeric Silsesquioxane

The relatively poor atomic-oxygen (AO) resistance of the standard polyimide (PI) films greatly limits the wide applications in low earth orbit (LEO) environments. The introduction of polyhedral oligomeric silsesquioxane (POSS) units into the molecular structures of the PI films has been proven to be an effective procedure for enhancing the AO resistance of the PI films. In the current work, a series of POSS-substituted poly (pyromellitic anhydride-4,4′-oxydianiline) (PMDA-ODA) films (POSS-PI) with different POSS contents were synthesized via a POSS-containing diamine, N-[(heptaisobutyl-POSS)propyl]-3,5-diaminobenzamide (DABA-POSS). Subsequently, the effects of the molecular structures on the thermal, tensile, optical, and especially the AO-erosion behaviors of the POSS-PI films were investigated. The incorporation of the latent POSS substituents decreased the thermal stability and the high-temperature dimensional stability of the pristine PI-0 (PMDA-ODA) film. For instance, the PI-30 film with the DABA-POSS content of 30 wt% in the film exhibited a 5% weight loss temperature (T5%) of 512 °C and a coefficient of linear thermal expansion (CTE) of 54.6 × 10−6/K in the temperature range of 50–250 °C, respectively, which were all inferior to those of the PI-0 film (T5% = 574 °C; CTE = 28.9 × 10−6/K). In addition, the tensile properties of the POSS-containing PI films were also deteriorated, to some extent, due to the incorporation of the DABA-POSS components. The tensile strength (TS) of the POSS-PI films decreased with the order of PI-0 > PI-10 > PI-15 > PI-20 > PI-25 > PI-30, and so did the tensile modulus (TM) and the elongations at break (Eb). PI-30 showed the TS, TM, and Eb values of 75.0 MPa, 1.55 GPa, and 16.1%, respectively, which were all lower than those of the PI-0 film (TS = 131.0 MPa, TM = 1.88 GPa, Eb = 73.2%). Nevertheless, the incorporation of POSS components obviously increased the AO resistance of the PI films. All of the POSS-PI films survived from the AO exposure with the total fluence of 2.16 × 1021 atoms/cm2, while PI-0 was totally eroded under the same circumstance. The PI-30 film showed an AO erosion yield (Es) of 1.1 × 10−25 cm3/atom, which was approximately 3.67% of the PI-0 film (Es = 3.0 × 10−24 cm3/atom). Inert silica or silicate passivation layers were detected on the surface of the POSS-PI films after AO exposure, which efficiently prevented the further erosion of the under-layer materials.

Structures and properties of HMPBO fibers treated by oxygen plasma/polyhedral oligomeric silsesquioxane

2013 ◽  
Vol 34 (12) ◽  
pp. 2026-2030 ◽  
Author(s):  
Hailin Li ◽  
Yusheng Tang ◽  
Junwei Gu ◽  
Jing Dang ◽  
Ting Bai ◽  
...  
Keyword(s):  
Oxygen Plasma ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Structures And Properties ◽  
Oligomeric Silsesquioxane
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