scholarly journals The simulation of micro droplet behavior of molten lead-free solder in inkjet printing process and its experimental validation

2012 ◽  
Vol 36 (7) ◽  
pp. 3067-3079 ◽  
Author(s):  
Hung-Ju Chang ◽  
Ming Hsiu Tsai ◽  
Weng-Sing Hwang
Keyword(s):  
Inkjet Printing ◽  
Experimental Validation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Printing Process ◽  
Droplet Behavior ◽  
Molten Lead ◽  
Free Solder

Study of Micro Droplet Impingement Process of Molten Lead-Free Solder by Inkjet Printing Process

2011 ◽  
Vol 409 ◽  
pp. 437-442 ◽  
Author(s):  
Cheng Han Wu ◽  
Hsiao Lan Lin ◽  
Weng Sing Hwang
Keyword(s):  
Heat Transfer ◽  
Inkjet Printing ◽  
Lead Free ◽  
Orifice Diameter ◽  
Lead Free Solder ◽  
Interfacial Heat Transfer ◽  
Droplet Impingement ◽  
Printing Process ◽  
Molten Lead ◽  
Free Solder

An investigation of molten metal droplet impingement on substrate was conducted. Micro droplets of molten lead-free solder; Sn_3.0wt%Ag_0.5wt%Cu, were ejected at 230°C by using a piezoelectric inkjet printing process. The droplets were squeezed out from nozzle with orifice diameter of 50 µm by applying a voltage pulse of bipolar waveform. In this study, micro droplets with various velocities were deposited onto flat substrate. Spread factors of solders are at the range of 1.23-1.25. With the aid of numerical simulation, interfacial heat transfer coefficients between molten solders and substrate were observed to rise with droplet impact velocity. Though analyzing the data of simulation results, the mathematical relation between interfacial heat transfer coefficient and potential and kinetic energy shows the trend of direct proportion.

scholarly journals Molten Lead-Free Solder Deposited by Inkjet Printing for Bonding of Thin-Film Solar Cell Modules

2016 ◽  
Vol 57 (6) ◽  
pp. 797-804
Author(s):  
Chien-Hsun Wang ◽  
Weng-Sing Hwang ◽  
Wen-Ming Chen ◽  
Ho-Lin Tsai ◽  
Cheng-Han Wu
Keyword(s):  
Thin Film ◽  
Solar Cell ◽  
Inkjet Printing ◽  
Thin Film Solar Cell ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cell Modules ◽  
Molten Lead ◽  
Free Solder

GS0414 Initial Corrosion Behavior of Stainless Steel in the Molten Lead-free Solder

2016 ◽  
Vol 2016.22 (0) ◽  
pp. _GS0414-1_-_GS0414-2_
Author(s):  
Kenji MIKI ◽  
Akira YAMAUCHI ◽  
Masashi KUROSE ◽  
Makoto NANKO
Keyword(s):  
Stainless Steel ◽  
Corrosion Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Molten Lead ◽  
Free Solder

20107 Observation of initial corrosion of carbon steel in molten lead-free solder

2015 ◽  
Vol 2015.21 (0) ◽  
pp. _20107-1_-_20107-2_
Author(s):  
Koudai UESUGI ◽  
Akira YAMAUCHI ◽  
Makoto NANKOU
Keyword(s):  
Carbon Steel ◽  
Lead Free ◽  
Lead Free Solder ◽  
Molten Lead ◽  
Free Solder

Stencil printing process performance on various aperture size and optimization for lead-free solder paste

2019 ◽  
Vol 102 (9-12) ◽  
pp. 3369-3379 ◽  
Author(s):  
M. S. Rusdi ◽  
M. Z. Abdullah ◽  
S. Chellvarajoo ◽  
M. S. Abdul Aziz ◽  
M. K. Abdullah ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Process Performance ◽  
Solder Paste ◽  
Aperture Size ◽  
Stencil Printing ◽  
Printing Process ◽  
Free Solder

scholarly journals Direct Printing of 1-D and 2-D Electronically Conductive Structures by Molten Lead-Free Solder

Materials ◽  
2016 ◽  
Vol 10 (1) ◽  
pp. 1 ◽  
Author(s):  
Chien-Hsun Wang ◽  
Ho-Lin Tsai ◽  
Weng-Sing Hwang
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Direct Printing ◽  
Molten Lead ◽  
Free Solder
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