Distinct fatigue cracking modes of grain boundaries with coplanar slip systems

2016 ◽  
Vol 120 ◽  
pp. 120-129 ◽  
Author(s):  
L.L. Li ◽  
Z.J. Zhang ◽  
P. Zhang ◽  
J.B. Yang ◽  
Z.F. Zhang
Keyword(s):  
Grain Boundaries ◽  
Fatigue Cracking ◽  
Slip Systems ◽  
Cracking Modes

What types of grain boundaries can be passed through by persistent slip bands?

2003 ◽  
Vol 18 (5) ◽  
pp. 1031-1034 ◽  
Author(s):  
Z. F. Zhang ◽  
Z. G. Wang ◽  
J. Eckert
Keyword(s):  
Grain Boundaries ◽  
Large Angle ◽  
Fatigue Cracking ◽  
Stress Axis ◽  
Slip Systems ◽  
Slip Bands ◽  
Persistent Slip Bands ◽  
Different Types ◽  
The Difference ◽  
Intergranular Fatigue Cracking

Three typical interactions of persistent slip bands (PSBs) with different types of grain boundaries (GBs) were investigated and analyzed in fatigued copper crystals. The results show that PSBs cannot transfer through all types of large-angle GBs, regardless of their orientation with respect to the stress axis. Secondary slip was often observed near the GBs, leading to strain incompatibility. When the slip systems of the two adjacent crystals are coplanar, the transmission of a PSB across a GB strongly depends on the slip directions of the two adjacent crystals. It was found that only the low-angle GBs can be passed through by PSBs, and accordingly they are insensitive to intergranular fatigue cracking. For a special copper bicrystal with coplanar slip systems, the ladderlike dislocation arrangements within the adjacent PSBs become discontinuous and a dislocation-affected-zone appears near the GB due to the difference in the slip direction of the two adjacent crystals. Therefore, the necessary conditions for the transmission of a PSB across a GB are that the neighboring grains have a coplanar slip system and identical slip directions.

Observation of secondary slip systems in tungsten bicrystals

1984 ◽  
Vol 42 ◽  
pp. 478-479
Author(s):  
J. R. Fekete ◽  
R. Gibala
Keyword(s):  
Stress Field ◽  
Grain Boundaries ◽  
Deformation Behavior ◽  
Stress Axis ◽  
Polycrystalline Materials ◽  
Slip Systems ◽  
Metallic Materials ◽  
Twist Boundary ◽  
Secondary Slip ◽  
Plane Normal

The deformation behavior of metallic materials is modified by the presence of grain boundaries. When polycrystalline materials are deformed, additional stresses over and above those externally imposed on the material are induced. These stresses result from the constraint of the grain boundaries on the deformation of incompatible grains. This incompatibility can be elastic or plastic in nature. One of the mechanisms by which these stresses can be relieved is the activation of secondary slip systems. Secondary slip systems have been shown to relieve elastic and plastic compatibility stresses. The deformation of tungsten bicrystals is interesting, due to the elastic isotropy of the material, which implies that the entire compatibility stress field will exist due to plastic incompatibility. The work described here shows TEM observations of the activation of secondary slip in tungsten bicrystals with a [110] twist boundary oriented with the plane normal parallel to the stress axis.

Evaluation of Plastic Work Density, Strain Energy and Slip Multiplication Intensity at Some Typical Grain Boundary Triple Junctions

2010 ◽  
Vol 654-656 ◽  
pp. 1283-1286 ◽  
Author(s):  
Tetsuya Ohashi ◽  
Michihiro Sato ◽  
Yuhki Shimazu
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Crystal Plasticity ◽  
Strain Energy ◽  
Plastic Work ◽  
Slip Systems ◽  
Triple Junctions ◽  
Plastic Slip ◽  
Boundary Triple

Plastic slip deformations of tricrystals with simplified geometries are numerically analyzed by a FEA-based crystal plasticity code. Accumulation of geometrically necessary (GN) dislocations, distributions of the total slip, plastic work density and GN dislocations on slip systems, as well as some indices for the intensity of slip multiplication are evaluated. Results show that coexistence of GN dislocations on different slip systems is prominent at triple junctions of grain boundaries.

The Slip Transfer Process Through Grain Boundaries in HCP Ti

1993 ◽  
Vol 319 ◽  
Author(s):  
J. Shirokoff ◽  
I.M. Robertson ◽  
H.K. Birnbaum
Keyword(s):  
Grain Boundary ◽  
Slip System ◽  
Grain Boundaries ◽  
Slip Systems ◽  
Boundary Dislocation ◽  
Burgers Vector ◽  
Slip Transfer ◽  
Transmission Electron ◽  
Fcc Materials

AbstractInformation on the mechanisms of slip transfer across grain boundaries in an HCP α-Ti alloy has been obtained from deformation experiments performed In situ in the transmission electron microscope. Initially, lattice dislocations are accommodated within the grain boundary until a critical local dislocation density is reached. The boundary then responds by activating slip in the adjoining grain on the slip system experiencing the highest local resolved shear stress and producing the residual grain-boundary dislocation with the smallest Burgers vector. Slip on secondary slip systems may be initiated provided they reduce the magnitude of the Burgers vector of, or eliminate, the residual grainboundary dislocation. The selection rules used to predict the slip system activated by the grain boundary are the same as apply in ordered and disordered FCC materials.

A Predictive Framework for Dislocation-Density Pile-Ups in Crystalline Systems With Coincident Site Lattice and Random Grain Boundaries

2017 ◽  
Vol 139 (2) ◽  
Author(s):  
David M. Bond ◽  
Mohammed A. Zikry
Keyword(s):  
Dislocation Density ◽  
Grain Boundaries ◽  
Coincident Site Lattice ◽  
Local Stress ◽  
Face Centered Cubic ◽  
Slip Systems ◽  
Triple Junctions ◽  
High Angle ◽  
Site Lattice ◽  
Wide Range

Evolving dislocation-density pile-ups at grain-boundaries (GBs) spanning a wide range of coincident site lattice (CSL) and random GB misorientations in face-centered cubic (fcc) bicrystals and polycrystalline aggregates has been investigated. A dislocation-density GB interaction scheme coupled to a dislocation-density-based crystalline plasticity formulation was used in a nonlinear finite element (FE) framework to understand how different GB orientations and GB-dislocation-density interactions affect local and overall behavior. An effective Burger's vector of residual dislocations was obtained for fcc bicrystals and compared with molecular dynamics (MDs) predictions of static GB energy, as well as dislocation-density transmission at GB interfaces. Dislocation-density pile-ups and accumulations of residual dislocations at GBs and triple junctions (TJs) were analyzed for a polycrystalline copper aggregate with Σ1, Σ3, Σ7, Σ13, and Σ21 CSLs and random high-angle GBs to understand and predict the effects of GB misorientation on pile-up formation and evolution. The predictions indicate that dislocation-density pile-ups occur at GBs with significantly misoriented slip systems and large residual Burger's vectors, such as Σ7, Σ13, and Σ21 CSLs and random high-angle GBs, and this resulted in heterogeneous inelastic deformations across the GB and local stress accumulations. GBs with low misorientations of slip systems had high transmission, no dislocation-density pile-ups, and lower stresses than the high-angle GBs. This investigation provides a fundamental understanding of how different representative GB orientations affect GB behavior, slip transmission, and dislocation-density pile-ups at a relevant microstructural scale.

Higher fatigue cracking resistance of twin boundaries than grain boundaries in Cu bicrystals

2011 ◽  
Vol 65 (6) ◽  
pp. 505-508 ◽  
Author(s):  
L.L. Li ◽  
Z.J. Zhang ◽  
P. Zhang ◽  
Z.F. Zhang
Keyword(s):  
Grain Boundaries ◽  
Fatigue Cracking ◽  
Cracking Resistance ◽  
Twin Boundaries

Intergranular Fatigue Cracking Enhanced by Impurity Segregation

2007 ◽  
Vol 539-543 ◽  
pp. 2137-2142 ◽  
Author(s):  
Claire Daniel ◽  
Frédéric Christien ◽  
René Le Gall
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Fatigue Cracking ◽  
Cold Drawing ◽  
High Concentration ◽  
Impurity Segregation ◽  
High Level ◽  
Scanning Electron

It was previously reported that fatigue life of some alloys can be dramatically reduced if the grain boundaries contain a high level of impurity segregation before fatigue tests. In this paper the susceptibility of single phase brass samples (90Cu10Zn) to this form of damage is studied. After cold drawing of as cast brass bars, fatigue samples were heat treated at 800°C during 30min to promote recrystallization and impurity segregation at grain boundary. The samples were then tested under high frequency bending fatigue test at 200°C. After cracking, fracture surfaces were studied using both scanning electron microscopy (SEM) and electron probe microanalysis (EPMA). The SEM micrographs showed that the fractures were mostly intergranular. Chemical composition of intergranular cracks surface were analyzed using EPMA at low accelerating voltage. A high concentration of sulfur was found on most of grain boundary facets. The internal stress in alloys after fatigue was qualitatively estimated using electron backscattering diffraction in scanning electron microscopy. A high level of local misorientation was found near most grain boundaries. The mechanism of intergranular cracks formation during fatigue is discussed taking into account both the segregation of sulfur at grain boundaries and accumulation of plastic strain at grain boundaries

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