Enhanced Thermal Conductivity and Tensile Strength of Copper Matrix Composite with Few-Layer Graphene Nanoplates

2021 ◽  
Author(s):  
Fei Long Jia ◽  
Kun Xia Wei ◽  
Wei Wei ◽  
Fu Qiang Chu ◽  
Qing Bo Du ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Tensile Strength ◽  
Matrix Composite ◽  
Copper Matrix ◽  
Layer Graphene ◽  
Copper Matrix Composite ◽  
Few Layer Graphene ◽  
Enhanced Thermal Conductivity ◽  
Graphene Nanoplates

High-yield exfoliation of graphite in acrylate polymers: A stable few-layer graphene nanofluid with enhanced thermal conductivity

Carbon ◽  
2013 ◽  
Vol 64 ◽  
pp. 288-294 ◽  
Author(s):  
Zhenyu Sun ◽  
Sascha Pöller ◽  
Xing Huang ◽  
Dmitrii Guschin ◽  
Christoph Taetz ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Yield ◽  
Layer Graphene ◽  
Acrylate Polymers ◽  
Few Layer Graphene ◽  
Enhanced Thermal Conductivity

A Study on Ti3SiC2 Reinforced Copper Matrix Composite by Warm Compaction Powder Metallurgy

2006 ◽  
Vol 532-533 ◽  
pp. 596-599 ◽  
Author(s):  
Tungwai Leo Ngai ◽  
Yuan Yuan Li ◽  
Zhao Yao Zhou
Keyword(s):  
Electrical Conductivity ◽  
Tensile Strength ◽  
Powder Metallurgy ◽  
Ultimate Tensile Strength ◽  
Matrix Composite ◽  
Copper Matrix ◽  
Warm Compaction ◽  
Copper Matrix Composite ◽  
Particulate Concentration ◽  
Particulate Reinforced

Increasing density is the best way to increase the performance of powder metallurgy materials. Conventional powder metallurgy processing can produce copper green compacts with density less than 8.3g/cm3 (a relative density of 93%). Performances of these conventionally compacted materials are substantially lower than their full density counterparts. Warm compaction, which is a simple and economical forming process to prepare high density powder metallurgy parts or materials, was employed to develop a Ti3SiC2 particulate reinforced copper matrix composite with high strength, high electrical conductivity and good tribological behaviors. Ti3SiC2 particulate reinforced copper matrix composites, with 1.25, 2.5 and 5 mass% Ti3SiC2 were prepared by compacting powder with a pressure of 700 MPa at 145°C, then sintered at 1000°C under cracked ammonia atmosphere for 60 minutes. Their density, electrical conductivity and ultimate tensile strength decrease with the increase in particulate concentration, while hardness increases with the increase in particulate concentration. A small addition of Ti3SiC2 particulate can increase the hardness of the composite without losing much of electrical conductivity. The composite containing 1.25 mass% Ti3SiC2 has an ultimate tensile strength of 158 MPa, a hardness of HB 58, and an electrical resistivity of 3.91 x 10-8 Ω.m.

Preparation and properties of copper matrix composite reinforced with SLM Fe alloy lattice

2019 ◽  
Vol 6 (5) ◽  
pp. 056530
Author(s):  
Huiyan Xu ◽  
Zhenhua Li ◽  
Baoren Teng ◽  
Bo Ren ◽  
Xin Li
Keyword(s):  
Matrix Composite ◽  
Copper Matrix ◽  
Copper Matrix Composite

Thermal Conductivity Reduction in Few-Layer Graphene

2011 ◽  
Author(s):  
Dhruv Singh ◽  
Jayathi Y. Murthy ◽  
Timothy S. Fisher
Keyword(s):  
Thermal Conductivity ◽  
Weak Coupling ◽  
Phonon Scattering ◽  
Single Layer ◽  
Acoustic Mode ◽  
Single Layer Graphene ◽  
Boltzmann Transport ◽  
Layer Graphene ◽  
Out Of Plane ◽  
Few Layer Graphene

Using the linearized Boltzmann transport equation and perturbation theory, we analyze the reduction in the intrinsic thermal conductivity of few-layer graphene sheets accounting for all possible three-phonon scattering events. Even with weak coupling between layers, a significant reduction in the thermal conductivity of the out-of-plane acoustic modes is apparent. The main effect of this weak coupling is to open many new three-phonon scattering channels that are otherwise absent in graphene. The highly restrictive selection rule that leads to a high thermal conductivity of ZA phonons in single-layer graphene is only weakly broken with the addition of multiple layers, and ZA phonons still dominate thermal conductivity. We also find that the decrease in thermal conductivity is mainly caused by decreased contributions of the higher-order overtones of the fundamental out-of-plane acoustic mode. Moreover, the extent of reduction is largest when going from single to bilayer graphene and saturates for four layers. The results compare remarkably well over the entire temperature range with measurements of of graphene and graphite.

A Study of 5%Mo-Cu Nanocomposite Prepared by SHS Route

2013 ◽  
Vol 675 ◽  
pp. 231-234
Author(s):  
Tie Ming Guo ◽  
Chang Song Han ◽  
Jian Gang Jia ◽  
Ying Fu ◽  
Zhi Hui ◽  
...  
Keyword(s):  
High Temperature ◽  
Electric Conductivity ◽  
Matrix Composite ◽  
Copper Matrix ◽  
Temperature Synthesis ◽  
Powder System ◽  
High Temperature Synthesis ◽  
Copper Matrix Composite ◽  
Microhardness Tester ◽  
Molybdenum Particles

Thermodynamic calculations indicate that molybdenum particles reinforced copper-matrix composite can be fabricated in CuO-Al-MoO3 powder system. Thermit reaction and self-propagation high-temperature synthesis (SHS) were applied to prepare samples. Then the phases, structure morphologies and properties were studied through the instruments of XRD, SEM and microhardness tester. The results show that nanocrystals are formed in Cu matrix and molybdenum particles are dispersive distributed in Cu matrix. The microhardness of 5﹪Mo-Cu nanocomposite is 110HV，and the relative electric conductivity is 58.6﹪IACS.

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