Modern Sample Preparation Methods in Chemical Analysis

2001 ◽  
Vol 136 (3-4) ◽  
pp. 199-204 ◽  
Author(s):  
Georgis Theodoridis ◽  
I. N. Papadoyannis
Keyword(s):  
Chemical Analysis ◽  
Sample Preparation ◽  
Preparation Methods ◽  
Modern Sample ◽  
Sample Preparation Methods

scholarly journals Possibilities of Utilization of Modern Sample Preparation Methods for Gas Chromatographic Analysis of Beverages and Especially beer.

2010 ◽  
Vol 56 (9) ◽  
pp. 358-366 ◽  
Author(s):  
Tomáš HORÁK ◽  
Jiří ČULÍK ◽  
Marie JURKOVÁ ◽  
Pavel ČEJKA ◽  
Vladimír KELLNER ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Chromatographic Analysis ◽  
Preparation Methods ◽  
Gas Chromatographic Analysis ◽  
Modern Sample ◽  
Sample Preparation Methods

Improving Sample Preparation Methods For Cannabis-Infused Edible And Topical Products

Planta Medica ◽  
2016 ◽  
Vol 82 (05) ◽  
Author(s):  
M Wilcox ◽  
M Jacyno ◽  
J Marcu ◽  
J Neal-Kababick
Keyword(s):  
Sample Preparation ◽  
Preparation Methods ◽  
Sample Preparation Methods

Thin-Die Flip Chip Physical-FA Process Flow

2002 ◽  
Author(s):  
Andrew J. Komrowski ◽  
N. S. Somcio ◽  
Daniel J. D. Sullivan ◽  
Charles R. Silvis ◽  
Luis Curiel ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Flip Chip ◽  
Semiconductor Industry ◽  
Organic Substrate ◽  
Fault Isolation ◽  
Preparation Methods ◽  
Chip Technology ◽  
Isolation Test ◽  
Sample Preparation Methods

Abstract The use of flip chip technology inside component packaging, so called flip chip in package (FCIP), is an increasingly common package type in the semiconductor industry because of high pin-counts, performance and reliability. Sample preparation methods and flows which enable physical failure analysis (PFA) of FCIP are thus in demand to characterize defects in die with these package types. As interconnect metallization schemes become more dense and complex, access to the backside silicon of a functional device also becomes important for fault isolation test purposes. To address these requirements, a detailed PFA flow is described which chronicles the sample preparation methods necessary to isolate a physical defect in the die of an organic-substrate FCIP.

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