Preparation, characterization, and thermal properties of microPCMs containing n-dodecanol by using different types of styrene-maleic anhydride as emulsifier

2009 ◽  
Vol 287 (5) ◽  
pp. 549-560 ◽  
Author(s):  
Fei Yu ◽  
Zhong-Hua Chen ◽  
Xing-Rong Zeng
Keyword(s):  
Thermal Properties ◽  
Maleic Anhydride ◽  
Different Types ◽  
Styrene Maleic Anhydride

scholarly journals Thermal Study of Anhydrides Cured Tetrafunctional Cardo Epoxy Resin

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Jignesh P. Patel ◽  
Parsotam H. Parsania
Keyword(s):  
Thermal Properties ◽  
Maleic Anhydride ◽  
Epoxy Resin ◽  
Degradation Kinetics ◽  
Frequency Factor ◽  
Entropy Change ◽  
Thermal Study ◽  
Gel Time ◽  
Degradation Reactions ◽  
Different Types

Tetrafunctional cardo epoxy resin (EBCF) was cured by using 10 wt% maleic anhydride (MA), pyromellitic dianhydride (PMDA), phthalic anhydride (PA), tetrahydrophthalic anhydride (THPA), tetrabromophthalic anhydride (TBPA), and tetrachlorophthalic anhydride (TCPA) as hardeners at 120°C for 40–105 min (gel time) and then postcured 1 h at 130°C. Gel time is found to depend on the structure of the anhydrides used. Cured samples were found insoluble in common solvents. Cured and uncured EBCF were characterized by FTIR, DSC, and TGA techniques. Cured and uncured resins followed multistep degradation reactions. Kinetic parameters, namely, order of degradation, energy of activation, frequency factor, and entropy change, were determined according to the Anderson-Freeman method and interpreted in light of the nature of hardeners used for curing purpose. The resins followed integral or fractional order degradation kinetics. Complex degradation reactions are due to different types of linkages in cured resins. Both nature and structure of resin and hardeners affected the curing behavior and the resultant thermal properties of the cured resins.

Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging

2019 ◽  
Vol 142 (1) ◽  
Author(s):  
Jisu Jiang ◽  
Landon Keller ◽  
Paul A. Kohl
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
Maleic Anhydride ◽  
Coefficient Of Thermal Expansion ◽  
Tangent Loss ◽  
Mechanical And Thermal Properties ◽  
Low Dielectric ◽  
Resin Formulation ◽  
Styrene Maleic Anhydride ◽  
Poly Propylene

Abstract Epoxide functionalized poly(propylene carbonate) (ePPC) was included in an epoxy resin formulation and thermally decomposed to create nanoporous epoxy film. The dielectric constant of the porous epoxy was lower than the epoxy formulation control. The introduction of 30% porosity in the epoxy lowered the dielectric constant from 3.78 to 2.76. A postporosity chemical treatment further lowered the dielectric constant. Hexamethyldisilazane (HMDS) was used to terminate the pore walls with the hydrophobic silane layer and reduce both the dielectric constant and tangent loss of the porous epoxy. Two different styrene maleic anhydride crosslinking agents were used in the epoxy formulation, styrene maleic anhydride 2000 (SMA2000) and styrene maleic anhydride 4000 (SMA4000). The effect of the maleic anhydride concentration within SMA on the electrical, mechanical, and thermal properties of porous epoxy film was evaluated. Epoxy films crosslinked with SMA2000 resulted in films with a higher dielectric constant compared to films prepared with SMA4000 due to higher mole fraction of maleic anhydride within SMA2000. However, SMA2000 crosslinked films yielded films with better mechanical and thermal properties. SMA2000 crosslinked films with 30% porosity had a coefficient of thermal expansion (CTE) of 35.2 ppm/K and glass transition temperature of 143 °C.

Styrene-maleic anhydride copolymer esters as flow improvers of waxy crude oil

2009 ◽  
Vol 65 (3-4) ◽  
pp. 139-146 ◽  
Author(s):  
A.M. Al-Sabagh ◽  
M.R. Noor El-Din ◽  
R.E. Morsi ◽  
M.Z. Elsabee
Keyword(s):  
Maleic Anhydride ◽  
Crude Oil ◽  
Waxy Crude Oil ◽  
Waxy Crude ◽  
Styrene Maleic Anhydride ◽  
Maleic Anhydride Copolymer
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