Root cause and vibration analysis to increase veneer manufacturing process efficiency: a case study on an industrial peeling lathe

2021 ◽  
Author(s):  
Víctor Tuninetti ◽  
Ricardo Alzugaray ◽  
Jorge González ◽  
Marian Valenzuela ◽  
Andrés Jaramillo ◽  
...  
Keyword(s):  
Manufacturing Process ◽  
Vibration Analysis ◽  
Process Efficiency ◽  
Root Cause

An integrated TRIZ approach for technological process and product innovation

2015 ◽  
Vol 231 (6) ◽  
pp. 1062-1077 ◽  
Author(s):  
Miao Li ◽  
Xinguo Ming ◽  
Maokuan Zheng ◽  
Lina He ◽  
Zhitao Xu
Keyword(s):  
Problem Solving ◽  
Technological Process ◽  
Manufacturing Process ◽  
Product Innovation ◽  
Interaction Matrix ◽  
Function Model ◽  
Manufacturing Defects ◽  
Root Cause ◽  
Innovative Solution

Process trimming (also can be called as trimming for process) helps to trim and eliminate process operations by redistributing their functions among other operations. It offers one way to eliminate key disadvantages in product and manufacturing process that other methods do not see. However, few methods have been disclosed in a structured way for process trimming effectively. Therefore, this article proposes an integrated process focused on technological process and product innovation to solve the key problems with process trimming-based TRIZ (theory of inventive problem-solving) approach. This method helps to identify and inventively solve the key problems and maximize use resource of system and supersystem. First, process trimming candidates are identified based on component function model, component trimming rules, process function model analysis, component–process interaction matrix, and root cause analysis. Then, three types of process trimming strategies are presented. Algorithm of process trimming is developed to identify key problems in technological process. TRIZ problem-solving tools are used to solve these key problems. Finally, a case study of refrigerator door foam innovative design and manufacturing process is investigated to test the efficiency of the approach. The innovative solution significantly decreases manufacturing defects and service cost.

Case Study of ESD-induced Pin Leakage Failure Solved Using Novel Powered TIVA Technique

2018 ◽  
Author(s):  
Sneta Mishra ◽  
Daniel R. Bockelman
Keyword(s):  
Root Cause ◽  
Leakage Failure

Abstract A case study is presented of a core CPU product where FA/FI debug is performed for an ESD-related pin leakage issue on an IO family to root cause and qualify the product. A Powered TIVA technique is used to localize the damage to the termination resistor circuitry of the affected IO block when the pin is tristated using a device tester. Failure characterization shows a gate to drain short on the transistor, with nanoprobing confirming a solid short on gate to drain and TEM finding a short at the location indicated by the TIVA hits.

Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips

2006 ◽  
Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris
Keyword(s):  
Reliability Analysis ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit ◽  
Root Cause ◽  
Micro Cracks ◽  
Temperature And Humidity

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

Case Study and Fault Modeling for Wrong Redundancy Evaluation on DRAM Devices

2007 ◽  
Author(s):  
Martin Versen ◽  
Dorina Diaconescu ◽  
Jerome Touzel
Keyword(s):  
Failure Mode ◽  
Failure Modes ◽  
Fault Modeling ◽  
Mode Analysis ◽  
Root Cause ◽  
Failure Mode Analysis

Abstract The characterization of failure modes of DRAM is often straight forward if array related hard failures with specific addresses for localization are concerned. The paper presents a case study of a bitline oriented failure mode connected to a redundancy evaluation in the DRAM periphery. The failure mode analysis and fault modeling focus both on the root-cause and on the test aspects of the problem.

Case Study—Failure Analysis of a Multiplexer

2016 ◽  
Author(s):  
Michael Woo ◽  
Marcos Campos ◽  
Luigi Aranda
Keyword(s):  
Failure Analysis ◽  
High Reliability ◽  
Component Failure ◽  
Root Cause ◽  
Knowing That ◽  
Cause Of Failure ◽  
The Cost

Abstract A component failure has the potential to significantly impact the cost, manufacturing schedule, and/or the perceived reliability of a system, especially if the root cause of the failure is not known. A failure analysis is often key to mitigating the effects of a componentlevel failure to a customer or a system; minimizing schedule slips, minimizing related accrued costs to the customer, and allowing for the completion of the system with confidence that the reliability of the product had not been compromised. This case study will show how a detailed and systemic failure analysis was able to determine the exact cause of failure of a multiplexer in a high-reliability system, which allowed the manufacturer to confidently proceed with production knowing that the failure was not a systemic issue, but rather that it was a random “one time” event.

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

scholarly journals Investigation into the Cause of Iron-Related Clogging of Groundwater Bores Used for Viticulture in the Limestone Coast, South Australia

Water ◽  
2021 ◽  
Vol 13 (5) ◽  
pp. 683
Author(s):  
Birte Moser ◽  
Meruyert Beknazarova ◽  
Harriet Whiley ◽  
Thilini Piushani Keerthirathne ◽  
Nikki Harrington ◽  
...  
Keyword(s):  
Groundwater Resources ◽  
South Australia ◽  
Water Levels ◽  
Clear Correlation ◽  
Problem Analysis ◽  
Persistent Problem ◽  
Root Cause ◽  
Complex Interactions ◽  
Iron Manganese

Iron-related clogging of boreholes, pumps and dripper lines is a significant and costly problem for irrigators worldwide. The primary cause of iron-related clogging is still debated. Previous studies have described complex interactions between biological clogging and inorganic iron/manganese oxide precipitation. This case study examined groundwater bores used for viticulture irrigation in the Limestone Coast region, a highly productive wine growing area in the SE of South Australia. Iron clogging of bore screens, pumps and dripper systems has been a persistent problem in the region and the issue is perceived to be growing, with irrigators suggesting the widespread introduction of iron-related bacteria (IRB) through drilling equipment to be the root cause of the problem. Analysis of the groundwater microbiology and inorganic chemistry found no apparent correlation between the presence of IRB and the clogging status of wells. In fact, IRB proved to be widespread throughout the limestone aquifer. However, a clear correlation could be found between clogging affected bores and the redox potential of the groundwater with the most severely affected bores strongly oversaturated in respect to iron oxide minerals. Elevated dissolved concentrations of Fe(II) thereby tended to be found in deeper bores, which also were generally more recently drilled. Following decades of less than average rainfall, a tendency to deepen bores in response to widespread declines in water levels has been documented for the SE of South Australia. The gradually widening clogging problem in the region is postulated to be related to the changes in climate in the region, with irrigators increasingly driven to rely on deeper, anoxic iron-rich groundwater resources.

scholarly journals Waste reduction of polypropylene bag manufacturing process using Six Sigma DMAIC approach: A case study

2021 ◽  
Vol 8 (1) ◽  
pp. 1896419
Author(s):  
Muhammad Hamad Sajjad ◽  
Khawar Naeem ◽  
Muhammad Zubair ◽  
Qazi Muhammad Usman Jan ◽  
Sikandar Bilal Khattak ◽  
...  
Keyword(s):  
Six Sigma ◽  
Manufacturing Process ◽  
Waste Reduction
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