Structure of the oxidation layer for stoichiometric and lean methane-air flames

Author(s):  
K. Seshadri ◽  
J. Göttgens
Keyword(s):  
2021 ◽  
Vol 13 (3) ◽  
pp. 3991-3998
Author(s):  
Guangwu Hu ◽  
Ruohan Yu ◽  
Zhenhui Liu ◽  
Qiang Yu ◽  
Yuanyuan Zhang ◽  
...  

2021 ◽  
pp. 151956
Author(s):  
Naxin Zhu ◽  
Kaichuang Ma ◽  
Xiangyi Xue ◽  
Jie Su
Keyword(s):  

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 001701-001730
Author(s):  
Taiji Sakai ◽  
Nobuhiro Imaizumi ◽  
Masataka Mizukoshi ◽  
Masayuki Kawase ◽  
Ryoji Tanimoto ◽  
...  

We have developed Cu-Cu/adhesives hybrid bonding technique by using collective cutting of Cu bumps and adhesives in order to achieve high density 3D-SIC. It is considered that progression of fine pitch interconnection leads to lower height of bonding electrodes, resulting in narrow gap between 3D-SICs. Therefore, it is difficult to fill in adhesive to such a narrow gap 3D-SICs after bonding, so we consider that hybrid bonding of pre-applied adhesives and Cu-Cu thermocompression bonding must be advantageous, in terms of void less bonding and minimizing bonding stress by adhesives and also low electricity by Cu-Cu solid diffusion bonding. In the present study, we adapted the following process; at first adhesives were spin coated on the wafer with Cu post and then pre-baked. After that, pre-applied adhesives and Cu bumps were successfully cut by single crystal diamond bite. Typical adhesives may cause bite damage with continuous cutting, but in this research, we selected low damage adhesive against continuous cutting, which is important properties to commercial uses. Then, chips with adhesives were attached to substrates and Cu oxidation layer was removed by exposing formic acid atmosphere. Finally permanent bonding was done at 225 degree C for 30 minutes. We concluded that solid diffusion between bonded Cu bumps could be achieved and no adhesive residue could be seen between bonded interfaces by TEM/EDX analysis.


Author(s):  
Gabriel Plascencia ◽  
Torstein A. Utigard ◽  
Juliana Gutiérrez ◽  
David Jaramillo ◽  
Fernando Martínez

2019 ◽  
Vol 102 (12) ◽  
pp. 7543-7552 ◽  
Author(s):  
Bin Du ◽  
Chao He ◽  
Junjie Qian ◽  
Xuan Wang ◽  
Mei Cai ◽  
...  

Minerals ◽  
2020 ◽  
Vol 10 (12) ◽  
pp. 1071
Author(s):  
Luying Wang ◽  
Heping Li ◽  
Qingyou Liu ◽  
Liping Xu ◽  
Lei Zha ◽  
...  

Understanding the oxidative mechanisms of chalcopyrite in various hydrothermal fluids is of great significance to improve copper extraction and to model the geochemical cycling of copper, iron, and sulfur. This paper investigated the effect of NaCl on the electrochemical oxidation of chalcopyrite at 340 °C and 21 MPa using polarization curves, electrochemical impedance spectroscopy (EIS), scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS), and Raman spectroscopy. The experimental results showed that NaCl can promote chalcopyrite leaching. As NaCl concentration increases, the protective property of the oxidation layer degraded. In the absence of NaCl, the oxidation layer that consisted of CuSn, (n ≥ 1), probably with some Fe2O3 and Fe(OH)3 and also in the presence of NaCl, Fe2O3, is the principal oxidation product. More rapid ionic diffusion and further chemical reaction contributed to the improvement of chalcopyrite dissolution with increasing NaCl concentration. A dissolution mechanism is proposed in this paper to explain the chalcopyrite leaching processes which is dependent on NaCl concentration.


2016 ◽  
Vol 23 (05) ◽  
pp. 1650045 ◽  
Author(s):  
MUHAMMAD AHSAN SHAFIQUE ◽  
G. MURTAZA ◽  
SHAHZAD SAADAT ◽  
ZEESHAN ZAHEER ◽  
MUHAMMAD SHAHNAWAZ ◽  
...  

Nickel ion release from NiTi shape memory alloy is an issue for biomedical applications. This study was planned to study the effect of C[Formula: see text] implantation on nickel ion release and affinity of calcium phosphate precipitation on NiTi alloy. Four annealed samples are chosen for the present study; three samples with oxidation layer and the fourth without oxidation layer. X-ray diffraction (XRD) spectra reveal amorphization with ion implantation. Proton-induced X-ray emission (PIXE) result shows insignificant increase in Ni release in simulated body fluid (SBF) and calcium phosphate precipitation up to [Formula: see text][Formula: see text]ions/cm2. Then Nickel contents show a sharp increase for greater ion doses. Corrosion potential decreases by increasing the dose but all the samples passivate after the same interval of time and at the same level of [Formula: see text] in ringer lactate solution. Hardness of samples initially increases at greater rate (up to [Formula: see text][Formula: see text]ions/cm[Formula: see text] and then increases with lesser rate. It is found that [Formula: see text][Formula: see text]ions/cm2 ([Formula: see text] is a safer limit of implantation on NiTi alloy, this limit gives us lesser ion release, better hardness and reasonable hydroxyapatite incubation affinity.


2011 ◽  
Vol 33 (1) ◽  
pp. 1647-1654 ◽  
Author(s):  
Bruno Coriton ◽  
Jonathan H. Frank ◽  
Andrea G. Hsu ◽  
Mitchell D. Smooke ◽  
Alessandro Gomez

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