Effect on the Microstructural and Thermomechanical Properties of a Porcelain Insulator after Substitution of Quartz by Technical Alumina

2015 ◽  
Vol 64 (6-7) ◽  
pp. 282-286
Author(s):  
G. Pahari ◽  
T. K. Parya
Keyword(s):  
Thermomechanical Properties ◽  
Porcelain Insulator ◽  
Technical Alumina

Materials Issues and Characterization of Low-k Dielectric Materials

MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 49-54 ◽  
Author(s):  
E. Todd Ryan ◽  
Andrew J. McKerrow ◽  
Jihperng Leu ◽  
Paul S. Ho
Keyword(s):  
Process Integration ◽  
Dielectric Materials ◽  
Propagation Delay ◽  
Thermomechanical Properties ◽  
General Criterion ◽  
Crosstalk Noise ◽  
Total Delay ◽  
Interlayer Dielectrics ◽  
Performance Improvements ◽  
And Performance

Continuing improvement in device density and performance has significantly affected the dimensions and complexity of the wiring structure for on-chip interconnects. These enhancements have led to a reduction in the wiring pitch and an increase in the number of wiring levels to fulfill demands for density and performance improvements. As device dimensions shrink to less than 0.25 μm, the propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant. Accordingly the interconnect delay now constitutes a major fraction of the total delay limiting the overall chip performance. Equally important is the processing complexity due to an increase in the number of wiring levels. This inevitably drives cost up by lowering the manufacturing yield due to an increase in defects and processing complexity.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILDs) and alternative architectures have surfaced to replace the current Al(Cu)/SiO2 interconnect technology. These alternative architectures will require the introduction of low-dielectric-constant k materials as the interlayer dielectrics and/or low-resistivity conductors such as copper. The electrical and thermomechanical properties of SiO2 are ideal for ILD applications, and a change to material with different properties has important process-integration implications. To facilitate the choice of an alternative ILD, it is necessary to establish general criterion for evaluating thin-film properties of candidate low-k materials, which can be later correlated with process-integration problems.

Thermomechanical properties of nanocomposites based on clinoptilolite and copolymer of ethylene with hexen

2020 ◽  
pp. 58-66
Author(s):  
N. T. Kakhramanov ◽  
◽  
I. V. Bayramova ◽  
S. S. Pesetsky ◽  
◽  
...  
Keyword(s):  
Thermomechanical Properties

Studies and Research on the Corrosion Behavior of Ni-Al2O3 Compound Coatings Obtained by Electrochemical Methods

2020 ◽  
Vol 43 (3) ◽  
pp. 21-25
Author(s):  
Simona BOICIUC ◽  
◽  
◽  
Keyword(s):  
Corrosion Resistance ◽  
Corrosion Behavior ◽  
Corrosion Behaviour ◽  
Composite Coatings ◽  
Point Of View ◽  
Electrochemical Methods ◽  
Dispersed Phase ◽  
Nickel Matrix ◽  
Technical Alumina ◽  
Compound Coatings

The undertaken research which is described in this paper aims at the corrosion behaviour of composite coatings in nickel matrix using as dispersed phase technical alumina with dimensions of 5 μm and their characterization from a microstructural point of view. The corrosion resistance in the saline fog of the coatings is influenced by the microstructure, the stresses developed in the layer and the roughness.

scholarly journals Fabrication of electrical porcelain insulator from ceramic raw materials of Oromia region, Ethiopia

Heliyon ◽  
2019 ◽  
Vol 5 (8) ◽  
pp. e02327 ◽  
Author(s):  
Andualem Merga ◽  
H.C.Ananda Murthy ◽  
Enyew Amare ◽  
Kalid Ahmed ◽  
Eshetu Bekele
Keyword(s):  
Raw Materials ◽  
Electrical Porcelain ◽  
Porcelain Insulator
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