Activation Energy for High Temperature Creep of High Purity Aluminum

JOM ◽  
1956 ◽  
Vol 8 (10) ◽  
pp. 1385-1388 ◽  
Author(s):  
H. I-Lieh Huang ◽  
O. D. Sherby ◽  
J. E. Dorn
Keyword(s):  
Activation Energy ◽  
High Temperature ◽  
High Purity ◽  
High Temperature Creep ◽  
Temperature Creep ◽  
High Purity Aluminum

High-temperature creep properties of NIFS-HEAT-2 high-purity low-activation vanadium alloy

2019 ◽  
Vol 59 (9) ◽  
pp. 096046 ◽  
Author(s):  
T. Nagasaka ◽  
T. Muroga ◽  
T. Tanaka ◽  
A. Sagara ◽  
K. Fukumoto ◽  
...  
Keyword(s):  
High Temperature ◽  
High Purity ◽  
High Temperature Creep ◽  
Vanadium Alloy ◽  
Creep Properties ◽  
Temperature Creep

Effect of Stress on Creep at High Temperatures

1957 ◽  
Vol 24 (2) ◽  
pp. 207-213
Author(s):  
H. Laks ◽  
C. D. Wiseman ◽  
O. D. Sherby ◽  
J. E. Dorn
Keyword(s):  
Activation Energy ◽  
Solid Solution ◽  
High Temperature ◽  
Creep Rate ◽  
Pure Aluminum ◽  
Dislocation Climb ◽  
Experimental Investigations ◽  
High Temperature Creep ◽  
Self Diffusion ◽  
Temperature Creep

Abstract Experimental investigations on pure aluminum and its dilute solid-solution alloys revealed that the high-temperature creep rate ϵ̇ is related to the stress σ by ϵ̇ ∼ σn for low stresses and ϵ̇ ∼ eBσ for high stresses where n and B are constants independent of the creep strain and temperature. According to a preliminary dislocation-climb model for high-temperature creep, the activation energy for creep is that for self-diffusion, the effect of stress on the creep rate depends on the number of active Frank-Read sources, and the rate of climb depends on the structure as determined by the pattern of climbing dislocations. Many of the experimental observations on high-temperature creep can be accounted for by this model.

On the activation energy of high temperature creep

1961 ◽  
Vol 9 (11) ◽  
pp. 1036-1037 ◽  
Author(s):  
P. Feltham ◽  
J.D. Meakin
Keyword(s):  
Activation Energy ◽  
High Temperature ◽  
High Temperature Creep ◽  
Temperature Creep

scholarly journals High Temperature Creep Properties of High Purity Chromium

1992 ◽  
Vol 78 (6) ◽  
pp. 947-954
Author(s):  
Yoshihiro KONDO ◽  
Kazuhiro KAWASUE ◽  
Jirou NAMEKATA ◽  
Takashi SAKAKI ◽  
Akira HONDA
Keyword(s):  
High Temperature ◽  
High Purity ◽  
High Temperature Creep ◽  
Creep Properties ◽  
Temperature Creep

scholarly journals High Temperature Creep Resistance of High Purity Chromium in Argon

1993 ◽  
Vol 79 (11) ◽  
pp. 1299-1304
Author(s):  
Yoshihiro KONDO ◽  
Kazuhiro KAWASUE ◽  
Jirou NAMEKATA ◽  
Takashi SAKAKI
Keyword(s):  
High Temperature ◽  
High Purity ◽  
Creep Resistance ◽  
High Temperature Creep ◽  
Temperature Creep

Characteristics of High Temperature Creep in Pure Aluminum Processed by Equal-Channel Angular Pressing

2010 ◽  
Vol 638-642 ◽  
pp. 1965-1970 ◽  
Author(s):  
Megumi Kawasaki ◽  
Terence G. Langdon
Keyword(s):  
High Temperature ◽  
Equal Channel Angular Pressing ◽  
Flow Behavior ◽  
Pure Aluminum ◽  
High Temperature Creep ◽  
Steady State Flow ◽  
Creep Properties ◽  
Temperature Creep ◽  
Angular Pressing ◽  
High Purity Aluminum

High purity aluminum was processed by equal-channel angular pressing (ECAP) to reduce the grain size to ~1.3 m. Tensile specimens were cut from the as-pressed billets and these specimens were tested under conditions of high temperature creep. The results show excellent creep properties with a well-defined region of steady-state flow. The flow behavior is analyzed by comparing the creep data with the predicted behavior for different fundamental creep mechanisms and by plotting a deformation mechanism map to provide a visual representation of the creep properties.

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