Full-wave electromagnetic simulation of millimeter-wave active devices and circuits

1999 ◽  
Vol 54 (1-2) ◽  
pp. 30-42
Author(s):  
Samir Hammadi ◽  
Robert O Grondin ◽  
Samir El-Ghazaly ◽  
Stephen Goodnick
Keyword(s):  
Millimeter Wave ◽  
Electromagnetic Simulation ◽  
Active Devices ◽  
Full Wave

scholarly journals In-situ monitoring for liquid metal jetting using a millimeter-wave impedance diagnostic

2020 ◽  
Vol 10 (1) ◽  
Author(s):  
Tammy Chang ◽  
Saptarshi Mukherjee ◽  
Nicholas N. Watkins ◽  
David M. Stobbe ◽  
Owen Mays ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Millimeter Wave ◽  
Manufacturing Systems ◽  
Wave Impedance ◽  
In Situ Monitoring ◽  
Full Wave ◽  
Drop On Demand ◽  
The Time Domain ◽  
Metal Droplets

AbstractThis article presents a millimeter-wave diagnostic for the in-situ monitoring of liquid metal jetting additive manufacturing systems. The diagnostic leverages a T-junction waveguide device to monitor impedance changes due to jetted metal droplets in real time. An analytical formulation for the time-domain T-junction operation is presented and supported with a quasi-static full-wave electromagnetic simulation model. The approach is evaluated experimentally with metallic spheres of known diameters ranging from 0.79 to 3.18 mm. It is then demonstrated in a custom drop-on-demand liquid metal jetting system where effective droplet diameters ranging from 0.8 to 1.6 mm are detected. Experimental results demonstrate that this approach can provide information about droplet size, timing, and motion by monitoring a single parameter, the reflection coefficient amplitude at the input port. These results show the promise of the impedance diagnostic as a reliable in-situ characterization method for metal droplets in an advanced manufacturing system.

Unconditionally Stable MFLTD Method for the Full Wave Electromagnetic Simulation

2012 ◽  
Vol 60 (5) ◽  
pp. 2583-2586 ◽  
Author(s):  
Rashid Mirzavand ◽  
Abdolali Abdipour ◽  
Gholamreza Moradi ◽  
Masood Movahhedi
Keyword(s):  
Electromagnetic Simulation ◽  
Unconditionally Stable ◽  
Full Wave

Two-dimensional Wireless Power Relay Plane based on Rectangular Switchable Units

2021 ◽  
Vol 35 (11) ◽  
pp. 1450-1451
Author(s):  
Zhouyi Wu ◽  
Peiying Lin ◽  
Chao Ma ◽  
Zhiyi Tang ◽  
Ran Li ◽  
...  
Keyword(s):  
Transmission Efficiency ◽  
Electromagnetic Simulation ◽  
Two Dimensional ◽  
Power Transfer ◽  
Wireless Power ◽  
Resonant Frequencies ◽  
Full Wave ◽  
Power Exchange ◽  
Wireless Relay ◽  
Efficient Power

In this paper a two-dimensional wireless relay plane consists of square resonant units is proposed. Power transfer between the transmitting coil and receiver above any unit can be achieved by resonance through the shortest routes on the plane. The self-resonant frequencies of units on the planned route are adjusted to be identical for efficient power transfer, while units beyond the route are isolated from power exchange due to frequency shift. Full wave electromagnetic simulation is executed and analyzed. According to the simulation results, concentrated power transfer can be realized on the power relay plane, and the highest transmission efficiency is 73.93%.

Broadband Transition between Substrate Integrated Waveguide (SIW) and Rectangular Waveguide for Millimeter-Wave Applications

2011 ◽  
Vol 130-134 ◽  
pp. 1990-1993 ◽  
Author(s):  
Kuang Da Wang ◽  
Wei Hong ◽  
Ke Wu
Keyword(s):  
Millimeter Wave ◽  
Rectangular Waveguide ◽  
Return Loss ◽  
Substrate Integrated Waveguide ◽  
Full Wave ◽  
Vertical Transition ◽  
W Band ◽  
Relative Bandwidth ◽  
Is Design ◽  
Better Than

In this paper, a broadband and simple vertical transition between substrate integrated waveguide and standard air-filled rectangular waveguide is design and experimentally verified. From full-wave simulation of the structure, a relative bandwidth of 19.5% in W-band with return loss better than 20dB is reached. Then, five copies of back-to-back connected transitions are fabricated on RT/Duroid 5880 substrate. The experimental results show that the transition pairs have an average of 15% relative bandwidth with return loss better than 12dB and insert loss lower than 1.2dB. To explain the differences between simulated and tested results, an error analysis is presented.

Design of multi-layered bandpass filter with independently controllable triple-passband response

2014 ◽  
Vol 6 (6) ◽  
pp. 611-618 ◽  
Author(s):  
Yung-Wei Chen ◽  
Hung-Wei Wu ◽  
Yan-Kuin Su
Keyword(s):  
Frequency Response ◽  
Bandpass Filter ◽  
Bottom Layer ◽  
Wide Frequency Range ◽  
Electromagnetic Simulation ◽  
Frequency Range ◽  
High Isolation ◽  
Full Wave ◽  
Simulation Results ◽  
Good Agreement

In this paper, a new multi-layered triple-passband bandpass filter using embedded and stub-loaded stepped impedance resonators (SIRs) is proposed. The filter is designed to have triple-passband at 1.8, 2.4, and 3.5 GHz. The 1st and 2nd passbands (1.8/2.4 GHz) are simultaneously generated by controlling the impedance and length ratios of the embedded SIRs (on top layer). The 3rd passband (3.5 GHz) is generated by using the stub-loaded SIR (on bottom layer). Using the embedded SIR, the even modes can be tuned within very wide frequency range and without affecting the odd modes. Therefore, the design of multi-band filters with very close passbands can be easily achieved and having a high isolation between the passbands. The filter can provide the multi-path propagation to enhance the frequency response and achieving the compact circuit size. The measured results are in good agreement with the full-wave electromagnetic simulation results.

Millimeter Wave Characterization of Wire Bond Transitions for W-Band Electromagnetic Sensor

2015 ◽  
Vol 738-739 ◽  
pp. 103-106
Author(s):  
Yong Fang ◽  
Bao Qing Zeng ◽  
Wen Tao Zhang ◽  
Pu Wang
Keyword(s):  
Equivalent Circuit ◽  
Millimeter Wave ◽  
Equivalent Circuit Model ◽  
Single Wire ◽  
Full Wave ◽  
Wire Bond ◽  
W Band ◽  
Electromagnetic Sensor ◽  
Simulation Results ◽  
Lumped Equivalent Circuit

This paper presents millimeter wave characterization and models of various wire bond transitions between chip’s ground-signal-ground pad (GSG) and microstrip (MS), include single-wire-nomatch MS-GSG transition, double-wire-nomatch MS-GSG, single-wire-match MS-GSG transition, and double-wire-match MS-GSG transition. It also presents the 3D full-wave electromagnetic simulation. Analysis results show that the double-wire-match MS-GSG transition’s characteristic is better than other three transitions in the whole W band. The accurate extracted parameter values are used for the lumped equivalent circuit model, whose simulation results are good with the full wave simulation results. The error between lumped equivalent circuit and full-wave models is of the order of ±0.2dB for S11 and S21 in the frequency range 75 - 105GHz. The proposed lumped equivalent circuit is suitable to be implemented in commercial microwave CAD tools for the electromagnetic sensor designing.

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