Effect of temperature cycling on the activity and productivity of immobilized β-galactosidase in a thermally reversible hydrogel bead reactor

1988 ◽  
Vol 19 (1) ◽  
pp. 1-9 ◽  
Author(s):  
Tae Gwan Park ◽  
Allan S. Hoffman
Keyword(s):  
Temperature Cycling ◽  
Effect Of Temperature ◽  
Hydrogel Bead

Effect of Temperature Cycling on Conduction Mechanisms in CdTe Thin Films

2012 ◽  
Vol 42 (3) ◽  
pp. 389-397
Author(s):  
V. Srivastav ◽  
R. Pal ◽  
N. Saini ◽  
R. S. Saxena ◽  
R. K. Bhan ◽  
...  
Keyword(s):  
Thin Films ◽  
Temperature Cycling ◽  
Effect Of Temperature ◽  
Conduction Mechanisms ◽  
Cdte Thin Films

Effect of Temperature Cycling on the Production of Patulin and Citrinin

1981 ◽  
Vol 46 (3) ◽  
pp. 974-975 ◽  
Author(s):  
Y. C. LIN ◽  
J. C. YRES ◽  
P. E. KOEHLER
Keyword(s):  
Temperature Cycling ◽  
Effect Of Temperature

Optimization of Wire Loop Height for a Cavity Down Plastic Pin Grid Array Package

1998 ◽  
Vol 120 (2) ◽  
pp. 194-200 ◽  
Author(s):  
I. Chaudhry ◽  
F. Barez
Keyword(s):  
Finite Element ◽  
Simulation Study ◽  
Thermal Stresses ◽  
Element Model ◽  
Temperature Cycling ◽  
Effect Of Temperature ◽  
Temperature Cycle ◽  
Wire Loop ◽  
Simulation Results ◽  
Test Points

A study has been conducted to resolve wire neck break problem in a cavity-down plastic pin grid array (PPGA) packages with a specific range of parameters when subjected to temperature cycle (−55°C/+125°C). In most cases, a weak or broken neck of the wire was observed after 300 cycles of temperature cycling. The objective of this study is to determine an optimum wire loop height so that the package can pass a 1000 temperature cycles. Results of a simulation study, performed by other researchers, using a finite element model (FEM) were utilized. Their work considered the effect of temperature cycling on PPGA packages identical to those in this report. Several possible factors that can contribute to this failure mechanism were analyzed, and stresses in the wires were evaluated. The simulation results were verified by running an experiment on actual parts. The parts were subjected to temperature cycling, and data was gathered at different test points. The experimental results obtained did concur with simulation results which suggested that the area just above the ball experienced a significant level of thermal stresses, and such stresses could be reduced by determining an optimum loop height.

The effect of temperature cycling on thin films of YBa2Cu3O7

1990 ◽  
Vol 3 (11) ◽  
pp. 537-539 ◽  
Author(s):  
A Mogro-Campero ◽  
L G Turner ◽  
A Bogorad ◽  
R Herschitz
Keyword(s):  
Thin Films ◽  
Temperature Cycling ◽  
Effect Of Temperature

scholarly journals Cream-like emulsions prepared with soy milk 3: Effect of temperature cycling

2005 ◽  
Vol 56 (3) ◽  
Author(s):  
Andrés L. Márquez ◽  
Gonzalo G. Palazolo ◽  
Jorge R. Wagner
Keyword(s):  
Temperature Cycling ◽  
Effect Of Temperature ◽  
Soy Milk

Effect of temperature cycling on reliability of flip chip solder joint

2014 ◽  
Author(s):  
Xueming Jiang ◽  
Pengrong Lin ◽  
Yuezhong Song ◽  
Yingzhuo Huang ◽  
Binhao Lian ◽  
...  
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Temperature Cycling ◽  
Effect Of Temperature
Sign in / Sign up

Export Citation Format

Share Document