The mechanism of anneal hardening in dilute copper alloys

1979 ◽  
Vol 10 (12) ◽  
pp. 1889-1892 ◽  
Author(s):  
J. M. Vitek ◽  
H. Warlimont
2002 ◽  
Vol 34 (2) ◽  
pp. 169-174 ◽  
Author(s):  
Svetlana Nestorovic ◽  
Boran Milicevic ◽  
Desimir Markovic

Samples of copper and copper alloys CuNi and CuNiAl were prepared by a powder metallurgical method and were then subjected to cold rolling with different degrees of deformation. Copper and copper alloys in the cold-rolled state were isochronally annealed up to the recrystallization temperature during which hardness and electrical conductivity were measured. This investigation shows that the anneal hardening effect occurs in a temperature range of 450 - 650 K, followed with an increase in hardness of alloys.


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