Growth kinetics of grain boundary allotriomorphs of proeutectoid ferrite in Fe-C-Mn-X2 alloys

1995 ◽  
Vol 26 (3) ◽  
pp. 561-580 ◽  
Author(s):  
T. Tanaka ◽  
H. I. Aaronson ◽  
M. Enomoto
Keyword(s):  
Grain Boundary ◽  
Growth Kinetics ◽  
Boundary Allotriomorphs ◽  
Proeutectoid Ferrite ◽  
Kinetics Of

Three-Dimensional Observation and Growth Kinetics of Proeutectoid Ferrite Formed at Austenite Grain Boundary in a Low Carbon Microalloyed Steel

2007 ◽  
Vol 539-543 ◽  
pp. 4578-4583 ◽  
Author(s):  
Kai Ming Wu ◽  
A.M. Guo ◽  
Lin Cheng
Keyword(s):  
Grain Boundary ◽  
Growth Kinetics ◽  
Three Dimensional ◽  
Low Carbon ◽  
Austenite Grain ◽  
Ferrite Allotriomorphs ◽  
Proeutectoid Ferrite ◽  
Carbon Microalloyed ◽  
Austenite Grain Boundary ◽  
Kinetics Of

Three-dimensional observations of proeutectoid ferrite formed at grain boundary in an Fe-0.09%C-1.48%Mn vanadium microalloyed alloy was revealed by techniques of serial sectioning along with computer-aided reconstruction. The ferrite allotriomorphs nucleated at grain boundary edges were approximately prolate ellipsoids. Not all the ferrite allotriomorphs formed at grain boundary faces were oblate ellipsoids. The growth kinetics of ferrite allotriomorphs nucleated at grain boundary edges was greater than that of ferrite allotriomorphs nucleated at grain boundary faces.

On the growth kinetics of grain boundary ferrite allotriomorphs

1973 ◽  
Vol 4 (3) ◽  
pp. 783-792 ◽  
Author(s):  
C. Atkinson ◽  
H. B. Aaron ◽  
K. R. Kinsman ◽  
H. I. Aaronson
Keyword(s):  
Grain Boundary ◽  
Growth Kinetics ◽  
Ferrite Allotriomorphs ◽  
Kinetics Of ◽  
Grain Boundary Ferrite

Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Xu Han ◽  
Xiaoyan Li ◽  
Peng Yao
Keyword(s):  
Grain Boundary ◽  
Microstructural Evolution ◽  
Growth Kinetics ◽  
Boundary Diffusion ◽  
Solder Joints ◽  
Content Type ◽  
Soldering Process ◽  
Different Temperatures ◽  
Ultrasonic Soldering ◽  
Kinetics Of

Purpose This study aims to investigate the effect of ultrasound on interfacial microstructures and growth kinetics of intermetallic compounds (IMCs) at different temperatures. Design/methodology/approach To investigate the effect of ultrasound on IMCs growth quantitatively, the cross-sectional area of IMCs layers over a confirmed length was obtained for calculating the thickness of the IMCs layer. Findings The generation of dimensional difference in normal direction between Cu6Sn5 and its adjacent Cu6Sn5, formation of bossed Cu6Sn5 and non-interfacial Cu6Sn5 in ultrasonic solder joints made the interfacial Cu6Sn5 layer present a non-scallop-like morphology different from that of traditional solder joints. At 260°C and 290°C, the Cu3Sn layer presented a wave-like shape. In contrast, at 320°C, the Cu3Sn in ultrasonic solder joints consisted of non-interfacial Cu3Sn and interfacial Cu3Sn with a branch-like shape. The Cu6Sn5/Cu3Sn boundary and Cu3Sn/Cu interface presented a sawtooth-like shape under the effect of ultrasound. The predominant mechanism of ultrasonic-assisted growth of Cu6Sn5 growth at 260°C, 290°C and 320°C involved the grain boundary diffusion accompanied by grain coarsening. The Cu3Sn growth was controlled by volume diffusion during the ultrasonic soldering process at 260°C and 290°C. The diffusion mechanism of Cu3Sn growth transformed to grain boundary diffusion accompanied by grain coarsening when the ultrasonic soldering temperature was increased to 320°C. Originality/value The microstructural evolution and growth kinetics of IMCs in ultrasonically prepared ultrasonic solder joints at different temperatures have rarely been reported in previous studies. In this study, the effect of ultrasound on microstructural evolution and growth kinetics of IMCs was systematically investigated.

Diffusion Controlled Abnormal Grain Growth in Ceramics

2007 ◽  
Vol 558-559 ◽  
pp. 1227-1236 ◽  
Author(s):  
Shen J. Dillon ◽  
Martin P. Harmer
Keyword(s):  
Grain Boundary ◽  
Grain Growth ◽  
Growth Kinetics ◽  
Abnormal Grain Growth ◽  
Growth Theory ◽  
Diffusion Controlled ◽  
Grain Growth Kinetics ◽  
Kinetics Of

The grain growth kinetics of silica and calcia doped alumina at 1400oC and their grain boundary complexion is characterized. These data are compared to predictions of both diffusion controlled and nucleation limited interface controlled grain growth theory. It is deduced from the indicators that the mechanism for normal and abnormal grain growth in these aluminas is diffusion controlled.

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