In search of potential earthquake source regions in the Chinese mainland in the light of ambient shear stress field

1995 ◽  
Vol 8 (3) ◽  
pp. 365-377 ◽  
Author(s):  
Pei-Shan Chen ◽  
Tong-Xia Bai ◽  
Lei Xiao
Keyword(s):  
Shear Stress ◽  
Stress Field ◽  
Chinese Mainland ◽  
Earthquake Source ◽  
Source Regions ◽  
The Chinese Mainland ◽  
Shear Stress Field ◽  
Ambient Shear Stress

Study on Characteristics of Seismic Ambient Shear Stress in Gansu Province

2014 ◽  
Vol 1065-1069 ◽  
pp. 1433-1437
Author(s):  
Xiu Feng Tian ◽  
Xuan Zhang ◽  
Ju Pu
Keyword(s):  
Shear Stress ◽  
Spatial Distribution ◽  
Stress Field ◽  
Gansu Province ◽  
Seismic Shear ◽  
Tectonic Environment ◽  
Relationship Of ◽  
The Relationship ◽  
Shear Stress Field ◽  
Ambient Shear Stress

The breeding and occurrence of earthquake closely related to the intensity and spatial distribution of ambient shear stress field. Earthquakes would happen when the regional shear stress enhanced to the damage limit of rocks. In this paper, we used some acceleration records in Gansu province, and calculated corresponding seismic shear stress value according to the theory put forward by Professor Chen Peishan. Combined with the tectonic environment, we discussed the relationship of ambient shear stress with the magnitude and hypocentral depth.

Cell adhesion on gaseous plasma modified poly-(l-lactide) surface under shear stress field

Biomaterials ◽  
2003 ◽  
Vol 24 (21) ◽  
pp. 3757-3764 ◽  
Author(s):  
Yuqing Wan ◽  
Jian Yang ◽  
Junlin Yang ◽  
Jianzhong Bei ◽  
Shenguo Wang
Keyword(s):  
Shear Stress ◽  
Cell Adhesion ◽  
Stress Field ◽  
Gaseous Plasma ◽  
Shear Stress Field

An Evaluation of a Modified Iosipescu Specimen for Measurement of Elastic-Plastic Properties of Solder Materials

2010 ◽  
Author(s):  
Subhasis Mukherjee ◽  
Abhijit Dasgupta
Keyword(s):  
Shear Stress ◽  
Stress Field ◽  
Solder Joint ◽  
Scale Effects ◽  
Element Model ◽  
Test Material ◽  
Plastic Properties ◽  
Elastic Plastic ◽  
Uniform Shear ◽  
Shear Stress Field

There are various specimen configurations available in the literature for characterizing the mechanical behavior of solder interconnect materials. An ideal test specimen should use a simple geometry to minimize the complexity of the stress analysis and which produces a uniform material response throughout the test material. In the thermo-mechanical micro scale (TMM) test used in this study, we use a simple, notched shear specimen, based on a concept originally proposed by Iosipescu [1967] [1], which produces a very uniform shear stress field in the solder joint volume [Reinikainen et al., 1998] [2]. Our modified Iosipescu specimen comprises of two oxygen free, high conductivity (OFHC) copper platens soldered together and loaded in simple shear. The solder joint in this specimen is only 180 microns wide to capture the length scale effects of functional solder interconnects. This study examines the effects of dimensional variabilities of this modified Iosipescu specimen on the shear stress distribution in the solder joint. Variabilities encountered in these specimens include: (i) fillets at the V-notches, caused by excess solder; (ii) offset between the two copper platens along the loading direction; (iii) taper of the solder joint due to lack of parallelism of the edges of the copper platens; and (iv) misalignment between the specimen centerline and loading axis of the TMM test frame due to mounting variability. Detailed parametric studies of these four dimensional variations in the TMM specimen are conducted using a simple two-dimensional elastic-plastic finite element model. The uniformity of the shear stress field in the specimen is investigated and the variation in the derived stress-strain curves is examined, as a function of the dimensional variabilities described above.

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