The effect of anodic coating on the creep behavior of strong aluminum alloys

1974 ◽  
Vol 5 (9) ◽  
pp. 2103-2104 ◽  
Author(s):  
Abir Arbel ◽  
MENahem Nathan
Keyword(s):  
Aluminum Alloys ◽  
Creep Behavior ◽  
Anodic Coating

scholarly journals Microstructure and impression creep characteristics Al-9Si-xCu aluminum alloys

10.30544/101 ◽  
2015 ◽  
Vol 21 (2) ◽  
pp. 115-126 ◽  
Author(s):  
Mohsen Yousefi ◽  
Mehdi Dehnavi ◽  
S.M. Miresmaeili
Keyword(s):  
Activation Energy ◽  
Aluminum Alloys ◽  
Intermetallic Compound ◽  
Stress Exponent ◽  
Creep Behavior ◽  
Eutectic Phase ◽  
Dislocation Creep ◽  
Impression Creep ◽  
Pipe Diffusion ◽  
Creep Characteristics

The effects of 1.5, 2.5 and 3.5 wt.% Cu additions on the microstructure and creep behavior of the as-cast Al-9Si alloy were investigated by impression tests. The tests were performed at temperature ranging from 493 to 553 K and under punching stresses in the range 300 to 414 MPa for dwell times up to 3000 seconds. The results showed that, for all loads and temperatures, the Al–9Si–3.5Cu alloy had the lowest creep rates and thus, the highest creep resistance among all materials tested. This is attributed to the formation of hard intermetallic compound of Al2Cu, and higher amount of α-Al2Cu eutectic phase. The stress exponent and activation energy are in the ranges of 5.2- 7.2 and 115 -150 kJ/ mol, respectively for all alloys. According to the stress exponent and creep activation energies, the lattice and pipe diffusion- climb controlled dislocation creep were the dominant creep mechanism.

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