Effect of grain boundary chemistry on the intergranular fracture of iron at cathodic potentials

1981 ◽  
Vol 12 (9) ◽  
pp. 1621-1629 ◽  
Author(s):  
R. H. Jones ◽  
S. M. Bruemmer ◽  
M. T. Thomas ◽  
D. R. Baer
Keyword(s):  
Grain Boundary ◽  
Intergranular Fracture ◽  
Boundary Chemistry

Intergranular fracture and grain boundary chemistry of Ni3Al and Ni3Si

1985 ◽  
Vol 19 (4) ◽  
pp. 551-556 ◽  
Author(s):  
T. Takasugi ◽  
E.P. George ◽  
D.P. Pope ◽  
O. Izumi
Keyword(s):  
Grain Boundary ◽  
Intergranular Fracture ◽  
Boundary Chemistry

Brittle fracture and grain boundary chemistry of microalloyed NiAl

1990 ◽  
Vol 5 (4) ◽  
pp. 754-762 ◽  
Author(s):  
E. P. George ◽  
C. T. Liu
Keyword(s):  
Solid Solution ◽  
Yield Strength ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Intergranular Fracture ◽  
Fracture Mode ◽  
Tensile Ductility ◽  
Hard Sphere Model ◽  
Strengthening Effect ◽  
Boundary Chemistry

The room-temperature tensile properties, fracture mode, and grain boundary chemistry of undoped stoichiometric NiAl, as well as NiAl doped with boron, carbon, and beryllium, have been investigated, Pure, stoichiometric NiAl fractures with limited tensile ductility in a predominantly intergranular manner. Auger analyses revealed that the grain boundaries in NiAl are extremely clean and free of any segregated impurities, indicating that they are intrinsically brittle. Boron, when added to stoichiometric NiAl at a bulk level of 300 wt. ppm, segregates to the grain boundaries and suppresses intergranular fracture. However, there is no attendant improvement in tensile ductility because boron is an extremely potent solid solution strengthener in NiAl, more than doubling its yield strength. As a result, any potential benefit of improving grain boundary strength is more than offset by the increase in yield strength. Unlike boron, both carbon (300 ppm) and beryllium (500 ppm) are ineffective in suppressing intergranular fracture in NiAl, and Auger analyses of the C-doped alloy revealed that carbon did not affect the fracture mode because it did not segregate to the grain boundaries. Although neither beryllium nor carbon suppressed grain boundary fracture, their effects on the tensile ductility of NiAl were quite different: the ductility of the Be-doped alloy was higher than that of the B-doped alloy because beryllium, unlike boron, has a rather modest strengthening effect in NiAl, whereas the C-doped alloy was brittle like the B-doped alloy, because carbon is a potent solid solution strengthener, just like boron. These observations were rationalized by considering a hard-sphere model for interstitial and substitutional sites in NiAl. It was concluded that boron and carbon occupy interstitial sites, whereas beryllium dissolves substitutionally. In all the alloys that were investigated, the Ni and Al contents of the grain boundaries were not significantly different from the bulk levels, and no evidence was found for B–Ni cosegregation.

Morphology and atomic structure of segregated grain boundaries in Cu-Sb

1992 ◽  
Vol 50 (1) ◽  
pp. 254-255
Author(s):  
R. W. Fonda ◽  
D. E. Luzzi
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Intergranular Fracture ◽  
Atomic Structure ◽  
Copper Alloys ◽  
Polycrystalline Materials ◽  
Grain Boundary Embrittlement ◽  
Boundary Embrittlement

The properties of polycrystalline materials are strongly dependant upon the strength of internal boundaries. Segregation of solute to the grain boundaries can adversely affect this strength. In copper alloys, segregation of either bismuth or antimony to the grain boundary will embrittle the alloy by facilitating intergranular fracture. Very small quantities of bismuth in copper have long been known to cause severe grain boundary embrittlement of the alloy. The effect of antimony is much less pronounced and is observed primarily at lower temperatures. Even though moderate amounts of antimony are fully soluble in copper, concentrations down to 0.14% can cause grain boundary embrittlement.

Effect of thermal annealing on grain boundary chemistry of polycrystalline TiBa2Ca2Cu3Oy films

1994 ◽  
Vol 52 ◽  
pp. 968-969
Author(s):  
Z. L. Wang ◽  
C. L. Briant ◽  
J. DeLuca ◽  
A. Goyal ◽  
D. M. Kroeger ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Weak Link ◽  
Zero Field ◽  
Stabilized Zirconia ◽  
Local Texture ◽  
Transmission Electron ◽  
Axis Alignment ◽  
Boundary Chemistry ◽  
Small Misorientation ◽  
Misorientation Angles

Recent studies have shown that spray-pyrolyzed films of the Tl-1223 compound (TlxBa2Ca2Cu3Oy, with 0.7 < × < 0.95) on polycrystalline yttrium stabilized zirconia substrates can be prepared which have critical current density Jc near 105 A/cm2 at 77 K, in zero field. The films are polycrystalline, have excellent c-axis alignment, and show little evidence of weak-link behavior. Transmission electron microscopy (TEM) studies have shown that most grain boundaries have small misorientation angles. It has been found that the films have a nigh degree of local texture indicative of colonies of similarly oriented grains. It is believed that inter-colony conduction is enhanced by a percolative network of small angle boundaries at colony interfaces. It has also been found that Jc is increased by a factor of 4 - 5 after the films were annealed at 600 °C in oxygen. This study is thus carried out to determine the effect on grain boundary chemistry of the heat treatment.

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