Melanin granule model for laser-induced thermal damage in the retina

1996 ◽  
Vol 58 (3) ◽  
pp. 513-553 ◽  
Author(s):  
C. R. Thompson ◽  
B. S. Gerstman ◽  
S. L. Jacques ◽  
M. E. Rogers
Keyword(s):  
Thermal Damage ◽  
Melanin Granule

scholarly journals Melanin granule model for laser-induced thermal damage in the retina

1996 ◽  
Vol 58 (4) ◽  
pp. 809-810 ◽  
Author(s):  
C. R. Thompson ◽  
B. S Gerstman ◽  
S. L. Jacques ◽  
M. E. Rogers
Keyword(s):  
Thermal Damage ◽  
Melanin Granule

Modelling of the laser spot size dependence of retinal thermal damage

2005 ◽  
Author(s):  
Karl Schulmeister ◽  
Bernhard Seiser ◽  
Florian Edthofer ◽  
David J. Lund
Keyword(s):  
Size Dependence ◽  
Thermal Damage ◽  
Spot Size ◽  
Laser Spot ◽  
Laser Spot Size

Experimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography

2014 ◽  
Vol 1038 ◽  
pp. 75-81
Author(s):  
Bernd Niese ◽  
Philipp Amend ◽  
Uwe Urmoneit ◽  
Stephan Roth ◽  
Michael Schmidt
Keyword(s):  
Thermal Damage ◽  
Laser Sintering ◽  
Conductive Adhesive ◽  
Flexible Production ◽  
Sintering Process ◽  
Building Process ◽  
In Situ Generation ◽  
Functional Components

Embedding stereolithography (eSLA) is an additive, hybrid process, which provides a flexible production of 3D components and the ability to integrate electrical and optical conductive structures and functional components within parts. However, the embedding of conductive circuits in stereolithography (SLA) parts assumes usage of process technologies, which enables their direct integration of conductive circuits during the layer-wise building process. In this context, a promising method for in-situ generation of conductive circuits is dispensing of conductive adhesive on the current surface of the SLA part and its subsequent sintering. In this paper, the laser sintering (λ = 355 nm) of conductive adhesive mainly consisting of silver nanoparticles is investigated. The work intends to evaluate the curing behavior of the conductive adhesive, the beam-matter-interactions and the thermal damage of the SLA substrate. The investigations revealed a fast and flexible laser sintering process for the generation of conductive circuits with sufficient electrical conductivity and sufficient current capacity load. In this context, a characterization of the conductive structures is done by measuring their electrical resistance and their potential current capacity load.

Influences of thermal damage on water transport in heat-treated cement mortar: Experimental and theoretical analyses

2021 ◽  
Vol 288 ◽  
pp. 123100
Author(s):  
Shanbin Xue ◽  
Peng Zhang ◽  
Junjie Wang ◽  
Jiuwen Bao ◽  
Songbai Han ◽  
...  
Keyword(s):  
Water Transport ◽  
Thermal Damage ◽  
Cement Mortar ◽  
Heat Treated ◽  
Theoretical Analyses

scholarly journals Reactive eccrine syringofibroadenoma triggered by thermal damage: case report

2021 ◽  
Author(s):  
Roberto Rheingantz da Cunha Filho ◽  
Lucas José Quioca ◽  
Graziela Junges Crescente Rastelli ◽  
José Fillus Neto
Keyword(s):  
Case Report ◽  
Thermal Damage

scholarly journals Anti-Reflection Nanostructures on Tempered Glass by Dynamic Beam Shaping

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 289
Author(s):  
Petr Hauschwitz ◽  
Jan Brajer ◽  
Danijela Rostohar ◽  
Jaromír Kopeček ◽  
Tomáš Mocek ◽  
...  
Keyword(s):  
Mobile Phones ◽  
Thermal Damage ◽  
Pulsed Laser ◽  
Processing Parameters ◽  
Beam Shaping ◽  
Separation Distance ◽  
Tempered Glass ◽  
Fundamental Wavelength ◽  
Speed Up ◽  
Scanning Head

Reflectivity and surface topography of tempered glass were modified without any thermal damage to the surroundings by utilizing 1.7 ps ultrashort pulsed laser on its fundamental wavelength of 1030 nm. To speed up the fabrication, a dynamic beam shaping unit combined with a galvanometer scanning head was applied to divide the initial laser beam into a matrix of beamlets with adjustable beamlets number and separation distance. By tuning the laser and processing parameters, reflected intensity can be reduced up to 75% while maintaining 90% of transparency thus showing great potential for display functionalization of mobile phones or laptops.

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