Error analysis and thermal expansion measurement with electron-beam moiré

1998 ◽  
Vol 38 (3) ◽  
pp. 167-171 ◽  
Author(s):  
J. R. Berger ◽  
E. S. Drexler ◽  
D. T. Read
Keyword(s):  
Thermal Expansion ◽  
Electron Beam ◽  
Error Analysis ◽  
Thermal Expansion Measurement ◽  
Electron Beam Moiré

Determination of Poisson's Ratio of Thin low-k Films using Bidirectional Thermal Expansion Measurement

2006 ◽  
Vol 914 ◽  
Author(s):  
Jiping Ye ◽  
Satoshi Shimizu ◽  
Shigeo Sato ◽  
Nobuo Kojima ◽  
Junnji Noro
Keyword(s):  
Thermal Expansion ◽  
Temperature Gradient ◽  
Young’S Modulus ◽  
Poisson’S Ratio ◽  
Silicon Oxide ◽  
Young's Modulus ◽  
Polymer Materials ◽  
Poisson's Ratio ◽  
Thermal Expansion Measurement ◽  
Low K

AbstractA recently developed bidirectional thermal expansion measurement (BTEM) method was applied to different types of low-k films to substantiate the reliability of the Poisson's ratio found with this technique and thereby to corroborate its practical utility. In this work, the Poisson's ratio was determined by obtaining the temperature gradient of the biaxial thermal stress from substrate curvature measurements, the temperature gradient of the whole thermal expansion strain along the film thickness from x-ray reflectivity (XRR) measurements, and reduced modulus of the film from nanoindentation measurements. For silicon oxide-based SiOC film having a thickness of 382.5 nm, the Poisson's ratio, Young's modulus and thermal extension coefficient (TEC) were determined to be Vf = 0.26, αf =21 ppm/K and Ef =9,7 GPa. These data are close to the levels of metals and polymers rather than the levels of fused silicon oxide, which is characterized by Vf = 0.17 and Er = 69.6 GPa. The alkyl component in the silicon oxide-based framework is thought to act as an agent in reducing the modulus and elevating the Poisson's ratio in SiOC low-k materials. In the case of an organic polymer SiLK film with a thickness of 501.5 nm, the Poisson's ratio, Young's modulus and TEC were determined to be Vf = 0.39, αf =74 ppm/K and Er =3.1 GPa, which are in the typical range of V= 0.34~0.47 with E =1.0~10 GPa for polymer materials. From the viewpoint of the relationship between the Poisson's ratio and Young's modulus as classified by different material types, the Poisson's ratios found for the silicon oxide-based SiOC and organic SiLK films are reasonable values, thereby confirming that BTEM is a reliable and effective method for evaluating the Poisson's ratio of thin films.

Thermal expansion measurement on R2Fe17C1 compounds

1992 ◽  
Vol 115 (2-3) ◽  
pp. 260-264 ◽  
Author(s):  
T.H. Jacobs ◽  
K.H.J. Buschow ◽  
H. Müller ◽  
R. Grössinger
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Measurement

Optical temperature sensor and thermal expansion measurement using a femtosecond micromachined grating in 6H-SiC

2008 ◽  
Vol 47 (21) ◽  
pp. 3773 ◽  
Author(s):  
G. Logan DesAutels ◽  
Peter Powers ◽  
Chris Brewer ◽  
Mark Walker ◽  
Mark Burky ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Temperature Sensor ◽  
Thermal Expansion Measurement ◽  
Optical Temperature Sensor

Measurement of electron beam moire fringes with pulsed-dilation framing camera using different lasers

Optik ◽  
2019 ◽  
Vol 195 ◽  
pp. 163149
Author(s):  
Yanli Bai ◽  
Rongbin Yao ◽  
Haiying Gao ◽  
Xun Wang ◽  
Dajian Liu
Keyword(s):  
Electron Beam ◽  
Moiré Fringes ◽  
Framing Camera ◽  
Electron Beam Moiré

Analysis of an extraordinary electron beam moiré phenomena in a pulse-dilation framing camera

Optik ◽  
2019 ◽  
Vol 199 ◽  
pp. 163516
Author(s):  
Yanli Bai ◽  
Rongbin Yao ◽  
Haiying Gao ◽  
Xun Wang ◽  
Dajian Liu
Keyword(s):  
Electron Beam ◽  
Framing Camera ◽  
Electron Beam Moiré
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