Electronic speckle pattern interferometry analysis of tensile tests of semihard copper sheets

2001 ◽  
Vol 41 (1) ◽  
pp. 58-62 ◽  
Author(s):  
C. Vial-Edwards ◽  
I. Lira ◽  
A. Martinez ◽  
M. Münzenmayer
Keyword(s):  
Speckle Pattern ◽  
Tensile Tests ◽  
Electronic Speckle Pattern Interferometry

Silicon-Framed Tensile Specimens: Techniques and Results

1998 ◽  
Vol 518 ◽  
Author(s):  
D. T. Read
Keyword(s):  
Thin Films ◽  
Silicon Substrate ◽  
Bulk Material ◽  
Speckle Pattern ◽  
Maximum Load ◽  
Tensile Tests ◽  
Tensile Specimen ◽  
Electronic Speckle Pattern Interferometry ◽  
Epitaxial Silicon ◽  
Young’S Moduli

AbstractThe silicon-framed tensile specimen design has been used in tensile tests of thin films of a variety of metals and epitaxial silicon. A piezo-actuated microtensile test device holds the specimen while the silicon frame is cut just before testing, imposes the tensile displacement, and provides voltages proportional to force and displacement. This technique is appropriate for films that are hundreds of micrometers long, tens to a few hundred micrometers wide, and from 0.3 to 15 micrometers thick. The specimen film must be amenable to lithographic patterning, must adhere well to the silicon substrate, and must resist a silicon etchant. The specimen fabrication is a bulk-micromachining process, because the silicon substrate is etched through underneath the specimen film. Uniaxial yield strength, ultimate tensile strength, and elongation to maximum load can be measured using the microtensile tester. The addition of laser illumination and digital photography allows implementation of electronic speckle pattern interferometry, for accurate measurement of local displacement. This addition allows evaluation of the tensile Young's modulus. Compared to bulk material, thin films of copper and aluminum have lower apparent Young's moduli, higher yield and ultimate tensile strengths because of their fine grain size, and lower elongation to failure. Correlation between properties measured by indentation and by tensile testing needs further study.

3-D ESPI Measurements Applied to Selected Engineering Problems

2016 ◽  
Vol 827 ◽  
pp. 65-68 ◽  
Author(s):  
Radim Halama ◽  
Lukáš Horňáček ◽  
Luboš Pečenka ◽  
Martin Krejsa ◽  
Jiří Šmach
Keyword(s):  
Shear Strain ◽  
Experimental Analysis ◽  
Poisson Ratio ◽  
Speckle Pattern ◽  
Tensile Tests ◽  
Material Testing ◽  
Electronic Speckle Pattern Interferometry ◽  
Engineering Problems ◽  
Structural Parts

The presented paper introduces the application of the Electronic Speckle Pattern Interferometry (ESPI) technique for measurements of contours of strains and stresses on 3-D surfaces. The paper focuses on three selected applications. Firstly, the methodology for determining the Poisson ratio of a material from tensile tests is described. Secondly, results of calibration verification of a biaxial extensometer used for measurements of shear strain in comparison with the ESPI measurements are presented. Finally, the experimental analysis of stresses in welds is discussed. As mentioned in the paper, the method is very useful for material testing, as well as for measurements on structural parts in service.

Thermal strain analysis of composite materials by electronic speckle pattern interferometry

2000 ◽  
Vol 14 (5) ◽  
pp. 477-482 ◽  
Author(s):  
Koung Suk Kim ◽  
Wan Shik Jang ◽  
Myung Seak Hong ◽  
Ki Soo Kang ◽  
Hyun Chul Jung ◽  
...  
Keyword(s):  
Composite Materials ◽  
Speckle Pattern ◽  
Thermal Strain ◽  
Strain Analysis ◽  
Electronic Speckle Pattern Interferometry
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