Whole-field strain measurement in a pin-loaded plate by electronic speckle pattern interferometry and the finite element method

1998 ◽  
Vol 38 (1) ◽  
pp. 55-60 ◽  
Author(s):  
F. Lanza di Scalea ◽  
S. S. Hong ◽  
G. L. Cloud
1983 ◽  
Vol 18 (2) ◽  
pp. 135-141 ◽  
Author(s):  
U C Jindal

The stress concentration around a circular hole in a plate can be reduced by up to 21 per cent by introducing auxiliary holes on either side of the original hole. But this approach of auxiliary holes creates two more regions of stress concentration in the plate. In the present study, the hole geometry has been modified to effect stress reductions as high as 22 per cent. The problem has been analysed numerically by the finite element method and experimentally by two-dimensional photoelasticity. It has been observed that by making the hole oblong in the direction of loading, a high order of reduction in stress concentration around the hole can be obtained.


2011 ◽  
Vol 70 ◽  
pp. 399-404
Author(s):  
Wei Chung Wang ◽  
Ting Ying Wu

In this paper, the electronic speckle pattern interferometry (ESPI) and the finite element method (FEM) were used to obtain the thermal deformation induced in a centrally supported thermoelectric cooler (TEC). The results of ESPI and FEM are in good agreement and show that the warpage varies linearly with respect to the temperature difference between the two ceramic plates inside the TEC.


Nanoscale ◽  
2019 ◽  
Vol 11 (43) ◽  
pp. 20868-20875 ◽  
Author(s):  
Junxiong Guo ◽  
Yu Liu ◽  
Yuan Lin ◽  
Yu Tian ◽  
Jinxing Zhang ◽  
...  

We propose a graphene plasmonic infrared photodetector tuned by ferroelectric domains and investigate the interfacial effect using the finite element method.


Sign in / Sign up

Export Citation Format

Share Document