The use of point and line heat sources for measuring thermophysical quantities of plane-parallel plates and thin films

1965 ◽  
Vol 15 (12) ◽  
pp. 865-882 ◽  
Author(s):  
J. Krempaský
Keyword(s):  
Thin Films ◽  
Heat Sources ◽  
Parallel Plates ◽  
Plane Parallel

Turbulent Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources

1994 ◽  
Vol 116 (3) ◽  
pp. 577-587 ◽  
Author(s):  
S. H. Kim ◽  
N. K. Anand
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Electronic Equipment ◽  
Turbulent Heat Transfer ◽  
Turbulent Heat ◽  
Computational Domain ◽  
Heat Sources ◽  
Parallel Plates ◽  
Wide Range ◽  
Independent Parameters

Two-dimensional turbulent heat transfer between a series of parallel plates with surface mounted discrete block heat sources was studied numerically. The computational domain was subjected to periodic conditions in the streamwise direction and repeated conditions in the cross-stream direction (Double Cyclic). The second source term was included in the energy equation to facilitate the correct prediction of a periodically fully developed temperature field. These channels resemble cooling passages in electronic equipment. The k–ε model was used for turbulent closure and calculations were made for a wide range of independent parameters (Re, Ks/Kf, s/w, d/w, and h/w). The governing equations were solved by using a finite volume technique. The numerical procedure and implementation of the k–ε model was validated by comparing numerical predictions with published experimental data (Wirtz and Chen, 1991; Sparrow et al., 1982) for a single channel with several surface mounted blocks. Computations were performed for a wide range of Reynolds numbers (5 × 104–4 × 105) and geometric parameters and for Pr = 0.7. Substrate conduction was found to reduce the block temperature by redistributing the heat flux and to reduce the overall thermal resistance of the module. It was also found that the increase in the Reynolds number decreased the thermal resistance. The study showed that the substrate conduction can be an important parameter in the design and analysis of cooling channels of electronic equipment. Finally, correlations for the friction factor (f) and average thermal resistance (R) in terms of independent parameters were developed.

Influence of multiple reflections on the transmissioncoefficients of uniaxial plane-parallel plates

2021 ◽  
Author(s):  
German Caro ◽  
Veiras F. E. ◽  
Eduardo Acosta ◽  
Liliana Perez
Keyword(s):  
Parallel Plates ◽  
Multiple Reflections ◽  
Plane Parallel

Correction possibilities of a component consisting of three cemented plane-parallel plates

1999 ◽  
Vol 66 (2) ◽  
pp. 146 ◽  
Author(s):  
G. I. Gresukh ◽  
S. A. Stepanov ◽  
E. G. Ezhov
Keyword(s):  
Parallel Plates ◽  
Plane Parallel

On Some Laminar Forced-Convection Problems

1961 ◽  
Vol 83 (4) ◽  
pp. 466-472 ◽  
Author(s):  
L. N. Tao
Keyword(s):  
Temperature Gradient ◽  
Laminar Flow ◽  
Complex Variables ◽  
Heat Sources ◽  
Parallel Plates ◽  
Constant Wall Temperature ◽  
Circular Tubes ◽  
Laminar Forced Convection ◽  
Connection Problems

The forced-connection problems in channels of fully developed laminar flow with heat sources and constant wall-temperature gradient are approached by the method of complex variables. It is shown that the stated problems are reduced to the determination of some analytic functions which satisfy the boundary conditions. Few basic problems, including flows in equilateral triangular ducts and in elliptical tubes, are studied. Also, it is shown that the cases of circular tubes and of parallel plates with a gap are directly deducible from that of elliptical tubes. All these solutions are expressed in closed forms by polynomials.

Young interference through transparent plane parallel plates

2001 ◽  
Author(s):  
Lia M. Zerbino ◽  
Mario Garavaglia
Keyword(s):  
Parallel Plates ◽  
Plane Parallel
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