The high temperature transition of polyethylene into a Condis phase, described on the basis of the cluster-entropy hypothesis (CEH)

1986 ◽  
Vol 264 (5) ◽  
pp. 415-422 ◽  
Author(s):  
H. P. Grossmann ◽  
W. R. Pechhold
Keyword(s):  
High Temperature ◽  
Temperature Transition ◽  
Condis Phase

Viscoelastic Behavior of Segmented Elastomers

1967 ◽  
Vol 40 (4) ◽  
pp. 1105-1110 ◽  
Author(s):  
Stuart L. Cooper ◽  
Arthur V. Tobolsky
Keyword(s):  
Hydrogen Bonding ◽  
Glass Transition ◽  
High Temperature ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Viscoelastic Behavior ◽  
Temperature Transition ◽  
Hydrogen Bonding Interactions ◽  
Structural Nature ◽  
Hard Segments

Abstract Viscoelastic behavior of linear segmented elastomers was examined. The unusual properties found in spandex systems are also observable in hydrocarbon block co-polymers, indicating that hydrogen bonding interactions are perhaps not essential. Low temperature properties of segmented systems are governed by the structural nature of the associated flexible segments, which determines the value of the major glass transition temperature (Tg). It appears that an association of the hard segments provides a broad temperature range of enhanced rubbery modulus. This occurs between the major Tg and a secondary high temperature transition.

High temperature transition in oligourethanes

1972 ◽  
Vol 14 (6) ◽  
pp. 1581-1587 ◽  
Author(s):  
V.F. Shumskii ◽  
S.A. Zubko ◽  
N.I. Litsov ◽  
L.V. Khailenko ◽  
Yu.S. Lipatov
Keyword(s):  
High Temperature ◽  
Temperature Transition

The ?-? high-temperature transition of CaF2

1977 ◽  
Vol 64 (4) ◽  
pp. 221-221 ◽  
Author(s):  
P. W. Mirwald
Keyword(s):  
High Temperature ◽  
Temperature Transition

Some thermodynamic aspects of the high-temperature transition in doped V2O3

1980 ◽  
Vol 1 (2) ◽  
pp. 185-194 ◽  
Author(s):  
G. M. Joshi ◽  
H. V. Keer ◽  
J. M. Honig
Keyword(s):  
High Temperature ◽  
Temperature Transition

Dynamic Mechanical Analysis (DMA) of CMP pad materials

2000 ◽  
Vol 613 ◽  
Author(s):  
Irene Li ◽  
Kersten M. Forsthoefel ◽  
Kathleen A. Richardson ◽  
Yaw S. Obeng ◽  
William G. Easter ◽  
...  
Keyword(s):  
High Temperature ◽  
Dynamic Mechanical Analysis ◽  
Semiconductor Industry ◽  
Polymer Network ◽  
Chemical Exposure ◽  
Mechanical Analysis ◽  
Process Conditions ◽  
Temperature Transition ◽  
Basic Oxide ◽  
Dynamic Mechanical

ABSTRACTIn the semiconductor industry, there is a need to establish fundamental, mechanism-based, correlation(s) between process conditions, consumables (e.g., pads and slurries), and observed process performance in Chemical-Mechanical Polishing (CMP). In this paper, we present recent results of studies on polyurethane-based CMP pads in static and dynamic conditions using Dynamic Mechanical Analysis (DMA) to monitor modulus and energy damping changes. Two-layered, composite IC1000 on Suba IV pads, [IC1000 (cast and cured polyurethane elastomer) / Suba IV (polyurethane impregnated polyester felt)], were analyzed: prior to use (fresh); after a 24-hr soak in silica-containing oxide slurry (basic); and after oxide polishing (used). Upon comparison it was observed that a characteristic transition feature due to water is present at sub-ambient temperatures in both the slurry soaked and used pads. Exposure of as-received pads to basic oxide slurry results in a broad, high temperature transition thought to be the result of chemical-induced disruption of macrostructural units. Polishing (load-enhanced chemical exposure) introduces further changes to the polymer network represented by an apparent degradation to the structural species responsible for the high temperature transition in Suba IV.

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