Time and temperature dependence of the specific heat of non-crystalline solids within the tunneling model

1989 ◽  
Vol 76 (3) ◽  
pp. 283-288 ◽  
Author(s):  
Martin Deye ◽  
Pablo Esquinazi
Author(s):  
I. N. Ganiev ◽  
S. E. Otajonov ◽  
N. F. Ibrohimov ◽  
M. Mahmudov

In the heat «cooling» investigated the temperature dependence of the specific heat capacity and thermodynamic functions doped strontium alloy AK1М2 in the range 298,15—900 K. Mathematical models are obtained that describe the change in these properties of alloys in the temperature range 298.15—900 K, as well as on the concentration of the doping component. It was found that with increasing temperature, specific heat capacity, enthalpy and entropy alloys increase, and the concentration up to 0.5 wt.% of the alloying element decreases. Gibbs energy values have an inverse relationship, i.e., temperature — decreases the content of alloying component — is up to 0.5 wt.% growing.


2020 ◽  
Vol 2020 (1) ◽  
pp. 17-24 ◽  
Author(s):  
I. N. Ganiev ◽  
A. G. Safarov ◽  
F. R. Odinaev ◽  
U. Sh. Yakubov ◽  
K. Kabutov

2006 ◽  
Vol 600 (18) ◽  
pp. 3633-3636 ◽  
Author(s):  
S.P. Hepplestone ◽  
A.M. Ciavarella ◽  
C. Janke ◽  
G.P. Srivastava

1999 ◽  
Vol 103 (1-3) ◽  
pp. 2080 ◽  
Author(s):  
Nathanael A. Fortune ◽  
Guruswamy Rajaram ◽  
Keizo Murata

1993 ◽  
Vol 71 (18) ◽  
pp. 3031-3034 ◽  
Author(s):  
Th. Schmidt ◽  
J. Baak ◽  
D. A. van de Straat ◽  
H. B. Brom ◽  
S. Völker

2018 ◽  
Vol 924 ◽  
pp. 473-476
Author(s):  
Patrick Fiorenza ◽  
Marilena Vivona ◽  
Ferdinando Iucolano ◽  
Andrea Severino ◽  
Simona Lorenti ◽  
...  

We present a temperature-dependence electrical characterization of the oxide/semiconductor interface in MOS capacitors with a SiO2layer deposited on 4H-SiC using dichlorosilane and nitrogen-based vapor precursors. The post deposition annealing process in N2O allowed to achieve an interface state density Dit 9.0×1011cm-2eV-1below the conduction band edge. At room temperature, an electron barrier height (conduction band offset) of 2.8 eV was measured using the standard Fowler-Nordheim tunneling model. The electron conduction through the SiO2insulating layer was evaluated by studying the experimental temperature dependence of the gate current. In particular, the Fowler-Nordheim electron barrier height showed a negative temperature coefficient (dφB/dT= - 0.98 meV/°C), which is very close to the expected value for an ideal SiO2/4H-SiC system. This result, obtained for deposited SiO2layers, is an improvement compared to the values of the temperature coefficient of the Fowler-Nordheim electron barrier height reported for thermally grown SiO2. In fact, the smaller dependence ofφBon the temperature observed in this work represents a clear advantage of our deposited SiO2for the operation of MOSFET devices at high temperatures.


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