Microwave sintering of titanium diboride

1991 ◽  
Vol 26 (14) ◽  
pp. 3730-3738 ◽  
Author(s):  
C. E. Holcombe ◽  
N. L. Dykes
Keyword(s):  
Titanium Diboride ◽  
Microwave Sintering

Densification and grain growth during microwave sintering of titanium diboride

2013 ◽  
Vol 69 (8) ◽  
pp. 610-613 ◽  
Author(s):  
D. Demirskyi ◽  
J. Cheng ◽  
D. Agrawal ◽  
A. Ragulya
Keyword(s):  
Grain Growth ◽  
Titanium Diboride ◽  
Microwave Sintering

scholarly journals Microstructure and properties of the Nd2Fe14Bp/Al–Co composites fabricated via microwave sintering

2021 ◽  
Vol 10 ◽  
pp. 34-50
Author(s):  
G.R. Li ◽  
J.J. Chen ◽  
D. Zhang ◽  
H.M. Wang ◽  
M. Liu ◽  
...  
Keyword(s):  
Microwave Sintering ◽  
Microstructure And Properties

Making alloyed titanium diboride powders

1993 ◽  
Vol 32 (6) ◽  
pp. 480-483
Author(s):  
Yu. V. Levinskii ◽  
A. P. Petrov
Keyword(s):  
Titanium Diboride ◽  
Alloyed Titanium ◽  
Titanium Diboride Powders

scholarly journals Microwave Sintering and Microwave Dielectric Properties of (1–x)Ca0.61La0.26TiO3-xNd(Mg0.5Ti0.5)O3 Ceramics

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 438
Author(s):  
Shuwei Yang ◽  
Bingliang Liang ◽  
Changhong Liu ◽  
Jin Liu ◽  
Caisheng Fang ◽  
...  
Keyword(s):  
Dielectric Properties ◽  
Mobile Communications ◽  
Sintering Temperature ◽  
Microwave Sintering ◽  
Microwave Dielectric Properties ◽  
Conventional Heating ◽  
Sintering Process ◽  
Microwave Dielectric ◽  
Sintering Time ◽  
Frequency Temperature

The (1–x)Ca0.61La0.26TiO3-xNd(Mg0.5Ti0.5)O3 [(1–x)CLT-xNMT, x = 0.35~0.60] ceramics were prepared via microwave sintering. The effects of sintering temperature and composition on the phase formation, microstructure, and microwave dielectric properties were investigated. The results show that the microwave sintering process requires a lower sintering temperature and shorter sintering time of (1–x)CLT-xNMT ceramics than conventional heating methods. All of the (1–x)CLT-xNMT ceramics possess a single perovskite structure. With the increase of x, the dielectric constant (ε) shows a downward trend; the quality factor (Qf) drops first and then rises significantly; the resonance frequency temperature coefficient (τf) keeps decreasing. With excellent microwave dielectric properties (ε = 51.3, Qf = 13,852 GHz, τf = −1.9 × 10−6/°C), the 0.65CLT-0.35NMT ceramic can be applied to the field of mobile communications.

scholarly journals Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

Materials ◽  
2021 ◽  
Vol 14 (4) ◽  
pp. 776
Author(s):  
Nur Syahirah Mohamad Zaimi ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Andrei Victor Sandu ◽  
Mohd Mustafa Al Bakri Abdullah ◽  
Norainiza Saud ◽  
...  
Keyword(s):  
Shear Strength ◽  
Composite Solder ◽  
Printed Circuit Board ◽  
Microwave Sintering ◽  
Copper Substrate ◽  
Bulk Diffusion ◽  
Circuit Board ◽  
Sac305 Solder ◽  
Lap Shear ◽  
Isothermal Ageing

This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.

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