Reaction of olefins with diazoacetic ester in presence of a copper sulfate catalyst

1960 ◽  
Vol 9 (5) ◽  
pp. 864-867 ◽  
Author(s):  
A. P. Meshcheryakov ◽  
I. E. Dolgii
Keyword(s):  
Copper Sulfate ◽  
Diazoacetic Ester

Unusual reaction of alkenylfurans with diazoacetic ester in the presence of copper sulfate

1971 ◽  
Vol 20 (7) ◽  
pp. 1496-1496
Author(s):  
O. M. Nefedov ◽  
V. M. Shostakovskii ◽  
M. Ya. Samoilova ◽  
M. I. Kravchenko
Keyword(s):  
Copper Sulfate ◽  
Unusual Reaction ◽  
Diazoacetic Ester

Fate and forms of Cu in a reservoir ecosystem following copper sulfate treatment (Saint Germain les Belles, France)

2003 ◽  
Vol 107 ◽  
pp. 1333-1336 ◽  
Author(s):  
E. Van Hullebusch ◽  
P. Chatenet ◽  
V. Deluchat ◽  
P. M. Chazal ◽  
D. Froissard ◽  
...  
Keyword(s):  
Copper Sulfate

Influence of Solvents on the Growth of Copper Sulfate Pentahydrate Single Crystals

2017 ◽  
Vol 13 (3) ◽  
pp. 81-94
Author(s):  
Tariq A. AL- Dhahir ◽  
◽  
Nabeel A. Bakr ◽  
Saja B. Mohammed
Keyword(s):  
Single Crystals ◽  
Copper Sulfate ◽  
Sulfate Pentahydrate ◽  
Copper Sulfate Pentahydrate ◽  
Influence Of Solvents

Characteristics of copper sulfide nanoparticles obtained in the copper sulfate—sodium thiosulfate system

2017 ◽  
Vol 58 (7) ◽  
pp. 1421-1428
Author(s):  
K. S. Murasheva ◽  
◽  
S. V. Saikova ◽  
S. A. Vorobiev ◽  
A. S. Romanchenko ◽  
...  
Keyword(s):  
Copper Sulfate ◽  
Copper Sulfide ◽  
Sodium Thiosulfate

Whisker Formation in Copper Electroplating

2011 ◽  
Author(s):  
Theresa Han ◽  
Eunin Cho ◽  
Jinwoo Heo ◽  
Seoung Jae Lee
Keyword(s):  
Copper Sulfate ◽  
Surface Stress ◽  
Whisker Formation ◽  
Printed Wiring Boards ◽  
Copper Electroplating ◽  
Cu Electroplating ◽  
Solution Surface ◽  
Dry Film

Abstract In the manufacture of Printed Wiring Boards (PWB), unwelcome structures, such as nodules and whiskers can be formed during copper electroplating with copper sulfate. Copper (Cu) whiskers with lengths of up to a few hundred micrometers can lead to electrical shorts between layers or patterns. In this paper, we document factors that can affect the growth of Cu whiskers; decomposition of additives in the Cu electroplating solution, surface stress, acidic cleaner, and the ingredients of a dry film. Contaminants from outside of the electroplating bath and the ingredients of the dry film were shown as key components in the formation of Cu whiskers.

EFFECTS OF COPPER SULFATE TREATMENT ON EUTROPHIC URBAN LAKE PHYTOPLANKTON COMMUNITIES

2009 ◽  
Vol 33 (4) ◽  
pp. 596-602 ◽  
Author(s):  
Xiao-Li ZHAO ◽  
Li-Rong SONG ◽  
Xiao-Ming ZHANG
Keyword(s):  
Copper Sulfate ◽  
Urban Lake ◽  
Phytoplankton Communities
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