Edge crack problem in a semi-infinite FGM plate with a bi-directional coefficient of thermal expansion under two-dimensional thermal loading

2000 ◽  
Vol 144 (3-4) ◽  
pp. 211-229 ◽  
Author(s):  
M. Nemat-Alla ◽  
N. Noda
Keyword(s):  
Thermal Expansion ◽  
Edge Crack ◽  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Crack Problem ◽  
Two Dimensional ◽  
Edge Crack Problem

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

1999 ◽  
Vol 122 (2) ◽  
pp. 121-127 ◽  
Author(s):  
Manjula N. Variyam ◽  
Weidong Xie ◽  
Suresh K. Sitaraman
Keyword(s):  
Thermal Expansion ◽  
Electronic Packaging ◽  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Plane Deformation ◽  
Three Dimensional ◽  
Dissimilar Materials ◽  
3D Models ◽  
Material Behavior ◽  
Element Analysis

Components in electronic packaging structures are of different dimensions and are made of dissimilar materials that typically have time, temperature, and direction-dependent thermo-mechanical properties. Due to the complexity in geometry, material behavior, and thermal loading patterns, finite-element analysis (FEA) is often used to study the thermo-mechanical behavior of electronic packaging structures. For computational reasons, researchers often use two-dimensional (2D) models instead of three-dimensional (3D) models. Although 2D models are computationally efficient, they could provide misleading results, particularly under thermal loading. The focus of this paper is to compare the results from various 2D, 3D, and generalized plane-deformation strip models and recommend a suitable modeling procedure. Particular emphasis is placed to understand how the third-direction coefficient of thermal expansion (CTE) influences the warpage and the stress results predicted by 2D models under thermal loading. It is seen that the generalized plane-deformation strip models are the best compromise between the 2D and 3D models. Suitable analytical formulations have also been developed to corroborate the findings from the study. [S1043-7398(00)01402-X]

Effects of Imperfections on Bifurcation of Multi-Layer Microstructures of MEMS under Thermal Loading

2007 ◽  
Vol 339 ◽  
pp. 276-280
Author(s):  
Y.T. Yu ◽  
Wei Zheng Yuan ◽  
D.Y. Qiao
Keyword(s):  
Finite Element ◽  
Thermal Expansion ◽  
Finite Element Simulation ◽  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Element Simulation ◽  
Simulation Results ◽  
Structural Bifurcation

Bifurcation of multi-layer microstructures subjected to thermal loading can be harmful for reliability and stability of MEMS structures. In this paper, three imperfections of geometry, coefficient of thermal expansion and thermal loading were introduced to investigate their effects on structural bifurcation by finite element simulation. Results show that bifurcation is strongly influenced by the imperfections. With larger deviation of imperfections, it results in a decreasing temperature to trigger the bifurcation and a gradual beginning of it.

Edge-crack problem in a long cylindrical superconductor

2011 ◽  
Vol 109 (9) ◽  
pp. 093920 ◽  
Author(s):  
Jun Zeng ◽  
Hua-Dong Yong ◽  
You-He Zhou
Keyword(s):  
Edge Crack ◽  
Crack Problem ◽  
Edge Crack Problem

Study on the Thermal Cracking Processes of Composite Subjected to Thermal Loading

2012 ◽  
Vol 256-259 ◽  
pp. 2867-2870
Author(s):  
Shi Bin Tang ◽  
Zheng Zhao Liang ◽  
Ya Fang Zhang
Keyword(s):  
Thermal Expansion ◽  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Process Analysis ◽  
Failure Process ◽  
Thermal Cracking ◽  
The Matrix ◽  
Rock Failure Process ◽  
High Or Low Temperature ◽  
Radial Cracks

A numerical method RFPA-T (Thermal Induced Rock Failure Process Analysis) code is used to study the thermal cracking processes of quasi-brittle materials subjected to high or low temperature. The numerical results indicate that thermal stress concentrating along the interface between the matrix and the embedded grains due to their different coefficient of thermal expansion (CTE). The modeling results indicate that θ-crack is generated during temperature increment as the CTE of the embedded grain is smaller than that of the matrix. However, radial-cracks emerged when the temperature decrease. The results obtained from RFPA-T code show a good agreement with experimental evidence of crack patterns caused by thermal expansion mismatch.

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