Thermomechanical behavior of viscoelastic solids of revolution during axisymmetric harmonic deformation

1989 ◽  
Vol 25 (5) ◽  
pp. 443-448
Author(s):  
V. I. Kozlov ◽  
S. N. Yakimenko
Author(s):  
Tobias Mittereder ◽  
Bernhard Ferstl ◽  
Terry Heidmann ◽  
Christian Hollerith

Abstract Temperature-dependent die warpage measurements show the possibility to analyze the thermomechanical behavior during assembly, e.g. within soldering processes. The warpage data acquisition is realized by confocal chromatic white light profilometry in combination with a precision heating/cooling chuck encapsulated in a chamber with optical access. The combination of these two tools allows precise die warpage evaluation under varied device temperature up to +400°C. This method helps to solve emerging challenges due to warpage during assembly of state of the art packages including thin dies and stacked dies as in e.g. 3D-SIPs.


2018 ◽  
Vol 13 ◽  
pp. 781-786 ◽  
Author(s):  
Zhengkun Liu ◽  
Julian Roggel ◽  
Daniel Juhre

2019 ◽  
Vol 782 ◽  
pp. 1114-1120 ◽  
Author(s):  
Chi-Ming Wu ◽  
Yi-Jung Lu ◽  
Shyuan-Yow Chen ◽  
Shih-Cheng Wen ◽  
Chia-Hung Wu ◽  
...  

2020 ◽  
Vol 794 ◽  
pp. 139857 ◽  
Author(s):  
O. Karakoc ◽  
K.C. Atli ◽  
A. Evirgen ◽  
J. Pons ◽  
R. Santamarta ◽  
...  

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