Errors of a three-electrode capacitance transducer for thickness measurement on planar insulations

1973 ◽  
Vol 16 (5) ◽  
pp. 671-674
Author(s):  
A. N. Kartashova ◽  
V. V. Kryuchenkov
Keyword(s):  
Thickness Measurement ◽  
Capacitance Transducer ◽  
Electrode Capacitance

Simulation Study of Spiral Electrode Capacitance Sensor for Measuring Concentration of Gas-Solid Two-Phase Flow

2012 ◽  
Vol 508 ◽  
pp. 170-173
Author(s):  
Zhi Chun Wang ◽  
Wen Jing Zhang ◽  
Wen Tao Li
Keyword(s):  
Two Phase Flow ◽  
Natural World ◽  
Structural Parameter ◽  
Phase Flow ◽  
Solid Concentration ◽  
Complex Flow ◽  
Capacitance Sensor ◽  
Two Phase ◽  
Capacitance Transducer ◽  
Electrode Capacitance

Gas-sold two-phase flow is a typical and complex flow form in the natural world and the industrial process. The accurate measurement of the parameters is the key problem for improving the industry control quality and promoting enterprise economic benefit. Three-dimensional finite element simulation of spiral electrodes capacitance sensor was put up by ANSYS in this paper. The results from simulation show that spiral electrode capacitance sensor has an obvious advantage. The sensor has uniform sensing filled, and the capacitance value has nothing to do with flow pattern which is only related to solid concentration change. There is good linear correlation between capacitance value and solid concentration. Relationship graph between capacitance value and solid concentration was obtained by calculated. In addition, with the FEM the qualitative analyses to the effect of each structural parameter of the capacitance transducer on its capability were made. These can provide bases and supports for optimum design of this kind of sensors. Comparing with ECT, it is a simply and easy-implemented method of concentration measurement using spiral electrode capacitance sensor.

Thickness Measurement in the AEM by Macintosh-Based Analysis of Two-Beam Convergent Beam Patterns

1990 ◽  
Vol 48 (2) ◽  
pp. 504-505
Author(s):  
John F. Mansfield ◽  
Douglas C. Crawford
Keyword(s):  
Electron Microscope ◽  
Video Camera ◽  
Thickness Measurement ◽  
Specimen Thickness ◽  
Crystalline Materials ◽  
Beam Dynamic ◽  
Line Measurement ◽  
On Line ◽  
Image Position ◽  
Convergent Beam

A method has been developed that allows on-line measurement of the thickness of crystalline materials in the analytical electron microscope. Two-beam convergent beam electron diffraction (CBED) patterns are digitized from a JEOL 2000FX electron microscope into an Apple Macintosh II microcomputer via a Gatan #673 CCD Video Camera and an Imaging Systems Technology Video 1000 frame-capture board. It is necessary to know the lattice parameters of the sample since measurements are made of the spacing of the diffraction discs in order to calibrate the pattern. The sample thickness is calculated from measurements of the spacings of the fringes that are seen in the diffraction discs. This technique was pioneered by Kelly et al, who used the two-beam dynamic theory of MacGillavry relate the deviation parameter (Si) of the ith fringe from the exact Bragg condition to the specimen thickness (t) with the equation:Where ξg, is the extinction distance for that reflection and ni is an integer.

Intima-media thickness measurement of the carotid artery in patients with primary hyperparathyroidism

2015 ◽  
Author(s):  
Dilek Tuzun ◽  
Ayten Oguz ◽  
Murat Sahin ◽  
Safa Ersen Ganidagli ◽  
Didem Atay ◽  
...  
Keyword(s):  
Carotid Artery ◽  
Primary Hyperparathyroidism ◽  
Intima Media Thickness ◽  
Thickness Measurement ◽  
Media Thickness

Silicon Fringe Sample Metrology—A Thickness Measurement Technique

2013 ◽  
Author(s):  
Mark Kimball
Keyword(s):  
Temperature Dependence ◽  
Temperature Coefficient ◽  
Measurement Technique ◽  
Thickness Measurement ◽  
Sample Thickness ◽  
Index Of Refraction ◽  
Interference Fringes ◽  
Noncontact Method ◽  
Thickness Variations

Abstract Silicon’s index of refraction has a strong temperature coefficient. This temperature dependence can be used to aid sample thinning procedures used for backside analysis, by providing a noncontact method of measuring absolute sample thickness. It also can remove slope ambiguity while counting interference fringes (used to determine the direction and magnitude of thickness variations across a sample).

Application of EDS Technique for OSP Film Thickness Measurement

2006 ◽  
Author(s):  
Prong Kongsubto ◽  
Sirarat Kongwudthiti
Keyword(s):  
Thin Film ◽  
Quantitative Analysis ◽  
Joint Strength ◽  
Critical Factor ◽  
Thickness Measurement ◽  
Ic Manufacturing ◽  
And Control ◽  
Film Thickness Measurement ◽  
Non Destructive

Abstract Organic solderability preservatives (OSPs) pad is one of the pad finishing technologies where Cu pad is coated with a thin film of an organic material to protect Cu from oxidation during storage and many processes in IC manufacturing. Thickness of OSP film is a critical factor that we have to consider and control in order to achieve desirable joint strength. Until now, no non-destructive technique has been proposed to measure OSP thickness on substrate. This paper reports about the development of EDS technique for estimating OSP thickness, starting with determination of the EDS parameter followed by establishing the correlation between C/Cu ratio and OSP thickness and, finally, evaluating the accuracy of the EDS technique for OSP thickness measurement. EDS quantitative analysis was proved that it can be utilized for OSP thickness estimation.

Impacts of Sample Preparation Methodology on TEM Failure Analysis of Advanced Semiconductor Devices

2011 ◽  
Author(s):  
Yongkai Zhou ◽  
Jie Zhu ◽  
Han Wei Teo ◽  
ACT Quah ◽  
Lei Zhu ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Case Studies ◽  
Thickness Measurement ◽  
Interface Roughness ◽  
Silicide Formation ◽  
Cross Sectional ◽  
Inspection Method ◽  
Low Mass

Abstract In this paper, two failure analysis case studies are presented to demonstrate the importance of sample preparation procedures to successful failure analyses. Case study 1 establishes that Palladium (Pd) cannot be used as pre-FIB coating for SiO2 thickness measurement due to the spontaneously Pd silicide formation at the SiO2/Si interface. Platinum (Pt) is thus recommended, in spite of the Pt/SiO2 interface roughness, as the pre-FIB coating in this application. In the second case study, the dual-directional TEM inspection method is applied to characterize the profile of the “invisible” tungsten residue defect. The tungsten residue appears invisible in the planeview specimen due to the low mass-thickness contrast. It is then revealed in the cross-sectional TEM inspection.

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