Influence of hold time on carbide grain growth in TiC-Ni alloys

1989 ◽  
Vol 28 (8) ◽  
pp. 613-617 ◽  
Author(s):  
N. M. Volkova ◽  
T. A. Dudorova ◽  
Yu. G. Gurevich
Keyword(s):  
Grain Growth ◽  
Hold Time ◽  
Ni Alloys

Effect of phosphorous addition on the grain growth of Fe–50wt.%Ni alloys

2002 ◽  
Vol 47 (5) ◽  
pp. 321-326 ◽  
Author(s):  
Ming-Shuing Chuang ◽  
Shun-Tian Lin
Keyword(s):  
Grain Growth ◽  
Ni Alloys

Development of Growth Texture in Nanocrystalline Fe-Ni Alloys

2005 ◽  
Vol 495-497 ◽  
pp. 749-754 ◽  
Author(s):  
Chang Sik Ha ◽  
Yong Bum Park
Keyword(s):  
Energy Density ◽  
Grain Growth ◽  
Fibre Type ◽  
Texture Evolution ◽  
Orientation Dependence ◽  
Texture Development ◽  
Fibre Texture ◽  
Abnormal Growth ◽  
Ni Alloys ◽  
Texture Change

In electroformed pure Ni and Fe-Ni alloys with nanometer-sized crystallites, grain growth that takes place during annealing results in a common texture change. With regard to the macrotextures, the as-deposited textures were of fibre-type characterized by strong <100>//ND and weak <111>//ND components, and the texture development due to grain growth was defined by strong <111>//ND fibre texture with the minor <100>//ND components. It was clarified by means of the microtexture analysis that abnormal growth of the <111>//ND grains occurs in the early stages of grain growth. The possible effects of the abnormal grain growth on the texture evolution have been discussed in terms of the orientation dependence of energy density.

Abnormal Grain Growth during Annealing in Nanocrystalline Fe-Ni Alloys

2007 ◽  
Vol 558-559 ◽  
pp. 1279-1282 ◽  
Author(s):  
J.H. Seo ◽  
Jong Kweon Kim ◽  
Yong Bum Park
Keyword(s):  
Grain Growth ◽  
Fibre Type ◽  
Texture Evolution ◽  
Orientation Imaging Microscopy ◽  
Abnormal Grain Growth ◽  
Morphological Features ◽  
Ni Alloys ◽  
Early Stages ◽  
Orientation Imaging

The texture evolution due to grain growth that takes place during annealing was investigated in nanocrystalline Fe-Ni alloys fabricated by using an electroforming method. In the current materials, the as-deposited textures were of fibre-type characterized by strong <100>//ND and weak <111>//ND components, and the occurrence of grain growth during annealing resulted in the strong development of the <111>//ND components with a significant decrease of the <100>//ND components. It was clarified that abnormal grain growth plays an important role on the evolution of the microstructures and textures. The abnormally grown grains were observed using orientation imaging microscopy in the early stages of grain growth, and their morphological features have been discussed.

Formation of Multiple Twinned Structural Units in Electrodeposited Nickel after Annealing

2014 ◽  
Vol 783-786 ◽  
pp. 2573-2578 ◽  
Author(s):  
Alexander Kahrimanidis ◽  
Uta Klement
Keyword(s):  
Grain Growth ◽  
Growth Direction ◽  
Zone Axis ◽  
Organic Additives ◽  
Free Standing ◽  
Structural Units ◽  
Ni Alloys ◽  
Orientation Change ◽  
Control Film ◽  
Electrodeposited Nickel

Electrodeposition is an advanced synthesis technique which involves the creation of a coating or free-standing material through an electrolytic process. Organic additives such as saccharin have been frequently used in electroplating operations to moderate deposit growth rates and to control film quality. In the present study, plating of Nickel without additives has resulted in a sub-microcrystalline microstructure and a <110>-fibre texture in growth direction. Structural units in form of groups of grains possessing a common <110>-zone axis in growth direction and low-Σ relationships between them have been found in the microstructure by use of EBSD. Upon annealing, grain growth sets in. However, the structural units and the texture are preserved up to 550°C. This means that the structural units stabilize the microstructure; there is no orientation change when grain growth occurs (e.g. by twinning). The low-Σ boundaries of the structural units are described in detail and texture development upon annealing is discussed in connection with results from previous studies on Ni and Ni-alloys of different initial texture.

Atomic Study on Copper–Copper Bonding Using Nanoparticles

2020 ◽  
Vol 142 (2) ◽  
Author(s):  
Xiaohui Song ◽  
Rui Zhang ◽  
Huadong Zhao
Keyword(s):  
Grain Growth ◽  
Bonding Temperature ◽  
High Surface ◽  
Hold Time ◽  
External Pressure ◽  
Bonding Layer ◽  
Degree Of Deformation ◽  
Thermocompression Bonding ◽  
Higher Temperature ◽  
Effects Of Temperature

Abstract Thermocompression bonding of copper to copper using copper nanoparticles is studied using molecular dynamics. The bonding interface formation process is investigated frst. For the bonding process, the effects of temperature and external pressure are examined. Also, we examine the grain growth at the interface. The results show that the nanoparticles with high surface energy and low compressive strength provide the active atoms to bond with copper. Pressure determining the degree of deformation of nanoparticles transfers atoms from the interior to the surface of nanoparticles and provide more surface atom to form bonds with bulk copper. While continuous pressure increase does not help bonding, higher temperature will facilitate formation of vacancies by breaking the bonds and driving the metal atoms into these vacancies. In addition, a higher temperature promotes grain growth at the interface. These behaviors indicate that using nanoparticles as a bonding layer in metal bonding can effectively reduce bonding temperature and pressure. It is necessary to select appropriate pressure at initial bonding stage and provide continuous high-temperature hold time.

Textures and Grain Growth in Nanocrystalline Fe-Ni Alloys

2005 ◽  
pp. 3483-3488 ◽  
Author(s):  
J.H. Seo ◽  
Jong Kweon Kim ◽  
T.H. Yim ◽  
Yong Bum Park
Keyword(s):  
Grain Growth ◽  
Ni Alloys
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