Heat treatment of drill pipe of strength group D

Metallurgist ◽  
1989 ◽  
Vol 33 (11) ◽  
pp. 225-226 ◽  
Author(s):  
V. K. Chernykh ◽  
L. A. Pisareva ◽  
K. M. Pikalova ◽  
V. A. Rodikov
1983 ◽  
Vol 19 (2) ◽  
pp. 165-166
Author(s):  
A. I. Mikhel'man ◽  
Yu. D. Petrina ◽  
Yu. V. Zima ◽  
M. I. Savchuk

Metallurgist ◽  
1989 ◽  
Vol 33 (2) ◽  
pp. 44-45
Author(s):  
E. P. Mikhailova ◽  
L. V. Lovanova ◽  
I. G. Pogorelova

2008 ◽  
Vol 38 (5) ◽  
pp. 416-418
Author(s):  
E. S. Chernykh ◽  
P. Yu. Gorozhanin ◽  
S. Yu. Zhukova ◽  
V. M. Farber
Keyword(s):  

1963 ◽  
Vol 30 (1) ◽  
pp. 87-99 ◽  
Author(s):  
J. G. Franklin ◽  
M. Elisabeth Sharpe

SummaryThe numbers and types of non-starter lactic acid bacteria, lipolytic bacteria and group D streptococci in cheese milks and corresponding Cheddar cheeses have been studied and their relationship to cheese flavour discussed. Different milks, heat-treatments and starters were used, and their association with flavour investigated. The pH and fat, salt and moisture contents of the cheeses were also determined.The non-starter lactic acid flora consisted mainly of Lactobacillus casei, L. plantarum, L. brevis, L. buchnerii, Pediococcus spp. and Leuconostoc spp. Lactobacillus casei was nearly always present in the milks and cheeses, predominating in most of the cheeses, particularly in those made from milk which received the most severe of the three heat-treatments tested (160°F for 17 sec). Leuconostocs were not found in any of the cheeses. Other species sometimes occurred in approximately equal numbers to L. casei, particularly in cheeses manufactured from the milder heattreated milks. Cheeses made from milk receiving the highest heat-treatment contained fewest bacteria and scored lowest for flavour. The average flavour scores increased as the number of species contributing to the non-starter lactic acid flora at the time of tasting increased.The lipolytic organisms capable of hydrolysing butterfat consisted mainly of Gram-positive cocci, predominantly Staphylococcus saprophyticus. The group D streptococci occurred infrequently, Streptococcus faecium being the most commonly occurring species.A definite correlation was found to exist between the starters used and the flavour of the cheeses. The pH of the cheeses was associated with the flavour, but the fat, moisture and salt contents of the cheeses showed no definite effect.


Metallurgist ◽  
1987 ◽  
Vol 31 (10) ◽  
pp. 336-337
Author(s):  
Yu. V. Yakubovich ◽  
V. M. Khokhlov ◽  
I. G. Pogorelova

2012 ◽  
Vol 430-432 ◽  
pp. 636-639
Author(s):  
Zhang Zhi ◽  
Xiao Yu Zhou ◽  
De Zhi Zeng ◽  
Ji Yin Zhang ◽  
Tai He Shi

During the process of deep drilling with high temperature and high pressure, downhole drilling tools might be exposed to various corrosive mediums, such as water/oil-based drilling fluid systems, dissolved oxygen, H2S/CO2, halogen elements (Cl- and Br-), etc. Halogen elements existing in the drilling fluid are ions promoting corrosion of metals. This effect is mainly manifested in the forms of uniform corrosion, pitting corrosion, stress corrosion cracking, etc. of carbon steel. Quality of the drill pipe is determined by the DP body, joint and welding area of the drill pipe. Reasonable friction welding process and proper post weld heat treatment can make the mechanical property of weld joint satisfy related standards. If process of friction welding or post weld heat treatment is improper, the weld joint will be easily damaged and accidents of pricking, breaking, etc will be likely aroused. This paper carries out an evaluation experiment of chloride cracking on the DP body, joints and weld joints of the high-strength drill pipe (S135) and discusses corrosion of the high-strength drill pipe caused by chloride ions.


1972 ◽  
Vol 8 (1) ◽  
pp. 44-46
Author(s):  
M. M. Melikov ◽  
S. M. Gadzhibeklinskii ◽  
K. T. Aliev ◽  
Ya. B. Shlimak
Keyword(s):  

Author(s):  
R. M. Anderson

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.


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