TEM characterization of a rapidly solidified ultrafine Al-Cu alloy powder

1989 ◽  
Vol 8 (1) ◽  
pp. 86-90 ◽  
Author(s):  
J. Ng-Yelim ◽  
C. Roy ◽  
C. Morel
Keyword(s):  
Alloy Powder ◽  
Cu Alloy ◽  
Tem Characterization ◽  
Rapidly Solidified

Production and properties of rapidly solidified Al-4.5% Cu alloy powder by the rotating-water-atomization process

1985 ◽  
Vol 20 (6) ◽  
pp. 2148-2158 ◽  
Author(s):  
Itsuo Ohnaka ◽  
Isamu Yamauchi ◽  
Satoru Kawamoto ◽  
Tatsuichi Fukusako
Keyword(s):  
Alloy Powder ◽  
Atomization Process ◽  
Cu Alloy ◽  
Water Atomization ◽  
Rapidly Solidified

scholarly journals The Effect of Copper Content on Tensile Property of Rapidly Solidified Fe-Cu Alloy Powder Consolidated by Heavy Worm Rolling

2003 ◽  
Vol 50 (12) ◽  
pp. 1036-1040 ◽  
Author(s):  
Kazumi Minagawa ◽  
Hideki Kakisawa ◽  
Minoru Otaguchi ◽  
Yoshiaki Osawa ◽  
Susumu Takamori ◽  
...  
Keyword(s):  
Tensile Property ◽  
Alloy Powder ◽  
Copper Content ◽  
Cu Alloy ◽  
Effect Of Copper ◽  
Rapidly Solidified

TEM-characterization of rapidly solidified Nb-Al ribbons

1998 ◽  
Vol 361 (6-7) ◽  
pp. 656-659
Author(s):  
B. Arnold ◽  
Wolfgang Löser ◽  
Monika Leonhardt
Keyword(s):  
Tem Characterization ◽  
Rapidly Solidified

scholarly journals Microstructure and Characterization of Rapidly Solidified Fe–30Cr–5Al Alloy Powder

1992 ◽  
Vol 33 (8) ◽  
pp. 769-774
Author(s):  
Kiyoshi Mizuuchi ◽  
Yoshihira Okanda ◽  
Itsuo Ohnaka
Keyword(s):  
Alloy Powder ◽  
Rapidly Solidified

Microstructural Characterization of Rapidly Solidified Al-6.5%Si-4%Cu Alloy Powders Produced by Gas Atomization

2005 ◽  
Vol 24-25 ◽  
pp. 519-522
Author(s):  
C.F. Ferrarini ◽  
L.A. Bereta ◽  
Walter José Botta Filho ◽  
Claudio Shyinti Kiminami ◽  
Claudemiro Bolfarini
Keyword(s):  
Microstructural Characterization ◽  
Gas Atomization ◽  
Cu Alloy ◽  
Rapidly Solidified

Shock consolidation of Ni-Ti alloy powder

1986 ◽  
Vol 44 ◽  
pp. 430-431
Author(s):  
Naresh N. Thadhani ◽  
Thad Vreeland ◽  
Thomas J. Ahrens
Keyword(s):  
Alloy Powder ◽  
Amorphous Material ◽  
Ti Alloy ◽  
Two Phase ◽  
Near Surface ◽  
Optical Micrograph ◽  
Shock Compaction ◽  
Powder Particles ◽  
Ti Powder ◽  
Rapidly Solidified

A spherically-shaped, microcrystalline Ni-Ti alloy powder having fairly nonhomogeneous particle size distribution and chemical composition was consolidated with shock input energy of 316 kJ/kg. In the process of consolidation, shock energy is preferentially input at particle surfaces, resulting in melting of near-surface material and interparticle welding. The Ni-Ti powder particles were 2-60 μm in diameter (Fig. 1). About 30-40% of the powder particles were Ni-65wt% and balance were Ni-45wt%Ti (estimated by EMPA).Upon shock compaction, the two phase Ni-Ti powder particles were bonded together by the interparticle melt which rapidly solidified, usually to amorphous material. Fig. 2 is an optical micrograph (in plane of shock) of the consolidated Ni-Ti alloy powder, showing the particles with different etching contrast.

TEM characterization of proton-exchanged LiNbO3 optical waveguides

1986 ◽  
Vol 44 ◽  
pp. 480-481
Author(s):  
W. E. Lee
Keyword(s):  
Refractive Index ◽  
Benzoic Acid ◽  
Optical Waveguides ◽  
Total Internal Reflection ◽  
Index Of Refraction ◽  
Optical Measurements ◽  
Lithium Ions ◽  
Wide Channel ◽  
Tem Characterization

An optical waveguide consists of a several-micron wide channel with a slightly different index of refraction than the host substrate; light can be trapped in the channel by total internal reflection.Optical waveguides can be formed from single-crystal LiNbO3 using the proton exhange technique. In this technique, polished specimens are masked with polycrystal1ine chromium in such a way as to leave 3-13 μm wide channels. These are held in benzoic acid at 249°C for 5 minutes allowing protons to exchange for lithium ions within the channels causing an increase in the refractive index of the channel and creating the waveguide. Unfortunately, optical measurements often reveal a loss in waveguiding ability up to several weeks after exchange.

TEM characterization of WSix films

1994 ◽  
Vol 52 ◽  
pp. 848-849
Author(s):  
V. C. Kannan ◽  
S. M. Merchant ◽  
R. B. Irwin ◽  
A. K. Nanda ◽  
M. Sundahl ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Vapor Deposition ◽  
High Purity ◽  
Physical Vapor Deposition ◽  
Thermal Treatments ◽  
Rapid Thermal Anneal ◽  
Tungsten Silicide ◽  
Tem Characterization ◽  
Metal Silicides

Metal silicides such as WSi2, MoSi2, TiSi2, TaSi2 and CoSi2 have received wide attention in recent years for semiconductor applications in integrated circuits. In this study, we describe the microstructures of WSix films deposited on SiO2 (oxide) and polysilicon (poly) surfaces on Si wafers afterdeposition and rapid thermal anneal (RTA) at several temperatures. The stoichiometry of WSix films was confirmed by Rutherford Backscattering Spectroscopy (RBS). A correlation between the observed microstructure and measured sheet resistance of the films was also obtained.WSix films were deposited by physical vapor deposition (PVD) using magnetron sputteringin a Varian 3180. A high purity tungsten silicide target with a Si:W ratio of 2.85 was used. Films deposited on oxide or poly substrates gave rise to a Si:W ratio of 2.65 as observed by RBS. To simulatethe thermal treatments of subsequent processing procedures, wafers with tungsten silicide films were subjected to RTA (AG Associates Heatpulse 4108) in a N2 ambient for 60 seconds at temperatures ranging from 700° to 1000°C.

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