Investigation of three-dimensional temperature distribution at a crack in a plate

1974 ◽  
Vol 7 (5) ◽  
pp. 561-566
Author(s):  
S. Ya. Yarema ◽  
M. P. Savruk
Keyword(s):  
Temperature Distribution ◽  
Three Dimensional

Boundary Condition Design to Heat a Moving Object at Uniform Transient Temperature Using Inverse Formulation

2004 ◽  
Vol 126 (3) ◽  
pp. 619-626 ◽  
Author(s):  
Hakan Ertu¨rk ◽  
Ofodike A. Ezekoye ◽  
John R. Howell
Keyword(s):  
Boundary Condition ◽  
Temperature Distribution ◽  
Design Problem ◽  
Manufacturing Industry ◽  
Three Dimensional ◽  
Chemical Deposition ◽  
Iterative Solution ◽  
Conveyor Belt ◽  
Temperature History ◽  
Transient Temperature

The boundary condition design of a three-dimensional furnace that heats an object moving along a conveyor belt of an assembly line is considered. A furnace of this type can be used by the manufacturing industry for applications such as industrial baking, curing of paint, annealing or manufacturing through chemical deposition. The object that is to be heated moves along the furnace as it is heated following a specified temperature history. The spatial temperature distribution on the object is kept isothermal through the whole process. The temperature distribution of the heaters of the furnace should be changed as the object moves so that the specified temperature history can be satisfied. The design problem is transient where a series of inverse problems are solved. The process furnace considered is in the shape of a rectangular tunnel where the heaters are located on the top and the design object moves along the bottom. The inverse design approach is used for the solution, which is advantageous over a traditional trial-and-error solution where an iterative solution is required for every position as the object moves. The inverse formulation of the design problem is ill-posed and involves a set of Fredholm equations of the first kind. The use of advanced solvers that are able to regularize the resulting system is essential. These include the conjugate gradient method, the truncated singular value decomposition or Tikhonov regularization, rather than an ordinary solver, like Gauss-Seidel or Gauss elimination.

scholarly journals Simulation of Thermal and Electric Field Distribution in Packaged Sausages Heated in a Stationary Versus a Rotating Microwave Oven

Foods ◽  
2021 ◽  
Vol 10 (7) ◽  
pp. 1622
Author(s):  
Wipawee Tepnatim ◽  
Witchuda Daud ◽  
Pitiya Kamonpatana
Keyword(s):  
Temperature Distribution ◽  
Electric Field ◽  
Three Dimensional ◽  
Development Stage ◽  
Microwave Oven ◽  
Computational Time ◽  
Plastic Package ◽  
Heating Uniformity ◽  
The Cost ◽  
Good Agreement

The microwave oven has become a standard appliance to reheat or cook meals in households and convenience stores. However, the main problem of microwave heating is the non-uniform temperature distribution, which may affect food quality and health safety. A three-dimensional mathematical model was developed to simulate the temperature distribution of four ready-to-eat sausages in a plastic package in a stationary versus a rotating microwave oven, and the model was validated experimentally. COMSOL software was applied to predict sausage temperatures at different orientations for the stationary microwave model, whereas COMSOL and COMSOL in combination with MATLAB software were used for a rotating microwave model. A sausage orientation at 135° with the waveguide was similar to that using the rotating microwave model regarding uniform thermal and electric field distributions. Both rotating models provided good agreement between the predicted and actual values and had greater precision than the stationary model. In addition, the computational time using COMSOL in combination with MATLAB was reduced by 60% compared to COMSOL alone. Consequently, the models could assist food producers and associations in designing packaging materials to prevent leakage of the packaging compound, developing new products and applications to improve product heating uniformity, and reducing the cost and time of the research and development stage.

Process Modeling in Laser Deposition of Multilayer SS410 Steel

2007 ◽  
Vol 129 (6) ◽  
pp. 1028-1034 ◽  
Author(s):  
Liang Wang ◽  
Sergio Felicelli
Keyword(s):  
Phase Transformation ◽  
Temperature Distribution ◽  
Three Dimensional ◽  
Element Model ◽  
Traverse Speed ◽  
Processing Parameters ◽  
Dimensional Finite Element ◽  
Net Shaping ◽  
Three Dimensional Finite Element ◽  
Continuous Cooling Transformation Diagram

A three-dimensional finite element model was developed to predict the temperature distribution and phase transformation in deposited stainless steel 410 (SS410) during the Laser Engineered Net Shaping (LENS™) rapid fabrication process. The development of the model was carried out using the SYSWELD software package. The model calculates the evolution of temperature in the part during the fabrication of a SS410 plate. The metallurgical transformations are taken into account using the temperature-dependent material properties and the continuous cooling transformation diagram. The ferritic and martensitic transformation as well as austenitization and tempering of martensite are considered. The influence of processing parameters such as laser power and traverse speed on the phase transformation and the consequent hardness are analyzed. The potential presence of porosity due to lack of fusion is also discussed. The results show that the temperature distribution, the microstructure, and hardness in the final part depend significantly on the processing parameters.

Direct observation of three-dimensional transient temperature distribution in SiC Schottky barrier diode under operation by optical-interference contactless thermometry (OICT) imaging

2022 ◽  
Author(s):  
Keiya Fujimoto ◽  
Hiroaki Hanafusa ◽  
Takuma Sato ◽  
Seiichiro HIGASHI
Keyword(s):  
Temperature Distribution ◽  
Schottky Barrier ◽  
Hot Spot ◽  
Local Heating ◽  
Three Dimensional ◽  
Schottky Barrier Diode ◽  
Transient Temperature ◽  
Optical Interference ◽  
Transient Temperature Distribution ◽  
Heating And Cooling

Abstract We have developed optical-interference contactless thermometry (OICT) imaging technique to visualize three-dimensional transient temperature distribution in 4H-SiC Schottky barrier diode (SBD) under operation. When a 1 ms forward pulse bias was applied, clear variation of optical interference fringes induced by self-heating and cooling were observed. Thermal diffusion and optical analysis revealed three-dimensional temperature distribution with high spatial (≤ 10 μm) and temporal (≤ 100 μs) resolutions. A hot spot that signals breakdown of the SBD was successfully captured as an anormal interference, which indicated a local heating to a temperature as high as 805 K at the time of failure.

Electromagnetic performance and thermal analysis of a novel permanent magnet fluxed-switching coupler

2021 ◽  
pp. 1-18
Author(s):  
Lezhi Ye ◽  
Yulong Zhang ◽  
Mingguang Cao
Keyword(s):  
Temperature Distribution ◽  
Permanent Magnet ◽  
Permanent Magnets ◽  
Three Dimensional ◽  
Load Condition ◽  
Maximum Load ◽  
Maximum Temperature ◽  
The Novel ◽  
Transient Field ◽  
Three Dimensional Finite Element

To solve the problem of complex operating device and permanent magnets (PMs) demagnetization at high temperature, a new type of permanent magnet fluxed-switching coupler (PMC) with synchronous rotating adjuster is proposed. Its torque can be adjusted by rotating a switched flux angle between the adjuster and PMs along the circumferential direction. The structural feature and working principle of the PMC are introduced. The analytical model of the novel PMC was established. The torque curves are calculated in transient field by using the three-dimensional finite element method (3-D FEM). The temperature distribution of the novel PMC under rated condition is calculated by 3-D FEM, and the temperature distribution of the PM is compared with that of the conventional PMC. The simulation and test results show that the maximum temperature of copper disc and PM of the novel PMC are 100 °C and 48 °C respectively. The novel PMC can work stably for a long time under the maximum load condition.

scholarly journals Numerical Simulation of Temperature Distribution in the Glass Fiber Epoxy Composites during Microwave Curing

2018 ◽  
Vol 206 ◽  
pp. 03001
Author(s):  
X Zhang ◽  
X L Chang ◽  
R L Ma ◽  
L Zhang ◽  
X D Chen ◽  
...  
Keyword(s):  
Temperature Distribution ◽  
Glass Fiber ◽  
Three Dimensional ◽  
Coupled Model ◽  
Curing Process ◽  
Epoxy Ring ◽  
Microwave Curing ◽  
Composite Ring ◽  
Initial Stage ◽  
Field Temperature

A three-dimensional coupled model of electromagnetic field, temperature field and curing degree field was established. Based on this model, the simulation of microwave curing process of glass fiber epoxy ring was realized, and the temperature distribution at different time was obtained. Numerical results indicate that the temperature difference within the composite ring is mainly formed in the initial stage during microwave curing.

Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems

2013 ◽  
Author(s):  
Leila Choobineh ◽  
Dereje Agonafer ◽  
Ankur Jain
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Temperature Field ◽  
Temperature Distribution ◽  
Analytical Modeling ◽  
Three Dimensional ◽  
Heat Transfer Process ◽  
Thermal Design ◽  
Research Attention ◽  
On Chip

Heterogeneous integration in microelectronic systems using interposer technology has attracted significant research attention in the past few years. Interposer technology is based on stacking of several heterogeneous chips on a common carrier substrate, also referred to as the interposer. Compared to other technologies such as System-on-Chip (SoC) or System-in-Package (SiP), interposer-based integration offers several technological advantages. However, the thermal management of an interposer-based system is not well understood. The presence of multiple heat sources in various die and the interposer itself needs to be accounted for in any effective thermal model. While a finite-element based simulation may provide a reasonable temperature prediction tool, an analytical solution is highly desirable for understanding the fundamentals of the heat transfer process in interposers. In this paper, we describe our recent work on analytical modeling of heat transfer in interposer-based microelectronic systems. The basic governing energy conservation equations are solved to derive analytical expressions for the temperature distribution in an interposer-based microelectronic system. These solutions are combined with an iterative approach to provide the three-dimensional temperature field in an interposer. Results are in excellent agreement with finite-element solutions. The analytical model is utilized to study the effect of various parameters on the temperature field in an interposer system. Results from this work may be helpful in the thermal design of microelectronic systems containing interposers.

scholarly journals INDOOR AIR TEMPERATURE DISTRIBUTION – AN ALTERNATIVE APPROACH TO BUILDING SIMULATION

2003 ◽  
Vol 2 (1) ◽  
Author(s):  
A. T. Franco ◽  
C. O. R. Negrão
Keyword(s):  
Temperature Distribution ◽  
Air Temperature ◽  
Indoor Air ◽  
Linear Equations ◽  
Three Dimensional ◽  
Momentum Conservation ◽  
Conservation Equation ◽  
Algebraic Equations ◽  
Conservation Of Energy ◽  
Energy Conservation Equation

The current paper presents a model to predict indoor air temperature distribution. The approach is based on the energy conservation equation which is written for a certain number of finite volumes within the flow domain. The magnitude of the flow is estimated from a scale analysis of the momentum conservation equation. Discretized two or three-dimensional domains provide a set of algebraic equations. The resulting set of non-linear equations is iteratively solved using the line-by-line Thomas Algorithm. As long as the only equation to be solved is the conservation of energy and its coefficients are not strongly dependent on the temperature field, the solution is considerably fast. Therefore, the application of such model to a whole building system is quite reasonable. Two case studies involving buoyancy driven flows were carried out and comparisons with CFD solutions were performed. The results are quite promising for cases involving relatively strong couplings between heat and airflow.

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