Apparatus for isometric heating and thermomechanical testing of films and fibers

1980 ◽  
Vol 15 (5) ◽  
pp. 649-651 ◽  
Author(s):  
M. G. Tsiprin ◽  
L. A. Irgen ◽  
G. M. Kerch ◽  
Yu. Yu. Silis
2020 ◽  
Vol 787 (12) ◽  
pp. 34-39
Author(s):  
L.A. Abdrakhmanova ◽  
◽  
K.R. Khuziakhmetova ◽  
R.K. Nizamov ◽  
V.G. Khozin ◽  
...  

A comparison of small doses (up to 0.7 mass part) of impact strength modifiers of foreign and domestic production in polyvinylchloride-based compositions is given. Domestic acrylicnitrile- butadiene styrene modifiers (ABS) were used. The developed shock-resistant polyvinylchloride compositions in the presence of ABS elastifier have high melt fluidity, which has a beneficial effect on the recyclability. Changes in supramolecular structure were estimated from thermomechanical testing and electron microscopy data for both unfilled and filled PVC samples. Thermomechanical analysis showed that the presence of ABS modifier had a favorable effect on the technological properties of PVC-based samples. Electron-microscopic images indicate that in unfilled PVC samples, the heterogeneous PVC structure is expressed in the presence of ABS copolymer in comparison with foreign acrylic modifiers. When the compositions are filled with micro-heterogeneous structure in dispersion medium, the filler-polymer is formed by chalk particles, while ABS elasticifier is at the phase interface. Due to the peculiarities of the structure ABS has a higher degree of “fixation” on the surface of the chalk particles in comparison with the basic compositions containing acrylic modifiers, which with increasing chalk concentration leads to lower wear and tear on the top of the forming equipment.


2010 ◽  
Vol 24 (01n02) ◽  
pp. 136-147 ◽  
Author(s):  
SHEAU HOOI LIM ◽  
KAIYANG ZENG ◽  
CHAOBIN HE

This paper presents recent studies on the processing and characterization of epoxy-alumina nanocomposites. Nano-sized alumina particles are incorporated into epoxy resin via solvent-assisted method, so that the particles are dispersed homogeneously in the epoxy matrix. The morphologies, mechanical and thermomechanical properties of the resulting nanocomposites are studied using transmission electron microscope (TEM), conventional tensile testing and thermomechanical testing methods. TEM results show that the alumina nano-particles with a higher specific surface area tend to agglomerate. Furthermore platelet shape particles shows a better dispersion homogeneity as well as better improvement in the mechanical properties of the composites compared to the rod shape particles.


1980 ◽  
Vol 15 (5) ◽  
pp. 652-652
Author(s):  
S. N. Kruglykh ◽  
S. S. Panina ◽  
A. V. Andrianov

2016 ◽  
Vol 716 ◽  
pp. 472-480 ◽  
Author(s):  
Gernot Eggbauer ◽  
Bruno Buchmayr

New steel grades for forged components are designed to meet the requirements of the automotive industry in order to obtain excellent strength and toughness behavior as well as a high endurance limit. Beside precipitation hardened ferritic-pearlitic steels, bainitic steels have gained more and more importance. Basic considerations on the alloy design (C-, Si-, Cr-; B-content) are done using JMatPro-Calculations and by some experimental trials. Using the thermomechanical testing system Gleeble 3800, various cooling strategies have been applied and the kinetics of the bainite formation has been measured at different holding temperatures and times. A detailed microstructural characterization has been done with relation to the mechanical properties. The isothermal tests are compared to continuous cooling situations. Finally, forging trials are performed to find out the most suitable and robust production schedule to be used in practice. The actual findings support the increasing use of bainitic steels for forged parts, especially regarding material saving, independence of cross section and good fatigue performance.


Author(s):  
M. Pei ◽  
J. Qu

Solders are used extensively as electrical interconnects in microelectronics packaging. Because of environmental concerns, lead-based solders are being replaced by Sn/Ag and Sn/Ag/Cu based solder materials. Since the thermomechanical reliability of modern electronic devices depends on, to a large extent, the fatigue and creep behavior of the solder joints, it is imperative to understand the deformation behavior of these new lead-free solders. This study conducted extensive thermomechanical testing on several commercial lead-free solder alloys. Anand viscoplastic model was used to describe the behavior of these materials with new curve fitting techniques. A modified Anand models was proposed that can yield a more accurate description of lead-free solders.


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