Fracture strength characterization of tubular ceramic materials using a simple c-ring geometry

1986 ◽  
Vol 21 (8) ◽  
pp. 2628-2632 ◽  
Author(s):  
M. K. Ferber ◽  
V. J. Tennery ◽  
S. B. Waters ◽  
J. Ogle
Author(s):  
Jefferson Talledo

This paper discusses the characterization of an integrated circuit (IC) silicon die fracture strength to have a realistic die crack assessment. The evaluation was conducted using a 3-point bend test setup to measure the die strength of actual IC dies. Both the active side and the back side of the IC die were tested for 2 types of dies with different active side circuit layout. Results showed that the difference in the die active side circuit layout or structure has impact on die strength. It was also found that the active side was weaker than the back side. This implies that both the active side and the back side of an actual IC die must be subjected to fracture strength characterization to have an assessment that would be in a better agreement with real condition. Using only the strength of the back side would result in over-estimating the die strength. The common approach of using the fracture strength of the die back side to characterize the die strength is not realistic and can mislead the assessment of die crack or semiconductor package robustness.


2007 ◽  
Vol 18 (6) ◽  
pp. 1219-1224 ◽  
Author(s):  
Erica C. Teixeira ◽  
Jeffrey R. Piascik ◽  
Brian R. Stoner ◽  
Jeffrey Y. Thompson

2014 ◽  
Vol 34 (5) ◽  
pp. 1423-1432 ◽  
Author(s):  
Kawai Kwok ◽  
Lutz Kiesel ◽  
Henrik Lund Frandsen ◽  
Martin Søgaard ◽  
Peter Vang Hendriksen

Author(s):  
K. J. Morrissey

Grain boundaries and interfaces play an important role in determining both physical and mechanical properties of polycrystalline materials. To understand how the structure of interfaces can be controlled to optimize properties, it is necessary to understand and be able to predict their crystal chemistry. Transmission electron microscopy (TEM), analytical electron microscopy (AEM,), and high resolution electron microscopy (HREM) are essential tools for the characterization of the different types of interfaces which exist in ceramic systems. The purpose of this paper is to illustrate some specific areas in which understanding interface structure is important. Interfaces in sintered bodies, materials produced through phase transformation and electronic packaging are discussed.


2015 ◽  
Vol 103 (5) ◽  
pp. 503
Author(s):  
Vladimir Gantchenko ◽  
Jacques Renard ◽  
Alexander Olowinsky ◽  
Gerhard Otto

2011 ◽  
Vol 16 (4) ◽  
pp. 1105-1110 ◽  
Author(s):  
Munir Tolga Yucel ◽  
Isa Yondem ◽  
Filiz Aykent ◽  
Oğuz Eraslan

2008 ◽  
Vol 75 (14) ◽  
pp. 4117-4126 ◽  
Author(s):  
M. Segarra ◽  
C. Arvieu ◽  
E. Lacoste ◽  
D. Spataro ◽  
J.M. Quenisset

Sign in / Sign up

Export Citation Format

Share Document