Analysis of the thermal stability of polyethylene terephthalates of various molecular weights

1982 ◽  
Vol 14 (1) ◽  
pp. 101-102
Author(s):  
O. I. Sidorov ◽  
V. N. Tamazina
Keyword(s):  
Thermal Stability ◽  
Molecular Weights ◽  
Thermal Stability Of

scholarly journals Sizing and Thermal Stability of Prepared Tetraaminophthalocyaninatocopper(II) Derivatives-grafted Polymers

2016 ◽  
Vol 13 (2) ◽  
pp. 221-234
Author(s):  
Baghdad Science Journal
Keyword(s):  
Thermal Stability ◽  
Ethylene Glycol ◽  
Group Analysis ◽  
Condensation Polymerization ◽  
Grafted Polymers ◽  
Poly Ethylene Glycol ◽  
Molecular Weights ◽  
Poly Ethylene ◽  
Thermal Stability Of ◽  
End Group

Different polymers were prepared by condensation polymerization of sebacic anhydride and adipic anhydride with ethylene glycol and poly(ethylene glycol). Their number average molecular weights were determined by end group analysis. Then, they were grafted on the prepared phthalocyaninatocopper(II) compounds with the general formula (NH2)4PcCu(II) having amino groups of 3,3',3'',3'''- or 4,4',4'',4'''- positions. All prepared polymers, compounds, and phthalocyaninatocopper(II)-grafted polymers were characterized by FTIR. The sizing measurements were carried out in 3,3',3'',3'''- (NH2)4PcCu(II) and 4,4',4'',4'''- (NH2)4PcCu(II) compounds with and without grafting polymers. The results showed that the grafting process led to decreasing in particle size and increasing in surface area. The grafting process was reflected positively on the thermal degradation of 3,3',3'',3'''- (NH2)4PcCu(II) and 4,4',4'',4'''- (NH2)4PcCu(II) grafted polymers. They had higher thermal stability accompanied with higher char residue and T50% weight loss with 3,3',3'',3'''-(NH2)4PcCu(II) and their grafted polymers being the best.

Phenylethynyl-terminated oligoimides based on bis(p-aminophenoxy)dimethyl silane: Effect of siloxane structure on processability and thermal stability

2018 ◽  
Vol 31 (6) ◽  
pp. 651-661 ◽  
Author(s):  
Yi Liu ◽  
Song Mo ◽  
Minhui He ◽  
Lei Zhai ◽  
Caihong Xu ◽  
...  
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Melt Viscosity ◽  
Fiber Reinforced Composite ◽  
Molecular Weights ◽  
Processing Window ◽  
Reinforced Composite ◽  
Interlaminar Shear ◽  
Biphenyltetracarboxylic Dianhydride ◽  
Thermal Stability Of

A series of phenylethynyl-terminated oligoimides based on 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA), 2,2′-bis(trifluoromethyl)benzidine (TFDB), and bis( p-aminophenoxy)dimethyl silane (APDS) with different siloxane content and various calculated molecular weights were synthesized. The effect of siloxane structure on the processability of oligoimides and the thermal stability of cured polyimides (PIs) was investigated. The results indicated that the oligoimides have lower melt viscosity and broader processing window with the incorporation of flexible siloxane segment. The thermal stability of the cured PIs can be significantly enhanced by high-temperature postcuring due to the oxidative cross-linking of siloxane. The polyimide PI-s1-15 exhibited good balance between processability and thermal stability with the minimum melt viscosity of 0.4 Pa·s at 325°C and glass transition temperature as high as 470°C after postcuring at 450°C. The carbon fiber-reinforced composite T800/PI-s1-15 displayed excellent high-temperature performance, which gave the flexural strength and interlaminar shear strength of 703 and 33 MPa, respectively, when tested at the temperature as high as 450°C.

Novel acrylic copolymers: synthesis, characterization and antimicrobial studies.

e-Polymers ◽  
2007 ◽  
Vol 7 (1) ◽  
Author(s):  
Hetal Patel ◽  
Mitesh Patel ◽  
Kirit Patel ◽  
Rajni Patel
Keyword(s):  
Thermal Stability ◽  
Thermal Analysis ◽  
Antimicrobial Activity ◽  
Feed Ratio ◽  
Dimethyl Formamide ◽  
Reactivity Ratios ◽  
Molecular Weights ◽  
Antimicrobial Studies ◽  
Acrylic Copolymers ◽  
Thermal Stability Of

AbstractThe monomer 2,4-dichloro phenyl acrylate (2,4-DCPA) was synthesized from 2,4-dichlorophenol and characterized by conventional methods. The homopolymers of 2,4-DCPA and its copolymers with 8-quinolinyl methacrylate (8- QMA) in different feed ratio were prepared by free radical polymerization using dimethyl formamide (DMF) as a solvent and 2,2’-azobisisobutyronitrile (AIBN) as an initiator. The resulting polymers were characterized by Infrared Spectroscopy. UV spectral data were employed to obtain the reactivity ratios of the monomers, 2,4-DCPA and 8-QMA. The results showed that 2,4-DCPA is more reactive than 8- QMA. Average molecular weights and intrinsic viscosities determined by Vapour pressure osmometer (VPO) lies in the range of 7900 to 10890 and 0.021-0.036 dl.g-1 respectively. Thermal analysis shows that thermal stability of copolymers increases with the increase of 2,4-DCPA. The copolymers also showed antimicrobial activity which increased with increase in 8-QMA content.

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

Thermal stability of Al-Cu-Fe icosahedral alloys

1991 ◽  
Vol 1 (12) ◽  
pp. 1823-1836 ◽  
Author(s):  
M. Bessière ◽  
A. Quivy ◽  
S. Lefebvre ◽  
J. Devaud-Rzepski ◽  
Y. Calvayrac
Keyword(s):  
Thermal Stability ◽  
Thermal Stability Of

Practical criteria for the thermal stability of a unidimensional superconductor

1994 ◽  
Vol 4 (4) ◽  
pp. 653-657
Author(s):  
B. Bonzi ◽  
M. El Khomssi ◽  
H. Lanchon-Ducauquis
Keyword(s):  
Thermal Stability ◽  
Thermal Stability Of

Time and thermal stability of magnetic properties of amorphous Fe80TM3B17 alloys

1998 ◽  
Vol 08 (PR2) ◽  
pp. Pr2-63-Pr2-66 ◽  
Author(s):  
R. Varga ◽  
P. Vojtaník ◽  
A. Lovas
Keyword(s):  
Thermal Stability ◽  
Magnetic Properties ◽  
Thermal Stability Of
Sign in / Sign up

Export Citation Format

Share Document