Effects of clipping and soil compaction on growth, morphology and mycorrhizal colonization of Schizachyrium scoparium, a C4 bunchgrass

Oecologia ◽  
1987 ◽  
Vol 72 (3) ◽  
pp. 423-428 ◽  
Author(s):  
L. L. Wallace
Keyword(s):  
Soil Compaction ◽  
Mycorrhizal Colonization ◽  
Schizachyrium Scoparium ◽  
Growth Morphology

Nutrients and environment influence arbuscular mycorrhizal colonization both independently and interactively in Schizachyrium scoparium

2018 ◽  
Vol 425 (1-2) ◽  
pp. 493-506 ◽  
Author(s):  
Paul N. Frater ◽  
Elizabeth T. Borer ◽  
Philip A. Fay ◽  
Virginia Jin ◽  
Brian Knaeble ◽  
...  
Keyword(s):  
Arbuscular Mycorrhizal ◽  
Mycorrhizal Colonization ◽  
Schizachyrium Scoparium ◽  
Arbuscular Mycorrhizal Colonization ◽  
Environment Influence

Biscogniauxia (Hypoxylon) Canker or Dieback in Trees

EDIS ◽  
2017 ◽  
Vol 2017 (6) ◽  
Author(s):  
Claudia Paez ◽  
Jason A. Smith
Keyword(s):  
Water Stress ◽  
Tree Species ◽  
Soil Compaction ◽  
Urban Areas ◽  
Root Disease ◽  
Poor Health ◽  
Green Spaces ◽  
Opportunistic Pathogens ◽  
Wide Range ◽  
Quercus Spp

Biscogniauxia canker or dieback (formerly called Hypoxylon canker or dieback) is a common contributor to poor health and decay in a wide range of tree species (Balbalian & Henn 2014). This disease is caused by several species of fungi in the genus Biscogniauxia (formerly Hypoxylon). B. atropunctata or B. mediterranea are usually the species found on Quercus spp. and other hosts in Florida, affecting trees growing in many different habitats, such as forests, parks, green spaces and urban areas (McBride & Appel, 2009).  Typically, species of Biscogniauxia are opportunistic pathogens that do not affect healthy and vigorous trees; some species are more virulent than others. However, once they infect trees under stress (water stress, root disease, soil compaction, construction damage etc.) they can quickly colonize the host. Once a tree is infected and fruiting structures of the fungus are evident, the tree is not likely to survive especially if the infection is in the tree's trunk (Anderson et al., 1995).

Evaluation of Loosening and Soil Compaction with a Working Tool of Tillage Machines Using a Hydrodynamic Model

2020 ◽  
Vol 13 (6) ◽  
pp. 394
Author(s):  
Salavat Mudarisov ◽  
Ildar Farkhutdinov ◽  
Airat Mukhametdinov ◽  
Raushan Aminov ◽  
Rustam Bagautdinov ◽  
...  
Keyword(s):  
Hydrodynamic Model ◽  
Soil Compaction

Soil compaction and organic matter affect conifer seedling nonmycorrhizal and ectomycorrhizal root tip abundance and diversity.

1996 ◽  
Author(s):  
Michael P. Amaranthus ◽  
Debbie Page-Dumroese ◽  
Al Harvey ◽  
Efren Cazares ◽  
Larry F. Bednar
Keyword(s):  
Organic Matter ◽  
Soil Compaction ◽  
Root Tip ◽  
Abundance And Diversity ◽  
Conifer Seedling

Copper to Aluminum Bonding: IMC Characterization through New Mechanical Sectioning Methods

2010 ◽  
Author(s):  
Lucas Copeland ◽  
Mukul Saran
Keyword(s):  
Intermetallic Compound ◽  
Imaging Study ◽  
Thermal Ageing ◽  
Initial Model ◽  
Growth Morphology ◽  
Intermetallic Formation ◽  
Imaging Parameters ◽  
Bonded Interface ◽  
Bond Interface ◽  
Sem Imaging

Abstract This paper presents a mechanical cross-sectioning approach that produces an image clarity not yet demonstrated in published literature. It demonstrates how a critical sequence of polishing, basic slurry optimization and staining, in conjunction with correct imaging parameters can be used to highlight the growth morphology of the intermetallic compound (IMCs). Utilizing this approach, the paper describes the results of a SEM imaging study of the intermetallic formation and growth at the Cu-Al bond interface during thermal ageing for up to 4000hrs at 150 deg C. The paper uses direct SEM imaging to catalog observations which are used to create an initial model for IMC and void growth at the wire bonded interface. It examines the effect of aluminum splash and concludes that growth of intermetallics at the Cu-Al interface is rapid into the bond-pad aluminum than into the Cu-ball, but the growth thickness uniformity is much higher into the Cu-ball.

Sign in / Sign up

Export Citation Format

Share Document