Modeling mixed-mode dynamic crack propagation nsing finite elements: Theory and applications

1988 ◽  
Vol 3 (6) ◽  
pp. 381-397 ◽  
Author(s):  
D. V. Swenson ◽  
A. R. Ingraffea
2010 ◽  
Vol 77 (14) ◽  
pp. 2864-2880 ◽  
Author(s):  
Addis Kidane ◽  
Vijaya B. Chalivendra ◽  
Arun Shukla ◽  
Ravi Chona

2012 ◽  
Vol 36 (5) ◽  
pp. 651-657 ◽  
Author(s):  
Jun Lei ◽  
Yue-Sheng Wang ◽  
Yifeng Huang ◽  
Qingsheng Yang ◽  
Chuanzeng Zhang

1998 ◽  
Vol 539 ◽  
Author(s):  
T. Cramer ◽  
A. Wanner ◽  
P. Gumbsch

AbstractTensile tests on notched plates of single-crystalline silicon were carried out at high overloads. Cracks were forced to propagate on {110} planes in a <110> direction. The dynamics of the fracture process was measured using the potential drop technique and correlated with the fracture surface morphology. Crack propagation velocity did not exceed a terminal velocity of v = 3800 m/s, which corresponds to 83%7 of the Rayleigh wave velocity vR. Specimens fractured at low stresses exhibited crystallographic cleavage whereas a transition from mirror-like smooth regions to rougher hackle zones was observed in case of the specimens fractured at high stresses. Inspection of the mirror zone at high magnification revealed a deviation of the {110} plane onto {111} crystallographic facets.


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