Optical Analysis of Monolayers at Surfaces and Interfaces

2005 ◽  
pp. 301-312
Author(s):  
Veit Wagner
Keyword(s):  
Optical Analysis ◽  
Surfaces And Interfaces

Inelastic scattering at surfaces and interfaces

1986 ◽  
Vol 44 ◽  
pp. 392-393
Author(s):  
R. H. Ritchie ◽  
A. Howie
Keyword(s):  
Inelastic Scattering ◽  
Surface Properties ◽  
Correlation Energy ◽  
Condensed Matter ◽  
Charged Particles ◽  
Condensed Matter Physics ◽  
Optical Phonons ◽  
Exchange Correlation ◽  
Surfaces And Interfaces ◽  
Inelastic Interactions

An important part of condensed matter physics in recent years has involved detailed study of inelastic interactions between swift electrons and condensed matter surfaces. Here we will review some aspects of such interactions.Surface excitations have long been recognized as dominant in determining the exchange-correlation energy of charged particles outside the surface. Properties of surface and bulk polaritons, plasmons and optical phonons in plane-bounded and spherical systems will be discussed from the viewpoint of semiclassical and quantal dielectric theory. Plasmons at interfaces between dissimilar dielectrics and in superlattice configurations will also be considered.

Ultramicrotomy as a Technique for Materials Specimen Preparation

1990 ◽  
Vol 48 (2) ◽  
pp. 428-429
Author(s):  
S.R. Glanvill
Keyword(s):  
Materials Science ◽  
Structural Information ◽  
Specimen Preparation ◽  
Preparation Technique ◽  
Cross Sectional ◽  
Surfaces And Interfaces ◽  
Beam Analysis ◽  
Flat Embedding ◽  
20 Nm ◽  
Sectional Analysis

This paper summarizes the application of ultramicrotomy as a specimen preparation technique for some of the Materials Science applications encountered over the past two years. Specimens 20 nm thick by hundreds of μm lateral dimension are readily prepared for electron beam analysis. Materials examined include metals, plastics, ceramics, superconductors, glassy carbons and semiconductors. We have obtain chemical and structural information from these materials using HRTEM, CBED, EDX and EELS analysis. This technique has enabled cross-sectional analysis of surfaces and interfaces of engineering materials and solid state electronic devices, as well as interdiffusion studies across adjacent layers.Samples are embedded in flat embedding moulds with Epon 812 epoxy resin / Methyl Nadic Anhydride mixture, using DY064 accelerator to promote the reaction. The embedded material is vacuum processed to remove trapped air bubbles, thereby improving the strength and sectioning qualities of the cured block. The resin mixture is cured at 60 °C for a period of 80 hr and left to equilibrate at room temperature.

ANTISYMMETRY OF SURFACES AND INTERFACES IN POLAR MATERIALS

1982 ◽  
Vol 43 (C1) ◽  
pp. C1-57-C1-62 ◽  
Author(s):  
R. C. Pond ◽  
D. B. Holt
Keyword(s):  
Surfaces And Interfaces ◽  
Polar Materials

Optical analysis of ink and other contaminants in process waters

TAPPI Journal ◽  
2012 ◽  
Vol 11 (8) ◽  
pp. 51-58
Author(s):  
ANTTI HAAPALA ◽  
MIKA KÖRKKÖ ◽  
ELISA KOIVURANTA ◽  
JOUKO NIINIMÄKI
Keyword(s):  
Optically Active ◽  
Process Water ◽  
Paper Machine ◽  
Optical Analysis ◽  
Direct Process ◽  
Active Components ◽  
Water Contaminants ◽  
Dependent Measurement ◽  
Measurement Methodology

Analysis methods developed specifically to determine the presence of ink and other optically active components in paper machine white waters or other process effluents are not available. It is generally more interest¬ing to quantify the effect of circulation water contaminants on end products. This study compares optical techniques to quantify the dirt in process water by two methods for test media preparation and measurement: direct process water filtration on a membrane foil and low-grammage sheet formation. The results show that ink content values obtained from various analyses cannot be directly compared because of fundamental issues involving test media preparation and the varied methodologies used to formulate the results, which may be based on different sets of assumptions. The use of brightness, luminosity, and reflectance and the role of scattering measurements as a part of ink content analysis are discussed, along with fine materials retention and measurement media selection. The study concludes with practical tips for case-dependent measurement methodology selection.

In Vivo Optical Analysis of Quantitative Changes in Collagen and Elastin During Arterial Remodeling¶

2005 ◽  
Vol 81 (2) ◽  
pp. 457 ◽  
Author(s):  
Alexander Christov ◽  
Renee M. Korol ◽  
Erbin Dai ◽  
Liying Liu ◽  
Haiyan Guan ◽  
...  
Keyword(s):  
Arterial Remodeling ◽  
Optical Analysis ◽  
Quantitative Changes

Aero-optical analysis of compressible flow over an open cavity

1987 ◽  
Author(s):  
PHILIP CASSADY ◽  
STANLEY BIRCH ◽  
P. TERRY
Keyword(s):  
Compressible Flow ◽  
Open Cavity ◽  
Optical Analysis

VLSI for Space Applications—Single Event Effect Investigation and Optical Analysis on an Integrated Laser Platform

2017 ◽  
Author(s):  
Samuel Chef ◽  
Chung Tah Chua ◽  
Yu Wen Siah ◽  
Philippe Perdu ◽  
Chee Lip Gan ◽  
...  
Keyword(s):  
Pulsed Laser ◽  
Single Event ◽  
Optical Analysis ◽  
Space Applications ◽  
Laser Probing ◽  
Single Event Effect ◽  
Evaluation Time ◽  
Black Boxes ◽  
System Use ◽  
First Time

Abstract Today’s VLSI devices are neither designed nor manufactured for space applications in which single event effects (SEE) issues are common. In addition, very little information about the internal schematic and usually nothing about the layout or netlist is available. Thus, they are practically black boxes for satellite manufacturers. On the other hand, such devices are crucial in driving the performance of spacecraft, especially smaller satellites. The only way to efficiently manage SEE in VLSI devices is to localize sensitive areas of the die, analyze the regions of interest, study potential mitigation techniques, and evaluate their efficiency. For the first time, all these activities can be performed using the same tool with a single test setup that enables a very efficient iterative process that reduce the evaluation time from months to days. In this paper, we will present the integration of a pulsed laser for SEE study into a laser probing, laser stimulation, and emission microscope system. Use of this system will be demonstrated on a commercial 8 bit microcontroller.

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