Effective fault localization and context‐aware debugging for concurrent programs

Abstract This paper discusses a creative manual diagnosis approach, a complementary technique that provides the possibility to extend Automatic Test Pattern Generation (ATPG) beyond its own limits. The authors will discuss this approach in detail using an actual case – a test coverage issue where user-generated ATPG patterns and the resulting ATPG diagnosis isolated the fault to a small part of the digital core. However, traditional fault localization techniques was unable to isolate the fault further. Using the defect candidates from ATPG diagnosis as a starting point, manual diagnosis through fault Injection and fault simulation was performed. Further fault localization was performed using the ‘not detected’ (ND) and/or ‘detected’ (DT) fault classes for each of the available patterns. The result has successfully deduced the defect candidates until the exact faulty net causing the electrical failure was identified. The ability of the FA lab to maximize the use of ATPG in combination with other tools/techniques to investigate failures in detail; is crucial in the fast root cause determination and, in case of a test coverage, aid in having effective test screen method implemented.

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Advanced IR-OBIRCH Analysis Technique for High Isb Failure Analysis

ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2010p0233 ◽

2010 ◽

Author(s):

Kuo Hsiung Chen ◽

Wen Sheng Wu ◽

Yu Hsiang Shu ◽

Jian Chan Lin

Keyword(s):

Failure Analysis ◽

Failure Mechanisms ◽

Fault Localization ◽

Resistance Change ◽

The Real ◽

Analysis Techniques ◽

Analysis Technique ◽

Leakage Failure ◽

Failure Site

Abstract IR-OBIRCH (Infrared Ray – Optical Beam Induced Resistance Change) is one of the main failure analysis techniques [1] [2] [3] [4]. It is a useful tool to do fault localization on leakage failure cases such as poor Via or contact connection, FEoL or BEoL pattern bridge, and etc. But the real failure sites associated with the above failure mechanisms are not always found at the OBIRCH spot locations. Sometimes the real failure site is far away from the OBIRCH spot and it will result in inconclusive PFA Analysis. Finding the real failure site is what matters the most for fault localization detection. In this paper, we will introduce one case using deep sub-micron process generation which suffers serious high Isb current at wafer donut region. In this case study a BEoL Via poor connection is found far away from the OBIRCH spots. This implies that layout tracing skill and relation investigation among OBIRCH spots are needed for successful failure analysis.

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