Effect of Single Power Two Circuits Electroslag Remelting Process on the Ingot Solidification Quality

2018 ◽  
Vol 90 (2) ◽  
pp. 1800337 ◽  
Author(s):  
Haibo Cao ◽  
Zhouhua Jiang ◽  
Yanwu Dong ◽  
Fubin Liu ◽  
Yulong Cao ◽  
...  
Keyword(s):  
Electroslag Remelting ◽  
Ingot Solidification ◽  
Single Power

scholarly journals A Novel Single Power Two Circuits Electroslag Remelting with Current Carrying Mould

2016 ◽  
Vol 56 (8) ◽  
pp. 1386-1393 ◽  
Author(s):  
Yanwu Dong ◽  
Zhouhua Jiang ◽  
Haibo Cao ◽  
Xiang Wang ◽  
Yulong Cao ◽  
...  
Keyword(s):  
Electroslag Remelting ◽  
Single Power

scholarly journals Effect of Single Power Two Circuits Electroslag Remelting Process on the Cleanliness of the Remelted Ingot

2020 ◽  
Vol 60 (2) ◽  
pp. 247-257 ◽  
Author(s):  
Haibo Cao ◽  
Zhouhua Jiang ◽  
Yanwu Dong ◽  
Fubin Liu ◽  
Zhiwen Hou ◽  
...  
Keyword(s):  
Electroslag Remelting ◽  
Single Power

Temperature-Dependent Logic Failure in a GaAs Power Amplifier-Duplexer Module Caused by a Subtle Parasitic Schottky Diode

2014 ◽  
Author(s):  
Rose Emergo ◽  
Steve Brockett ◽  
Pat Hamilton
Keyword(s):  
Power Amplifier ◽  
Schottky Diode ◽  
Production Test ◽  
Temperature Dependent ◽  
Cold Temperatures ◽  
Collector Junction ◽  
Power Mode ◽  
The Difference ◽  
Base Contact ◽  
Single Power

Abstract A single power amplifier-duplexer device was submitted by a customer for analysis. The device was initially considered passing when tested against the production test. However, further electrical testing suggested that the device was stuck in a single power mode for a particular frequency band at cold temperatures only. This paper outlines the systematic isolation of a parasitic Schottky diode formed by a base contactcollector punch through process defect that pulled down the input of a NOR gate leading to the incorrect logic state. Note that this parasitic Schottky diode is parallel to the basecollector junction. It was observed that the logic failure only manifested at colder temperatures because the base contact only slightly diffused into the collector layer. Since the difference in the turn-on voltages between the base-collector junction and the parasitic Schottky diode increases with decreasing temperature, the effect of the parasitic diode is only noticeable at lower temperatures.

scholarly journals Effects of Weight‐Compatible Design on Ingot Solidification

2021 ◽  
Vol 92 (3) ◽  
pp. 2170031
Author(s):  
Yan Zhang ◽  
Changjun Xu ◽  
Ningning Liu ◽  
Yuting Zhang ◽  
Zhengguo Xue
Keyword(s):  
Ingot Solidification

Production of sheet rolled products made of a nitrogen-bearing high-strength corrosion-resistant steel using electroslag remelting

2009 ◽  
Vol 2009 (7) ◽  
pp. 655-658 ◽  
Author(s):  
E. R. Gutman ◽  
V. A. Durynin ◽  
G. Yu. Kalinin ◽  
O. A. Khar’kov ◽  
V. V. Tsukanov
Keyword(s):  
High Strength ◽  
Electroslag Remelting ◽  
Corrosion Resistant Steel ◽  
Resistant Steel ◽  
Corrosion Resistant

Density of CaF2-CaO-Al2O3Melts for Electroslag Remelting

1981 ◽  
Vol 20 (1) ◽  
pp. 113-116 ◽  
Author(s):  
Shigeta Hara ◽  
Kazumi Ogino
Keyword(s):  
Electroslag Remelting
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