Prediction of Longitudinal Cracks Based on a Full-Scale Finite-Element Model Coupled Inverse Algorithm for a Continuously Cast Slab

2017 ◽  
Vol 88 (10) ◽  
pp. 1700013 ◽  
Author(s):  
Fengming Du ◽  
Xudong Wang ◽  
Yu Liu ◽  
Jingjing Wei ◽  
Man Yao
Keyword(s):  
Finite Element ◽  
Finite Element Model ◽  
Element Model ◽  
Full Scale ◽  
Cast Slab ◽  
Inverse Algorithm ◽  
Continuously Cast ◽  
Longitudinal Cracks

scholarly journals Analysis of the Effect of Tungsten Inert Gas Welding Sequences on Residual Stress and Distortion of CFETR Vacuum Vessel Using Finite Element Simulations

Metals ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 912 ◽  
Author(s):  
Jingwen Zhang ◽  
Liming Yu ◽  
Yongchang Liu ◽  
Zongqing Ma ◽  
Huijun Li ◽  
...  
Keyword(s):  
Finite Element ◽  
Finite Element Model ◽  
Element Model ◽  
Full Scale ◽  
Inert Gas ◽  
Vacuum Vessel ◽  
Lower Segment ◽  
Welding Stress ◽  
Welding Sequence ◽  
Welding Sequences

The as-welded sectors of China Fusion Engineering Testing Reactor (CFETR) vacuum vessel (VV) have very tight tolerances. However, it is difficult to investigate the welding stress and distortion without the production of a full-scale prototype. Therefore, it is important to predict and reduce the welding stress and distortion to guarantee the final assembly by using an accurately adjusted finite element model. In this paper, a full-scale finite element model of the 1/32 VV mock-up was built by ABAQUS which is a powerful finite element software for engineering simulation, and three different tungsten inert gas (TIG) welding sequences were simulated to study the effect of welding sequences on the welding stress and distortion. The results showed that the main welding stress happened on the weld zone, and the maximum distortion occurred on the shell near the welding joints between the inboard segment (PS1) and the lower segment (PS4). The inboard segment (PS1), upper segment (PS2), and lower segment (PS4) distorted to inside of the shell perpendicularly, while the equatorial segment (PS3) distorted to outside of the shell perpendicularly. According to the further analysis, the maximum welding stresses in sequence 1, sequence 2, and sequence 3 were 234.509 MPa, 234.731 MPa, and 234.508 MPa, respectively, and the average welding stresses were 117.268 MPa, 117.367 MPa, and 117.241 MPa, respectively, meanwhile, the maximum welding displacements in sequence 1, sequence 2, and sequence 3 were 1.158 mm, 1.157 mm, and 1.149 mm, respectively, and the average welding displacements were 1.048 mm, 1.053 mm, and 1.042 mm, respectively. Thus, an optimized welding sequence 3 was obtained and could be applied to the practical assembly process of the 1/32 VV mock-up.

scholarly journals Updating Finite Element Model of a Wind Turbine Blade Section Using Experimental Modal Analysis Results

2014 ◽  
Vol 2014 ◽  
pp. 1-12 ◽  
Author(s):  
Marcin Luczak ◽  
Simone Manzato ◽  
Bart Peeters ◽  
Kim Branner ◽  
Peter Berring ◽  
...  
Keyword(s):  
Finite Element ◽  
Finite Element Model ◽  
Wind Turbine ◽  
Turbine Blade ◽  
Numerical Study ◽  
Element Model ◽  
Full Scale ◽  
Wind Turbine Blade ◽  
Model Parameters ◽  
Blade Section

This paper presents selected results and aspects of the multidisciplinary and interdisciplinary research oriented for the experimental and numerical study of the structural dynamics of a bend-twist coupled full scale section of a wind turbine blade structure. The main goal of the conducted research is to validate finite element model of the modified wind turbine blade section mounted in the flexible support structure accordingly to the experimental results. Bend-twist coupling was implemented by adding angled unidirectional layers on the suction and pressure side of the blade. Dynamic test and simulations were performed on a section of a full scale wind turbine blade provided by Vestas Wind Systems A/S. The numerical results are compared to the experimental measurements and the discrepancies are assessed by natural frequency difference and modal assurance criterion. Based on sensitivity analysis, set of model parameters was selected for the model updating process. Design of experiment and response surface method was implemented to find values of model parameters yielding results closest to the experimental. The updated finite element model is producing results more consistent with the measurement outcomes.

Full Scale Cyclic Fatigue Testing of Dented Pipelines and Development of a Validated Dented Pipe Finite Element Model

2012 ◽  
Author(s):  
Sanjay Tiku ◽  
Vlado Semiga ◽  
Aaron Dinovitzer ◽  
Geoff Vignal
Keyword(s):  
Finite Element ◽  
Finite Element Model ◽  
Fatigue Testing ◽  
Complex Function ◽  
Element Model ◽  
Full Scale ◽  
Assessment Model ◽  
Integrity Assessment ◽  
Operational Life ◽  
Integrity Management

Dents in buried pipelines can occur due to a number of potential causes; the pipe resting on rock, third party machinery strike, rock strikes during backfilling, amongst others. The long-term integrity of a dented pipeline segment is a complex function of a variety of parameters, including pipe geometry, indenter shape, dent depth, indenter support, pressure history at and following indentation. In order to estimate the safe remaining operational life of a dented pipeline, all of these factors must be accounted for in the analysis. The paper discusses the full-scale dent testing being completed to support the development of pipeline integrity management criteria and is a continuation of the work discussed in previous IPC papers [1,2]. The material and structural response of the pipe test segments during dent formation and pressure loading has been recorded to support numerical model development. The full scale experimental testing is being completed for pipe test specimens in the unrestrained and restrained condition using different indentation depths and indenter sizes. The dents are pressure cycled until fatigue failure in the dent. This paper presents typical data recorded during trial including indentation load/displacement curves, applied pressures, strain gauges along the axial and circumferential centerlines, as well as dent profiles. The use of the full-scale mechanical damage test data described in this paper in calibrating and validating a finite element model based integrity assessment model is outlined. The details of the integrity assessment model are described along with the level of agreement of the finite element model with the full scale trial results. Current and future applications of the integrity assessment model are described along with recommendations for further development and testing to support pipeline integrity management.

A Full-Scale 3D Finite Element Analysis for No-Underfill Flip Chip Package

2002 ◽  
Author(s):  
S. M. Hsu ◽  
J. C. Lin ◽  
K. N. Chiang
Keyword(s):  
Finite Element ◽  
Finite Element Model ◽  
Flip Chip ◽  
Computation Time ◽  
Element Model ◽  
Organic Substrate ◽  
Full Scale ◽  
Element Analysis ◽  
3D Finite Element ◽  
3D Finite Element Model

This research establishes a micro-macro 3D finite element model for no underfill flip chip BGA package. The no underfill package uses a ceramic-like (CTE close to silicon) material mounted on the backside of the flip chip substrate to constrain the thermal expansion of the organic substrate and enhance the reliability of the solder joint. This work attempts to design a constrained structure to enhance the reliability of the no underfill flip chip package. For the special design of constrained structure, a full-scale 3D finite element model is needed to investigate some mechanical behaviors that cannot be revealed by the 2D finite element model. However, to establish a full-scale 3D finite element model, the large computation time is an issue. The equivalent beam concept is adopted in this research to overcome this drawback of the finite element models. The results indicate that the equivalent beam concept is a feasible methodology for reducing the computation time of the 3D finite element model. Further, the new design structure could improve package reliability, increase manufacturing throughput and thermal performance, and maintain reworkability of the flip chip structure.

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