Investigations of the bonding mechanism at the joining region of a steel sandwich sheet

2002 ◽  
Vol 73 (4) ◽  
pp. 157-162
Author(s):  
Jian Bian ◽  
Wolfgang Bleck ◽  
Peter Karduck
Keyword(s):  
Bonding Mechanism ◽  
Sandwich Sheet

The concerted use of SEM, TEM, and SCM for examination of resin-dentin interfaces

1994 ◽  
Vol 52 ◽  
pp. 476-477
Author(s):  
B. Van Meerbeek ◽  
L. J. Conn ◽  
E. S. Duke
Keyword(s):  
Surface Layer ◽  
Stress Distribution ◽  
Phosphoric Acid ◽  
Bonding Mechanism ◽  
Restorative Dentistry ◽  
Dental Adhesive ◽  
Low Viscosity ◽  
Dentin Adhesives ◽  
Acid Etch ◽  
Tooth Tissue

Restoration of decayed teeth with tooth-colored materials that can be bonded to tooth tissue has been a highly desirable property in restorative dentistry for many years. Advantages of such an adhesive restorative technique over conventional techniques using non-adhesive metal-based restoratives include improved restoration retention with minimal sacrifice of sound tooth tissue for retention purposes, superior adaptation and sealing of the restoration margins in prevention of caries recurrence, improved stress distribution across the tooth-restoration interface throughout the whole tooth, and even reinforcement of weakened tooth structures. The dental adhesive technology is rapidly changing. An efficient resin bond to enamel has already long been achieved. Its bonding mechanism has been fully elucidated and has proven to be a durable and reliable clinical treatment. However, bonding to dentin represents a greater challenge. After the failures of a dentin acid-etch technique in imitation of the enamel phosphoric-acid-etch technique and a bonding procedure based on chemical adhesion, modern dentin adhesives are currently believed to bond to dentin by a micromechanical hybridization process. This process is developed by an initial demineralization of the dentin surface layer with acid etchants exposing a collagen fibril arrangement with interfibrillar microporosities that subsequently become impregnated by low-viscosity monomers. Although the development of such a hybridization process has well been documented in the literature, questions remain with respect to parameters of-primary importance to adhesive efficacy.

scholarly journals Interfacial Morphology and Bonding Mechanism of Explosive Weld Joints

2021 ◽  
Vol 34 (1) ◽  
Author(s):  
Tingting Zhang ◽  
Wenxian Wang ◽  
Zhifeng Yan ◽  
Jie Zhang
Keyword(s):  
Laminated Composite ◽  
Base Plate ◽  
Sine Wave ◽  
Laminated Plates ◽  
Bonding Interface ◽  
Interfacial Structure ◽  
Bonding Mechanism ◽  
Critical Material ◽  
Interfacial Morphology ◽  
Az31b Alloy

AbstractInterfacial structure greatly affects the mechanical properties of laminated plates. However, the critical material properties that impact the interfacial morphology, appearance, and associated bonding mechanism of explosive welded plates are still unknown. In this paper, the same base plate (AZ31B alloy) and different flyer metals (aluminum alloy, copper, and stainless steel) were used to investigate interfacial morphology and structure. SEM and TEM results showed that typical sine wave, wave-like, and half-wave-like interfaces were found at the bonding interfaces of Al/Mg, Cu/Mg and SS/Mg clad plates, respectively. The different interfacial morphologies were mainly due to the differences in hardness and yield strength between the flyer and base metals. The results of the microstructural distribution at the bonding interface indicated metallurgical bonding, instead of the commonly believed solid-state bonding, in the explosive welded clad plate. In addition, the shear strength of the bonding interface of the explosive welded Al/Mg, Cu/Mg and SS/Mg clad plates can reach up to 201.2 MPa, 147.8 MPa, and 128.4 MPa, respectively. The proposed research provides the design basis for laminated composite metal plates fabrication by explosive welding technology.

Comment on “First-principles determination of the bonding mechanism and adsorption energy for CO/MgO(001)” [Chem. Phys. Lett. 290 (1998) 255]

1999 ◽  
Vol 306 (3-4) ◽  
pp. 202-204 ◽  
Author(s):  
Francesc Illas ◽  
Gianfranco Pacchioni ◽  
Alexander Pelmenschikov ◽  
Lars G.M. Pettersson ◽  
Roberto Dovesi ◽  
...  
Keyword(s):  
Adsorption Energy ◽  
First Principles ◽  
Chem Phys ◽  
Bonding Mechanism

Interfacial bonding mechanism of high-pressure sintered Al-Ti-cBN composites

2019 ◽  
Vol 91 ◽  
pp. 29-33 ◽  
Author(s):  
Deng Wen-li ◽  
Deng Fu-ming ◽  
Liu Rui-ping ◽  
Zhang Peng ◽  
Ma Xiang-dong ◽  
...  
Keyword(s):  
High Pressure ◽  
Interfacial Bonding ◽  
Bonding Mechanism

Silicon Wafer Bonding Mechanism for Silicon-on-Insulator Structures

1990 ◽  
Vol 29 (Part 2, No. 12) ◽  
pp. L2311-L2314 ◽  
Author(s):  
Takao Abe ◽  
Tokio Takei ◽  
Atsuo Uchiyama ◽  
Katsuo Yoshizawa ◽  
Yasuaki Nakazato
Keyword(s):  
Silicon Wafer ◽  
Wafer Bonding ◽  
Silicon On Insulator ◽  
Bonding Mechanism

Bonding Mechanism and Atomic Geometry of an Ordered Hydroxyl Overlayer on Pt(111)

2001 ◽  
Vol 123 (30) ◽  
pp. 7347-7351 ◽  
Author(s):  
Ari P. Seitsonen ◽  
Yingjie Zhu ◽  
Kolja Bedürftig ◽  
Herbert Over
Keyword(s):  
Bonding Mechanism
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