A new, optical measuring technique for the determination of the vapour film thickness during film boiling

1995 ◽  
Vol 66 (6) ◽  
pp. 244-250 ◽  
Author(s):  
Reiner Weichert ◽  
Rudolf Jeschar ◽  
Walter Klemm ◽  
Viktor Heidt ◽  
Patrick Thibor ◽  
...  
2014 ◽  
Vol 121-122 ◽  
pp. 1-10 ◽  
Author(s):  
Lorenzo Graziani ◽  
Marcin Kneć ◽  
Tomasz Sadowski ◽  
Marco D’Orazio ◽  
Stefano Lenci

2001 ◽  
Vol 671 ◽  
Author(s):  
Michael Gostein ◽  
Paul Lefevre ◽  
Alex A. Maznev ◽  
Michael Joffe

ABSTRACTWe discuss applications of optoacoustic film thickness metrology for characterization of copper chemical-mechanical polishing (CMP). We highlight areas where the use of optoacoustics for CMP characterization provides data complementary to that obtained by other techniques because of its ability to directly measure film thickness with high spatial resolution in a rapid, non-destructive manner. Examples considered include determination of planarization length, measurement of film thickness at intermediate stages of polish, and measurement of arrays of metal lines.


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