scholarly journals Role of Dopants on the Local Electronic Structure of Polymeric Carbon Nitride Photocatalysts

Small Methods ◽  
2020 ◽  
pp. 2000707
Author(s):  
Jian Ren ◽  
Lihua Lin ◽  
Klaus Lieutenant ◽  
Christian Schulz ◽  
Deniz Wong ◽  
...  
2014 ◽  
Vol 116 (15) ◽  
pp. 153701 ◽  
Author(s):  
Ashish Ravalia ◽  
Megha Vagadia ◽  
P. S. Solanki ◽  
S. Gautam ◽  
K. H. Chae ◽  
...  

Carbon ◽  
2020 ◽  
Vol 168 ◽  
pp. 125-134 ◽  
Author(s):  
Sujoy Datta ◽  
Prashant Singh ◽  
Debnarayan Jana ◽  
Chhanda B. Chaudhuri ◽  
Manoj K. Harbola ◽  
...  

2016 ◽  
Vol 52 (3) ◽  
pp. 453-456 ◽  
Author(s):  
Xuefeng Li ◽  
Hao Ren ◽  
Zhijuan Zou ◽  
Jiaojiao Sun ◽  
Jingyu Wang ◽  
...  

A highly efficient visible-NIR photocatalyst: the electronic structure of CN nanosheets is engineered to match well with the emission energy of UCPs.


2021 ◽  
Author(s):  
Dariusz Mitoraj ◽  
Igor Krivtsov ◽  
Chunyu Li ◽  
Ashwene Rajagopal ◽  
Changbin Im ◽  
...  

2019 ◽  
Vol 7 (23) ◽  
pp. 14001-14010 ◽  
Author(s):  
Chuchu Wu ◽  
Xiaoming Zhang ◽  
Zhangxun Xia ◽  
Miao Shu ◽  
Huanqiao Li ◽  
...  

Ni–Fe dual-metal sites on NiFe-codoped polymeric carbon nitride co-participate in the OER process leading to significantly enhanced electrocatalytic activity.


Author(s):  
S.J. Splinter ◽  
J. Bruley ◽  
P.E. Batson ◽  
D.A. Smith ◽  
R. Rosenberg

It has long been known that the addition of Cu to Al interconnects improves the resistance to electromigration failure. It is generally accepted that this improvement is the result of Cu segregation to Al grain boundaries. The exact mechanism by which segregated Cu increases service lifetime is not understood, although it has been suggested that the formation of thin layers of θ-CuA12 (or some metastable substoichiometric precursor, θ’ or θ”) at the boundaries may be necessary. This paper reports measurements of the local electronic structure of Cu atoms segregated to Al grain boundaries using spatially resolved EELS in a UHV STEM. It is shown that segregated Cu exists in a chemical environment similar to that of Cu atoms in bulk θ-phase precipitates.Films of 100 nm thickness and nominal composition Al-2.5wt%Cu were deposited by sputtering from alloy targets onto NaCl substrates. The samples were solution heat treated at 748K for 30 min and aged at 523K for 4 h to promote equilibrium grain boundary segregation. EELS measurements were made using a Gatan 666 PEELS spectrometer interfaced to a VG HB501 STEM operating at 100 keV. The probe size was estimated to be 1 nm FWHM. Grain boundaries with the narrowest projected width were chosen for analysis. EDX measurements of Cu segregation were made using a VG HB603 STEM.


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