High spatial resolution analytical electron microscopy studies on the Co/CeO2 system

1988 ◽  
Vol 12 (1) ◽  
pp. 3-10 ◽  
Author(s):  
C. Colliex ◽  
D. Ugarte ◽  
Z. L. Wang ◽  
M. Gasgnier ◽  
V. Paul-Boncour
Keyword(s):  
Electron Microscopy ◽  
Spatial Resolution ◽  
High Spatial Resolution ◽  
Analytical Electron Microscopy ◽  
Analytical Electron

High Spatial Resolution Assessment of the Structure, Composition, and Electronic Properties of Nanowire Arrays

2001 ◽  
Vol 635 ◽  
Author(s):  
M.S. Sander ◽  
A.L. Prieto ◽  
Y.M. Lin ◽  
R. Gronsky ◽  
A.M. Stacy ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Electronic Properties ◽  
Spatial Resolution ◽  
High Spatial Resolution ◽  
Analytical Electron Microscopy ◽  
Nanowire Arrays ◽  
Composition Gradient ◽  
Transmission Electron ◽  
Analytical Electron ◽  
Electron Energy Loss

AbstractWe have employed transmission electron microscopy (TEM) and analytical electron microscopy to perform preliminary assessment of the structure, composition and electronic properties of nanowire arrays at high spatial resolution. The two systems studied were bismuth and bismuth telluride nanowire arrays in alumina (wire diameters ~40nm), both of which are promising for thermoelectric applications. Imaging coupled with diffraction in the TEM was employed to determine the grain size in electrodeposited Bi2Te3 nanowires. In addition, a composition gradient was identified along the wires in a short region near the electrode by energy-dispersive x-ray spectroscopy. Electron energy loss spectroscopy combined with energy-filtered imaging in the TEM revealed the excitation energy and spatial variation of plasmons in bismuth nanowire arrays.

On the Spatial Resolution in Analytical Electron Microscopy

1998 ◽  
pp. 59-64
Author(s):  
Aldo Armigliato ◽  
David J. Howard ◽  
Roberto Balboni ◽  
Stefano Frabboni ◽  
Matty R. Caymax
Keyword(s):  
Electron Microscopy ◽  
Spatial Resolution ◽  
Analytical Electron Microscopy ◽  
Analytical Electron

POLAR NANOREGION IN RELAXOR FERROELECTRICS STUDIED BY ANALYTICAL ELECTRON MICROSCOPY

2012 ◽  
Vol 02 (02) ◽  
pp. 1241008
Author(s):  
Y. L. LI ◽  
L. XIE ◽  
J. ZHU
Keyword(s):  
Electron Microscopy ◽  
High Spatial Resolution ◽  
Analytical Electron Microscopy ◽  
Frequency Dispersion ◽  
High Resolution Electron Microscopy ◽  
Relaxor Ferroelectrics ◽  
Resolution Electron ◽  
Analytical Electron ◽  
Polar Nanoregions ◽  
Diffuse Phase

Relaxor ferroelectrics have different properties from that of the normal ferroelectrics, such as dielectric properties with diffuse phase transition and frequency dispersion, specific heat, birefringence, elastic constants and Raman scattering, etc. It is considered that the different properties are related with the polar nanoregions in relaxors. In this work we briefly introduce how we use the high spatial resolution analytical electron microscopy and high resolution electron microscopy methods to investigate the polar nanoregion in Pb(Mg1/3Nb2/3)O3 (PMN), Pb(Mg1/3Nb2/3)O3–PbTiO3 (PMN–PT) and Ba ( Ti 1-x Sn x) O 3 (BTSn). The main experimental results1–10 are as mentioned in next three parts.

Electron Beam Damage of Biomolecules Assessed by Energy Loss Spectroscopy

1978 ◽  
Vol 36 (3) ◽  
pp. 61-69
Author(s):  
M. Isaacson ◽  
M.L. Collins ◽  
M. Listvan
Keyword(s):  
Electron Microscopy ◽  
Radiation Damage ◽  
Structural Integrity ◽  
Analytical Electron Microscopy ◽  
High Dose ◽  
Dose Rates ◽  
Special Cases ◽  
Analytical Electron ◽  
Atom Migration ◽  
Beam Damage

Over the past five years it has become evident that radiation damage provides the fundamental limit to the study of blomolecular structure by electron microscopy. In some special cases structural determinations at very low doses can be achieved through superposition techniques to study periodic (Unwin & Henderson, 1975) and nonperiodic (Saxton & Frank, 1977) specimens. In addition, protection methods such as glucose embedding (Unwin & Henderson, 1975) and maintenance of specimen hydration at low temperatures (Taylor & Glaeser, 1976) have also shown promise. Despite these successes, the basic nature of radiation damage in the electron microscope is far from clear. In general we cannot predict exactly how different structures will behave during electron Irradiation at high dose rates. Moreover, with the rapid rise of analytical electron microscopy over the last few years, nvicroscopists are becoming concerned with questions of compositional as well as structural integrity. It is important to measure changes in elemental composition arising from atom migration in or loss from the specimen as a result of electron bombardment.

Analytical Electron Microscopy (AEM) of Meningeal Cells Exposed to Particulate Cobalt During Studies of Experimental Epilepsy

1982 ◽  
Vol 40 ◽  
pp. 186-187
Author(s):  
R.G. Frederickson ◽  
R.G. Ulrich ◽  
J.L. Culberson
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Experimental Epilepsy ◽  
Metallic Cobalt ◽  
Experimental Animals ◽  
X Ray ◽  
Brain Surface ◽  
Meningeal Cells ◽  
Analytical Electron ◽  
The Brain

Metallic cobalt acts as an epileptogenic agent when placed on the brain surface of some experimental animals. The mechanism by which this substance produces abnormal neuronal discharge is unknown. One potentially useful approach to this problem is to study the cellular and extracellular distribution of elemental cobalt in the meninges and adjacent cerebral cortex. Since it is possible to demonstrate the morphological localization and distribution of heavy metals, such as cobalt, by correlative x-ray analysis and electron microscopy (i.e., by AEM), we are using AEM to locate and identify elemental cobalt in phagocytic meningeal cells of young 80-day postnatal opossums following a subdural injection of cobalt particles.

Analytical Electron Microscopy Characterization of Electric Arc Furnace Dust

1981 ◽  
Vol 39 ◽  
pp. 134-135
Author(s):  
J. R. Porter ◽  
J. I. Goldstein ◽  
D. B. Williams
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Electric Arc Furnace ◽  
Electric Arc ◽  
Dust Particles ◽  
Particle Analysis ◽  
Arc Furnace ◽  
Analytical Electron ◽  
Residual Elements ◽  
Industry Practice

Alloy scrap metal is increasingly being used in electric arc furnace (EAF) steelmaking and the alloying elements are also found in the resulting dust. A comprehensive characterization program of EAF dust has been undertaken in collaboration with the steel industry and AISI. Samples have been collected from the furnaces of 28 steel companies representing the broad spectrum of industry practice. The program aims to develop an understanding of the mechanisms of formation so that procedures to recover residual elements or recycle the dust can be established. The multi-phase, multi-component dust particles are amenable to individual particle analysis using modern analytical electron microscopy (AEM) methods.Particles are ultrasonically dispersed and subsequently supported on carbon coated formvar films on berylium grids for microscopy. The specimens require careful treatment to prevent agglomeration during preparation which occurs as a result of the combined effects of the fine particle size and particle magnetism. A number of approaches to inhibit agglomeration are currently being evaluated including dispersal in easily sublimable organic solids and size fractioning by centrifugation.

Application of analytical electron microscopy to the study of partitioning of silicon in a 2 wt% Si eutectoid steel

1978 ◽  
Vol 36 (1) ◽  
pp. 616-617
Author(s):  
N. Ridley ◽  
S.A. Al-Salman ◽  
G.W. Lorimer
Keyword(s):  
Electron Microscopy ◽  
Electron Microscope ◽  
Analytical Electron Microscopy ◽  
Eutectoid Steel ◽  
Minimum Diameter ◽  
Thin Foils ◽  
Analytical Electron ◽  
Analytical Electron Microscope ◽  
Transformation Front

The application of the technique of analytical electron microscopy to the study of partitioning of Mn (1) and Cr (2) during the austenite-pearlite transformation in eutectoid steels has been described in previous papers. In both of these investigations, ‘in-situ’ analyses of individual cementite and ferrite plates in thin foils showed that the alloying elements partitioned preferentially to cementite at the transformation front at higher reaction temperatures. At lower temperatures partitioning did not occur and it was possible to identify a ‘no-partition’ temperature for each of the steels examined.In the present work partitioning during the pearlite transformation has been studied in a eutectoid steel containing 1.95 wt% Si. Measurements of pearlite interlamellar spacings showed, however, that except at the highest reaction temperatures the spacing would be too small to make the in-situ analysis of individual cementite plates possible, without interference from adjacent ferrite lamellae. The minimum diameter of the analysis probe on the instrument used, an EMMA-4 analytical electron microscope, was approximately 100 nm.

Analytical electron microscopy of grain boundaries in Al-Cu metallizations

1992 ◽  
Vol 50 (2) ◽  
pp. 1684-1685
Author(s):  
J. R. Michael ◽  
A. D. Romig ◽  
D. R. Frear
Keyword(s):  
Electron Microscopy ◽  
Integrated Circuits ◽  
Failure Mode ◽  
Current Density ◽  
Thermal History ◽  
Analytical Electron Microscopy ◽  
Cu Metallization ◽  
Analytical Electron ◽  
Interconnect Lines

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.

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