P‐6.4: Failure Analysis of Al Corrosion Issue at Complementary Metal Oxide Semiconductor Backplane Solder Process for 1980PPI Micro Light Emitting Diode Display

2019 ◽  
Vol 50 (S1) ◽  
pp. 761-763
Author(s):  
Xuedan Wang ◽  
Rubo Xing ◽  
Dong Wei ◽  
Xiaowei Li ◽  
Haiyan Liu ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Failure Analysis ◽  
Light Emitting Diode ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Light Emitting

scholarly journals Failure Analysis Challenges of Phase Change Memory Test Structures with Two Case Studies

2021 ◽  
Author(s):  
J. Demarest ◽  
N. Arnold ◽  
K. Brew ◽  
V. Chan ◽  
A. Cote ◽  
...  
Keyword(s):  
Artificial Intelligence ◽  
Metal Oxide ◽  
Failure Analysis ◽  
Phase Change ◽  
Semiconductor Industry ◽  
Phase Change Memory ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Change Memory

Abstract There are several variants of artificial intelligence (AI) hardware structures which are under study by the semiconductor industry as potential future synergistic technology adders to existing complementary metal–oxide–semiconductor (CMOS) designs. This paper will discuss some of the failure analysis challenges which have appeared in discrete test structures and test arrays of an exploratory PCM program at IBM's Albany AI Hardware Research Center.

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